JPH07138549A - Conductive adhesive - Google Patents
Conductive adhesiveInfo
- Publication number
- JPH07138549A JPH07138549A JP5284978A JP28497893A JPH07138549A JP H07138549 A JPH07138549 A JP H07138549A JP 5284978 A JP5284978 A JP 5284978A JP 28497893 A JP28497893 A JP 28497893A JP H07138549 A JPH07138549 A JP H07138549A
- Authority
- JP
- Japan
- Prior art keywords
- silver
- adhesive
- copper powder
- epoxy resin
- type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Conductive Materials (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、電気・電子機器に装
着されるセラミック半導体素子の基板への装着あるいは
該セラミック半導体素子へのリードワイヤーの取り付け
に使用する導電性接着剤に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive adhesive used for mounting a ceramic semiconductor element mounted on an electric / electronic device on a substrate or mounting a lead wire on the ceramic semiconductor element.
【０００２】[0002]
【従来の技術及びその課題】この種の従来の導電性接着
剤は、銀粉Ａｇ又はカーボンＣをエポキシ樹脂等に混入
させたものが主であった。これらの接着剤は、導電性の
長期安定性はよいが、前者（Ａｇ）は高い導電性（低い
体積抵抗率）を得るためには銀粉の混入量が多くなっ
て、コスト高になるとともに、銀マイグレーションが発
生し易く、また、半田付け時、銀の拡散によって半田の
食われ現象が生じ易くなり、半田付けが困難になる。後
者（Ｃ）は前者に比べコスト的には問題はないが、導電
性に劣るため、高い導電性が要求される場合には使用し
得ない。2. Description of the Related Art A conventional conductive adhesive of this type is mainly one in which silver powder Ag or carbon C is mixed with an epoxy resin or the like. These adhesives have good long-term conductivity stability, but in the former (Ag), in order to obtain high conductivity (low volume resistivity), the amount of silver powder mixed in is large and the cost is high. Silver migration is likely to occur, and the solder is apt to be eaten by the diffusion of silver during soldering, which makes soldering difficult. The latter (C) has no problem in cost as compared with the former, but since it is inferior in electrical conductivity, it cannot be used when high electrical conductivity is required.
【０００３】一方、従来から、導電性塗料として銅粉を
混入したものが考えられており、この種の接着剤も銅粉
を混入したものが考えられる。銅粉は、コスト的にも安
価であり、体積固有抵抗も低いため、上記の銀粉及びカ
ーボンのものの問題は解決する。On the other hand, conventionally, a conductive paint containing copper powder has been considered, and an adhesive of this type may also contain copper powder. Since the copper powder is low in cost and has a low volume resistivity, the above problems of silver powder and carbon can be solved.
【０００４】しかしながら、銅粉は、銀粉、カーボンな
どの粉体に比べて活性が高いため、耐環境特性試験（後
述）における長期安定性が悪く、時変化が大きいという
欠点がある。However, since copper powder is more active than powders of silver powder, carbon, etc., it has the drawbacks of poor long-term stability in environmental resistance test (described later) and large time change.
【０００５】そこで、この発明は、上記の実情の下、銅
粉による接着剤において、銀粉による接着剤と同等レ
ベル（１×１０-4〜１×１０-3Ω−ｍ）の導電性を有
し、長期特性（耐環境性）がよく（時変化が小さ
く）、かつコスト的にも十分に満足できる導電性接着
剤を得ることを課題とする。Therefore, according to the present invention, under the above circumstances, the adhesive made of copper powder has the same level of conductivity (1 × 10 −4 to 1 × 10 −3 Ω-m) as the adhesive made of silver powder. However, it is an object to obtain a conductive adhesive that has good long-term properties (environmental resistance) (small change with time) and is sufficiently satisfactory in terms of cost.
【０００６】[0006]
【課題を解決するための手段】上記課題を解決するため
に、この発明の導電性接着剤にあっては、銀等の銅より
活性の低い導電性金属メッキ銅粉７５〜９０重量部と、
硬化剤５〜２０重量％を含むエポキシ樹脂２５〜１０重
量部とからなる構成としたのである。In order to solve the above problems, in the conductive adhesive of the present invention, 75 to 90 parts by weight of a conductive metal-plated copper powder having a lower activity than copper such as silver,
The composition is composed of 25 to 10 parts by weight of an epoxy resin containing 5 to 20% by weight of a curing agent.
【０００７】上記メッキ銅粉は、アトマイズ法により調
整された銅粉に１〜２０重量％の銀メッキ（銀メッキ処
理濃度：１〜２０％）を施したものとするとよい。The plated copper powder is preferably prepared by subjecting copper powder prepared by an atomizing method to silver plating of 1 to 20% by weight (silver plating treatment concentration: 1 to 20%).
【０００８】上記銀メッキ銅粉が７５重量部未満では所
望の導電特性が得られず、９０重量部を越えると樹脂量
が少なくて所望の接着特性は得られなくなる。If the amount of the silver-plated copper powder is less than 75 parts by weight, desired conductive properties cannot be obtained, and if it exceeds 90 parts by weight, the amount of resin is small and desired adhesive properties cannot be obtained.
【０００９】上記銀等のメッキ量が銅粉に対し１重量％
未満では銅粉表面が十分にメッキされておらず、十分な
電気特性が得られない場合があり、２０重量％をこえる
と、銀マイグレーションの発生の原因になるとともに半
田付け時に銀の拡散によって半田の食われ現象が現わ
れ、半田付けが困難になる場合がある。好ましくは５〜
１５重量％である。The amount of plating of silver or the like is 1% by weight based on copper powder.
If less than 20% by weight, the surface of the copper powder may not be sufficiently plated, and sufficient electrical characteristics may not be obtained. If it exceeds 20% by weight, silver migration may occur and the solder may diffuse due to silver during soldering. In some cases, the phenomenon of erosion appears and soldering becomes difficult. Preferably 5
It is 15% by weight.
【００１０】上記エポキシ樹脂が２５重量部を越えると
所望の導電特性が得られず１０重量部未満では接着性が
得られなくなる。If the amount of the epoxy resin exceeds 25 parts by weight, the desired conductive property cannot be obtained, and if it is less than 10 parts by weight, the adhesiveness cannot be obtained.
【００１１】エポキシ樹脂は、ビスフェノールＦ型、ビ
スフェノールＦ型分散剤付き（防さび用）、ビスフェノ
ールＡ型、グリシジルアミン型、メタキシレンジアミン
型、アミンフェノール型等を採用する。As the epoxy resin, bisphenol F type, bisphenol F type with a dispersant (for rust prevention), bisphenol A type, glycidyl amine type, metaxylene diamine type, amine phenol type and the like are adopted.
【００１２】ここで、エポキシ樹脂への銅粉の充てん率
は樹脂粘度、粉体分散性、多官能性等によって左右さ
れ、低粘度化を指向する場合、ビスフェノールＡ型のも
のよりは、ビスフェノールＦ型が適している。但し、ビ
スフェノールＡ型を使用する場合でも反応性希釈剤をブ
レンドすれば低粘度化が可能である。また、多官能化を
行なって配合物の架橋密度を上げようとする場合、及び
従来のフェノールノボラックタイプを使用する場合は、
非常に粘度が上昇する。このため、多官能で、低粘度を
指向する場合は、グリシジルアミン型、メタキシレンジ
アミン型、アミノフェノール型が好ましい。さらに、耐
熱骨格を有さないものでも、下記ポリエーテル型反応性
希釈剤を利用すれば、耐熱性を得ることができる。Here, the filling rate of the copper powder in the epoxy resin depends on the resin viscosity, the powder dispersibility, the polyfunctionality and the like, and when aiming at lowering the viscosity, bisphenol F is more preferable than bisphenol A type. The type is suitable. However, even when bisphenol A type is used, it is possible to lower the viscosity by blending with a reactive diluent. Also, when trying to increase the crosslink density of the compound by performing polyfunctionalization, and when using the conventional phenol novolac type,
The viscosity rises significantly. Therefore, in the case of being polyfunctional and aiming for low viscosity, glycidylamine type, metaxylenediamine type, and aminophenol type are preferable. Furthermore, even if it does not have a heat-resistant skeleton, heat resistance can be obtained by using the following polyether-type reactive diluent.
【００１３】エポキシ樹脂の希釈剤としては、反応性の
もので、例えば、グリシジルアミン型、ポリエーテル
型、ジオール変性型、フェニルエーテル型、アルコール
変性型を採用し得る。The diluent for the epoxy resin is a reactive one, and for example, a glycidyl amine type, a polyether type, a diol modified type, a phenyl ether type, or an alcohol modified type can be adopted.
【００１４】因みに、従来一般の銀系導電性接着剤の粉
体（銀粉）充てん率は７５重量％以下である。Incidentally, the powder filling rate of conventional general silver-based conductive adhesives (silver powder) is 75% by weight or less.
【００１５】硬化剤が５重量％未満では所望の時間内で
硬化せず、２０重量％をこえるとポットライフが短くな
って製品の流通過程で硬化する。ここで、１液型導電性
接着剤を作成するためには、硬化剤として、ジシアンジ
アミド、ジシアンジアミド変性、グアニド系、酸レドラ
ジッド、イミダゾール類、３フッ化ホウ素系、メラミン
類、スルホニウム塩タイプなどが考えられる。If the amount of the curing agent is less than 5% by weight, it will not be cured within a desired time, and if it exceeds 20% by weight, the pot life will be shortened and the composition will be cured in the course of product distribution. Here, in order to prepare a one-pack type conductive adhesive, as a curing agent, dicyandiamide, dicyandiamide modification, guanide series, acid redrazide, imidazoles, boron trifluoride series, melamines, sulfonium salt type, etc. are considered. To be
【００１６】[0016]
【作用】このように構成する導電性接着剤は、銀等のメ
ッキにより銅粉の活性が抑止され、長期特性が銀粉、カ
ーボンなどのものに比べ見劣りしない。また、銀重量が
銀粉のみのものに比べて少ないため、コスト的に安価な
ものとなり、銅粉の導電性の高さにより、所望の導電性
を有する。In the conductive adhesive thus constructed, the activity of the copper powder is suppressed by the plating of silver or the like, and the long-term characteristics are not inferior to those of silver powder, carbon, or the like. Further, since the weight of silver is smaller than that of silver powder alone, the cost is low, and the desired conductivity is achieved due to the high conductivity of the copper powder.
【００１７】[0017]
【実施例】表１に示すように、銀メッキ銅粉の重量部が
８０％前後の、実施例１乃至６、同重量部が７５％以
下、又は９０％以上の比較例１、２、及び硬化剤が５重
量％以下又は２０重量％以上の比較例３、４を、それぞ
れ製造し、それらについて、ポットライフとして６０日
経過後、体積固有抵抗ρ（導電性）、及びせん断強度τ
（接着強度）を測定し、その結果を表１下欄に示す。[Examples] As shown in Table 1, Examples 1 to 6 in which the weight part of the silver-plated copper powder is about 80%, Comparative examples 1 and 2 in which the weight part is 75% or less, or 90% or more, and Comparative Examples 3 and 4 in which the curing agent was 5% by weight or less or 20% by weight or more, respectively, were produced, and after 60 days as a pot life, volume specific resistance ρ (conductivity) and shear strength τ were obtained.
(Adhesive strength) was measured, and the results are shown in the lower column of Table 1.
【００１８】[0018]
【表１】 [Table 1]
【００１９】ここで、体積固有抵抗ρは実施例又は比較
例の導電接着剤をガラスエポキシ基板上にスクリーン印
刷法により印刷して回転パターンを５条形成し、精密級
テスターにより、その各パターン両端間の抵抗を測定し
計算した平均値である。また、接着強度τの測定は、１
９７６年ＪＩＳＫ６８５０「接着剤の引張り剪断接着強
さ試験方法」に従って行った。Here, the volume resistivity ρ is obtained by printing the conductive adhesive of the embodiment or the comparative example on a glass epoxy substrate by a screen printing method to form five rotation patterns, and using a precision grade tester, both ends of each pattern. It is an average value calculated by measuring the resistance between. Moreover, the measurement of the adhesive strength τ is 1
976 JISK 6850 "Adhesive Tensile Shear Bond Strength Test Method".
【００２０】その測定結果によると、各実施例は、製造
後、６０日経過後においてもスクリーン印刷することが
できて、ポットライフが６０日以上あり、また、導電性
が１０-4〜１０-3Ω−ｃｍと銀粉のものに近いレベルで
あり、せん断強度も１００ｋｇ／ｃｍ2 以上を得てお
り、十分に使用に耐え得るものである。この結果は、エ
ポキシ樹脂により銀メッキ銅粉が強固に保持され、マト
リックスがバランスよく形成されていることによると考
える。According to the measurement results, each Example can be screen-printed even after 60 days have passed, the pot life is 60 days or more, and the conductivity is 10 -4 to 10 -3. [Omega] -cm, which is a level close to that of silver powder, and a shear strength of 100 kg / cm < 2 > or more, which can be sufficiently used. This result is considered to be because the epoxy resin firmly holds the silver-plated copper powder and forms the matrix in a well-balanced manner.
【００２１】一方、比較例１は、導電性が悪く、銀粉の
みのレベルに遠く及ばない。比較例２は、樹脂量が少な
いため、硬化し易く、粉体の保持が十分に行えないた
め、接着強度が著しく低い。比較例９は、硬化剤が不足
して所定の硬化処理後の接着力が不足し、比較例１０
は、硬化剤が過多のため、混練調整後５０日で硬化が始
まり、ρ、τとともに測定が不能であった。On the other hand, Comparative Example 1 has poor conductivity and is far below the level of silver powder alone. In Comparative Example 2, since the amount of resin is small, the resin is easily cured and the powder cannot be sufficiently retained, so that the adhesive strength is extremely low. Comparative Example 9 lacks the curing agent and lacks the adhesive force after the predetermined curing treatment.
Since the amount of the curing agent was excessive, the curing started 50 days after the kneading adjustment, and the measurement with ρ and τ was impossible.
【００２２】また、各実施例は、下記の各耐環境特性試
験（特性劣化促進試験）を行っても使用に支障がなかっ
た。Further, in each of the examples, there was no problem in use even when the following environment resistance characteristic tests (characteristic deterioration acceleration tests) were conducted.
【００２３】〔耐湿試験〕 温度：６０℃、湿度：９０％、放置時間：２４時間 〔ヒートサイクル試験〕 −４０℃で３０分と８５℃で３０分を１０００回繰り返
し。[Moisture resistance test] Temperature: 60 ° C., humidity: 90%, leaving time: 24 hours [Heat cycle test] -40 ° C. for 30 minutes and 85 ° C. for 30 minutes were repeated 1000 times.
【００２４】なお、実施例のものは、有機溶剤を使用し
ていないため、作業環境において有利である。Since the organic solvent of the embodiment does not use an organic solvent, it is advantageous in the working environment.
【００２５】[0025]
【発明の効果】この発明に係る導電性接着剤は以上のよ
うに構成したので、銀系導電性接着剤の高コスト、銅系
導電性接着剤の長期不安定性及びカーボン系の低導電性
を克服するものである。このため、各種電子・電気機器
の接合部に、低コストで品質のよい導電性接着剤を供給
することが可能になる。EFFECTS OF THE INVENTION Since the conductive adhesive according to the present invention is constructed as described above, the high cost of the silver-based conductive adhesive, the long-term instability of the copper-based conductive adhesive, and the low conductivity of the carbon-based adhesive are achieved. It is to overcome. Therefore, it becomes possible to supply a low-cost, high-quality conductive adhesive to the joints of various electronic / electrical devices.
─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成６年１月１２日[Submission date] January 12, 1994
【手続補正１】[Procedure Amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００１[Correction target item name] 0001
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【０００１】[0001]
【産業上の利用分野】この発明は、電気・電子機器に装
着されるセラミック素子の基板への装着あるいは該セラ
ミック素子へのリードワイヤーの取り付けに使用する導
電性接着剤に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive adhesive used for mounting a ceramic element mounted on an electric / electronic device on a substrate or mounting a lead wire on the ceramic element .
【手続補正２】[Procedure Amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００５[Name of item to be corrected] 0005
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【０００５】そこで、この発明は、上記の実情の下、銅
粉による接着剤において、銀粉による接着剤と同等レ
ベル（１×１０-4〜１×１０-3Ω−ｃｍ）の導電性を有
し、長期特性（耐環境性）がよく（時変化が小さ
く）、かつコスト的にも十分に満足できる導電性接着
剤を得ることを課題とする。Under the above circumstances, therefore, the present invention has the same level of conductivity (1 × 10 -4 to 1 × 10 -3 Ω- cm ) as the adhesive made of silver powder, as compared with the adhesive made of silver powder. However, it is an object to obtain a conductive adhesive that has good long-term properties (environmental resistance) (small change with time) and is sufficiently satisfactory in terms of cost.
【手続補正３】[Procedure 3]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１１[Correction target item name] 0011
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００１１】エポキシ樹脂は、ビスフェノールＦ型、ビ
スフェノールＦ型分散剤付き（防さび用）、ビスフェノ
ールＡ型、グリシジルアミン型、メタキシレンジアミン
型、アミノフェノール型等を採用する。[0011] Epoxy resins, bisphenol F type, with a bisphenol F type dispersing agent (for rust), bisphenol A type, glycidyl amine type, meta-xylene diamine type, employing an amino phenol type.
【手続補正４】[Procedure amendment 4]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１５[Name of item to be corrected] 0015
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００１５】硬化剤が５重量％未満では所望の時間内で
硬化せず、２０重量％をこえるとポットライフが短くな
って製品の流通過程で硬化する。ここで、１液型導電性
接着剤を作成するためには、硬化剤として、ジシアンジ
アミド、ジシアンジアミド変性、グアニド系、酸ヒドラ
ジッド、イミダゾール類、３フッ化ホウ素系、メラミン
類、スルホニウム塩タイプなどが考えられる。If the amount of the curing agent is less than 5% by weight, it will not be cured within a desired time, and if it exceeds 20% by weight, the pot life will be shortened and the composition will be cured in the course of product distribution. Here, in order to create a one-conductive adhesive, as a curing agent, dicyandiamide, dicyandiamide modified, guanido-based, acid arsenate Dora <br/> Gide, imidazoles, boron trifluoride-based, melamine, A sulfonium salt type is considered.
【手続補正５】[Procedure Amendment 5]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１９[Correction target item name] 0019
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００１９】ここで、体積固有抵抗ρは実施例又は比較
例の導電性接着剤をガラスエポキシ基板上にスクリーン
印刷法により印刷して回路パターンを５条形成し、精密
級テスターにより、その各パターン両端間の抵抗を測定
し計算した平均値である。また、接着強度τの測定は、
１９７６年ＪＩＳＫ６８５０「接着剤の引張り剪断接着
強さ試験方法」に従って行った。[0019] Here, volume resistivity ρ embodiment or the conductive adhesive of Comparative Example to form 5 Article a circuitry pattern was printed by screen printing on a glass epoxy substrate, a precision grade tester, each It is an average value calculated by measuring the resistance between both ends of the pattern. Also, the measurement of the adhesive strength τ is
1976 JIS K 6850 "Adhesive Tensile Shear Bond Strength Test Method".
【手続補正６】[Procedure correction 6]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００２１[Correction target item name] 0021
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００２１】一方、比較例１は、導電性が悪く、銀粉の
みのレベルに遠く及ばない。比較例２は、樹脂量が少な
いため、硬化し易く、粉体の保持が十分に行えないた
め、接着強度が著しく低い。比較例３は、硬化剤が不足
して所定の硬化処理後の接着力が不足し、比較例４は、
硬化剤が過多のため、混練調整後５０日で硬化が始ま
り、ρ、τとともに測定が不能であった。On the other hand, Comparative Example 1 has poor conductivity and is far below the level of silver powder alone. In Comparative Example 2, since the amount of resin is small, the resin is easily cured and the powder cannot be sufficiently retained, so that the adhesive strength is extremely low. Comparative Example 3 lacks the curing agent and lacks the adhesive force after the predetermined curing treatment, and Comparative Example 4
Since the amount of the curing agent was excessive, the curing started 50 days after the kneading adjustment, and the measurement was impossible together with ρ and τ.
【手続補正７】[Procedure Amendment 7]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００２３[Name of item to be corrected] 0023
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００２３】〔耐湿試験〕 温度：６０℃、湿度：９０％、放置時間：１０００時間 〔ヒートサイクル試験〕 −４０℃で３０分と８５℃で３０分を１０００回繰り返
し。[Moisture resistance test] Temperature: 60 ° C., humidity: 90%, leaving time: 1000 hours [Heat cycle test] -40 ° C. for 30 minutes and 85 ° C. for 30 minutes were repeated 1000 times.
Claims (2)
キ銅粉７５〜９０重量部と、硬化剤５〜２０重量％を含
むエポキシ樹脂２５〜１０重量部とからなることを特徴
とする導電性接着剤。1. A conductive metal-plated copper powder having a lower activity than copper such as silver of 75 to 90 parts by weight, and an epoxy resin containing 5 to 20% by weight of a curing agent and 25 to 10 parts by weight of an epoxy resin. Conductive adhesive.
上記メッキ銅粉は、アトマイズ法により調整された銅粉
に１〜２０重量％の銀メッキを施したものであることを
特徴とする導電性接着剤。2. The conductive adhesive according to claim 1, wherein
The above-mentioned plated copper powder is a copper powder prepared by an atomizing method and plated with 1 to 20% by weight of silver, which is a conductive adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5284978A JPH07138549A (en) | 1993-11-15 | 1993-11-15 | Conductive adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5284978A JPH07138549A (en) | 1993-11-15 | 1993-11-15 | Conductive adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07138549A true JPH07138549A (en) | 1995-05-30 |
Family
ID=17685551
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5284978A Pending JPH07138549A (en) | 1993-11-15 | 1993-11-15 | Conductive adhesive |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07138549A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010000096A1 (en) | 2008-07-03 | 2010-01-07 | National Starch And Chemical Investment Holding Coporation | Silver coated flaky material filled conductive curable composition and the application in die attach |
| CN101964218A (en) * | 2009-07-24 | 2011-02-02 | 藤仓化成株式会社 | The preparation method of conductive paste and conductive paste |
| US8217403B1 (en) | 2011-03-08 | 2012-07-10 | Napra Co., Ltd. | Electronic device |
| EP2657962A1 (en) | 2012-04-24 | 2013-10-30 | Napra Co., Ltd. | Electronic device with a metallisation layer having a high- and a low-melting-point component diffusion-bonded together and a synthetic resin layer covering the metallisation layer |
| CN104205243A (en) * | 2012-03-23 | 2014-12-10 | 株式会社昌星 | Electrode paste composition for solar cell |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61185806A (en) * | 1985-02-12 | 1986-08-19 | 古河電気工業株式会社 | Conductive resin paste |
| JPS62179566A (en) * | 1986-01-31 | 1987-08-06 | Toyobo Co Ltd | Electrically conductive resin composition |
| JPH01251625A (en) * | 1988-03-31 | 1989-10-06 | Toshiba Chem Corp | Resin sealed type semiconductor device |
| JPH01304150A (en) * | 1988-06-01 | 1989-12-07 | Asahi Chem Ind Co Ltd | Metal powder-containing epoxy resin composition |
| JPH03264678A (en) * | 1990-03-15 | 1991-11-25 | Showa Denko Kk | Copper powder for conductive paste |
-
1993
- 1993-11-15 JP JP5284978A patent/JPH07138549A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61185806A (en) * | 1985-02-12 | 1986-08-19 | 古河電気工業株式会社 | Conductive resin paste |
| JPS62179566A (en) * | 1986-01-31 | 1987-08-06 | Toyobo Co Ltd | Electrically conductive resin composition |
| JPH01251625A (en) * | 1988-03-31 | 1989-10-06 | Toshiba Chem Corp | Resin sealed type semiconductor device |
| JPH01304150A (en) * | 1988-06-01 | 1989-12-07 | Asahi Chem Ind Co Ltd | Metal powder-containing epoxy resin composition |
| JPH03264678A (en) * | 1990-03-15 | 1991-11-25 | Showa Denko Kk | Copper powder for conductive paste |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010000096A1 (en) | 2008-07-03 | 2010-01-07 | National Starch And Chemical Investment Holding Coporation | Silver coated flaky material filled conductive curable composition and the application in die attach |
| CN101964218A (en) * | 2009-07-24 | 2011-02-02 | 藤仓化成株式会社 | The preparation method of conductive paste and conductive paste |
| JP2011028985A (en) * | 2009-07-24 | 2011-02-10 | Fujikura Kasei Co Ltd | Method of manufacturing conductive paste, and the conductive paste |
| US8217403B1 (en) | 2011-03-08 | 2012-07-10 | Napra Co., Ltd. | Electronic device |
| CN104205243A (en) * | 2012-03-23 | 2014-12-10 | 株式会社昌星 | Electrode paste composition for solar cell |
| EP2657962A1 (en) | 2012-04-24 | 2013-10-30 | Napra Co., Ltd. | Electronic device with a metallisation layer having a high- and a low-melting-point component diffusion-bonded together and a synthetic resin layer covering the metallisation layer |
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