JP3484957B2 - Conductive adhesive - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to semiconductor elements such as LEDs and ICs, chip resistors, chip components such as chip LEDs, lead frames and printed wiring boards (PW).
B), a conductive adhesive applied when adhering to a substrate such as a flexible printed circuit board (FPC), and in particular,
The present invention relates to an improvement of a conductive adhesive that has a heat resistance capable of withstanding a heat treatment at about 200 to 300 ° C. and gives a cured product excellent in conductivity, adhesiveness, workability, thermal conductivity and the like.

[0002]

2. Description of the Related Art A conductive adhesive is used to bond a semiconductor element or a chip component to a lead frame or various substrates to obtain electrical or thermal conduction. As a method, Si such as semiconductor chips is used.
An Au-Si eutectic method in which the back surface is heated and pressure-bonded to an Au plating layer on a lead frame or various substrates, and a solder joining method using various solders such as tin-lead solder have been the mainstream.

However, in the conventional Au-Si eutectic method and solder joining method, Au is expensive, lacks in relaxation of thermal stress that adversely affects the semiconductor chip, lacks in heat resistance, and requires working temperature. In recent years, the method using the above-mentioned conductive adhesive has become the mainstream because it has a disadvantage that it requires a relatively high temperature.

By the way, recent semiconductor elements and chip parts are required to be compact, highly accurate, and have high performance.
Further, when a semiconductor element or a chip component is bonded to a substrate or the like, the bonding area of the component is reduced in accordance with the progress of miniaturization of these components, so that the conductive adhesive is required to have stronger adhesiveness than before.

In order to improve the precision and performance of semiconductor elements and chip components, for example, the heat generation amount of IC chips and the like increases, so that the conductive adhesive has high thermal conductivity and , Heat dissipation and heat resistance are required.

Further, a semiconductor element or a chip component to which a conductive adhesive is applied is subjected to a soldering furnace or a wire bonding process in a manufacturing process or a mounting process of the component, and then 200
Since heat treatment at about 300 to 300 ° C. can be repeatedly added, heat resistance that can withstand heat treatment at about 200 to 300 ° C. is required.

And as this kind of conductive adhesive,
Conventionally, a conductive powder, an organic resin, a solvent, a composition containing a catalyst as a main component has been utilized, the conductive powder,
Gold, silver, copper, carbon and the like are applied, and thermosetting resins such as epoxy resin and phenol resin are applied as the organic resin.

[0008]

However, the conductive powder,
Conventional conductive adhesives containing organic resins, solvents, catalysts, etc. as main components have poor heat resistance, and when exposed to heat treatment at about 200 to 300 ° C. in the manufacturing process or mounting process of chip parts, etc., There has been a problem that the bond strength, electrical conductivity, thermal conductivity, etc. of the organic resin in the adhesive are destroyed, resulting in extreme deterioration.

The present invention has been made by paying attention to such problems, and the problem is that the temperature is 200 to 300 ° C.
An object of the present invention is to provide a conductive adhesive that has a heat resistance that can withstand a certain degree of heat treatment and that gives a cured product having excellent conductivity, adhesiveness, workability, thermal conductivity, and the like.

[0010]

The inventors of the present invention have made extensive studies in order to solve such problems, and as a result, as an organic resin component, a conventional epoxy resin and a screw represented by the following chemical formula (1) are used. When applied in combination with an alkenyl-substituted nadiimide, it is possible to provide a conductive adhesive that can withstand a heat treatment at about 200 to 300 ° C. and that has good properties such as conductivity, adhesiveness, workability, and thermal conductivity. I came to find out. The present invention has been completed based on such technical findings.

[0011] Namely, the invention according to claim 1, a conductive adhesive assumes, metal powder, epoxy resin, bisalkenyl substituted nadimide represented by the following chemical formula (1), and is composed of a curing agent, and , The above metal powder is 60-
90% by weight, as well as silica and chi
Powder selected from tania and alumina, curing accelerator, and
And epoxy resin and the above bisalkenyl-substituted nadiimide
Acts as a diluent and exists as a liquid when cured
At least 1 kind of organic compound is added as an additive component
Characterized in that it is,

[0012]

[Chemical 2] [In the above chemical formula (1), R ₁ and R ₂ may be the same or different and each represents a hydrogen atom or a methyl group. Also,
X ₁ is an alkylene group having 2 to 10 carbon atoms, a cycloalkylene group having 5 to 8 carbon atoms, a divalent aromatic group having 6 to 18 carbon atoms, and a group —R—C ₆ H ₄ — (R ′) _m —. {However, m is an integer of 0 or 1, R and R'may be the same or different and each represents an alkylene group having 2 to 10 carbon atoms or a cycloalkylene group having 5 to 12 carbon atoms}, and a group -C. ₆ H ₄ -A-
C ₆ H ₄ - {where, A is _{-CH 2 -, - C (CH} 3) 2 -,
-CO -, - O -, - OC 6 H 4 C (CH 3) 2 C 6 H 4 O-
The present invention according to claim 2 is based on the conductive adhesive according to claim 1, and the epoxy resin is in the range of 2 to 38% by weight, And the bisalkenyl-substituted nadiimide is 0.1
Characterized in that it is blended in the range of ~ 28% by weight,
Further, the invention according to claim 3 is based on the conductive adhesive according to claim 1 or 2, and is a compounding ratio (β / (β /) of the weight α of the epoxy resin and the weight β of the bisalkenyl-substituted nadiimide.
α) is set in the range of 0.01 to 4.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below.

First, the conductive adhesive according to the present invention is characterized in that the bisalkenyl-substituted nadiimide represented by the above chemical formula (1) is blended in addition to the epoxy resin conventionally applied as the organic resin component. I am trying.

That is, in a conductive adhesive compounded with an epoxy resin and a bisalkenyl-substituted nadimide, the epoxy resin and the bisalkenyl-substituted nadimide do not react at the time of curing, but the respective resins do not exist in a mutually uneven distribution. It has a three-dimensional mesh structure, and because it is entangled with each other and hardened, it shows a very uniform and constant range of characteristics.
It exhibits good heat resistance, electrical conductivity, adhesiveness, thermal conductivity, etc. that can withstand about 200 to 300 ° C. In addition, when viewed as a composition of a conductive adhesive, the epoxy resin and the bisalkenyl-substituted nadimide and the curing agent have good compatibility and thus have excellent storage stability, and the curing reaction takes place at a relatively low temperature for a short time. Since the reaction progresses in, it has characteristics such as exhibiting excellent characteristics in workability.

The bisalkenyl-substituted nadiimide used in the present invention is represented by the chemical formula (1) and is disclosed in JP-A-59-80662 and JP-A-60-.
Those described in JP-A-178862, JP-A-63-170358, and Japanese Patent Application No. 5-222258 can be used. Specific examples of applicable bisalkenyl-substituted nadiimides include N, N′-hexamethylene-bis (allylbicyclo [2,2,1] hept-
5-ene-2,3-dicarboximide), N, N'-
p-xylylene-bis (allylbicyclo [2,2,1]
Hept-5-ene-2,3-dicarboximide),
N, N'-m-xylylene-bis (allylbicyclo [2,2,1] hept-5-ene-2,3-dicarboximide), bis {4- (allylbicyclo [2,2,2]
1] hept-5-ene-2,3-dicarboximide)
Phenyl} methane and the like. Further, these bisalkenyl-substituted nadiimides may be used alone, or a plurality of kinds may be mixed and applied, and are arbitrary.

Next, as the epoxy resin used in combination with the bisalkenyl-substituted nadiimide represented by the above chemical formula (1), almost all known epoxy resins which have been conventionally applied can be used and are not particularly limited. Examples of applicable epoxy resins include bisphenol A diglycidyl ether, which is mainly used for casting and adhesion of electronic materials, bisphenol F diglycidyl ether, novolac glycidyl ether, epoxidized soybean oil, and 3,4 epoxy. -6 methylcyclohexylmethylcarboxylate, 3,4 epoxycyclohexylmethylcarboxylate, tetraglycidyl diaminodiphenylmethane and the like. In addition, in consideration of the intended use, a liquid form is preferable, and in consideration of being used as an electronic material, ionic impurities such as chlorine ions are 800 p.
It is preferably pm or less. In addition, these epoxy resins may be used alone or as a mixture of two or more kinds, and are arbitrary.

Further, the curing agent applied in the present invention should be one that rapidly undergoes a curing reaction with the epoxy resin when heated (60 to 300 ° C.) and satisfies long-term storage stability at room temperature. There is no particular limitation. In general,
2-ethyl-4-methylimidazole of imidazoles, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-heptadecylimidazole,
Examples thereof include phenol novolac compounds, dicyandiamide, acid anhydride-based tetrahydromethylphthalic anhydride, hexahydrophthalic anhydride, dodecylsuccinic anhydride, and BF ₃ salt of Lewis acid complex. These may be used alone or as a mixture of plural kinds, and are arbitrary. Further, in the conductive adhesive according to the present invention, a curing accelerator, such as an amine salt or a blocked isocyanate, which has a curing promoting action may be blended as necessary.

Further, in the conductive adhesive of the present invention,
An organic compound which acts as a diluent for the epoxy resin and the bisalkenyl-substituted nadiimide represented by the above chemical formula (1) and which does not exist as a liquid at the time of curing may be added. That is, for example, 2,2,4-trimethyl-3-hydroxydipentaneisobutyrate, 2,2,4-trimethylpentane-1,3-isobutyrate, isobutylbutyrate, diethylene glycol that does not react with the epoxy resin and the curing agent. Monobutyl ether, ethylene glycol monobutyl ether, etc., or those which can react with an epoxy resin and a curing agent when heated, such as phenyl glycidyl ether, ethylene glycol diglycidyl ether, ethylhexyl glycidyl ether, and 3
-Aminopropyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane and the like can be mentioned.

Next, the metal powder which is an essential component of the conductive adhesive according to the present invention is applied as a conductive powder.
It is optional as long as high conductivity (1 × 10 ⁻³ Ω · cm or less) can be obtained, and applicable metal powder is gold,
Examples are silver, copper, nickel, palladium, platinum, and alloys thereof. Incidentally, in these exemplified metal powders, the surfaces of copper and nickel are susceptible to oxidation in the air, and therefore, special treatment for preventing oxidation of the powder surface or curing treatment of the conductive adhesive is performed. At this time, it is desirable to cure in a reducing atmosphere. Further, regarding the shape of these metal powders, the flake shape is preferable because the highest conductivity is obtained. However, metallic powder such as spherical powder or acicular powder may be applied according to the method of using the conductive adhesive and the required characteristics. Further, regarding the size of the metal powder, in consideration of printability and the like, for example, silver powder having an average particle diameter of 10 μm or less is desirable. Also,
In consideration of price, handleability, storability, and obtained characteristics, it is desirable to use flake-shaped silver powder or spherical silver powder.

Further, the blending ratio of the metal powder of the conductive adhesive according to the present invention needs to be set within the range of 60 to 90% by weight. That is, when the blending ratio of the metal powder is less than 60% by weight, the electrical conductivity and the thermal conductivity are significantly lowered, and the blending ratio of the metal powder is 9%.
This is because if the amount exceeds 0% by weight, the adhesive strength is remarkably lowered and the function as an adhesive cannot be fulfilled.

Next, the blending ratio of the epoxy resin, which is the resin component of the conductive adhesive according to the present invention, and the bisalkenyl-substituted nadimide is arbitrarily set within the range in which the effect of the bisalkenyl-substituted nadimide is exhibited. By setting this blending ratio within the following range, it becomes possible to further improve the adhesiveness, electrical conductivity, thermal conductivity, heat resistance, workability and the like. That is, it is desirable to set the mixing ratio of the epoxy resin within the range of 2 to 38% by weight and the mixing ratio of the bisalkenyl-substituted nadiimide within the range of 0.1 to 28% by weight (claim 2). When the compounding ratio of the epoxy resin is less than 2% by weight, the adhesive strength may decrease, and when the compounding ratio of the epoxy resin exceeds 38% by weight, the metal powder in the conductive adhesive is 60% by weight. This is because the electrical conductivity and the thermal conductivity may decrease when the amount is less than the above. Similarly, when the blending ratio of the bisalkenyl-substituted nadimide is less than 0.1% by weight, the effect of the blending of the bisalkenyl-substituted nadimide may not be exhibited even when mixed with the epoxy resin. When the content exceeds 28% by weight, the spinnability of the obtained conductive adhesive becomes large and the workability thereof deteriorates.
Moreover, adverse effects such as an increase in the curing temperature and an increase in the curing time may occur.

In the conductive adhesive according to the present invention, when the weight of the epoxy resin is α and the weight of the bisalkenyl-substituted nadimide is β, the compounding ratio (β / α) of the epoxy resin and the bisalkenyl-substituted nadimide is Is preferably set within the range of 0.01 to 4 (claim 3). When the compounding ratio (β / α) is less than 0.01,
Even if mixed with an epoxy resin, the effect of the bisalkenyl-substituted nadiimide blend may not be exerted, and
When the compounding ratio (β / α) exceeds 4, the spinnability of the obtained conductive adhesive is increased and the workability is deteriorated, and
This is because adverse effects such as an increase in the curing temperature and a longer curing time may occur.

In the conductive adhesive according to the present invention, powders of silica, titania, alumina, etc. may be mixed for the purpose of improving workability and preventing sedimentation of metal powder such as silver powder. Further, the particle size and the like are not particularly limited, but from experience, it is desirable that the primary particle size be 100 nm or less.

[0025]

EXAMPLES Examples of the present invention will be specifically described below.

[Examples 1 to 13] Each component having the composition shown in Tables 1 and 2 below was kneaded by using a stirrer and a three-roll type kneader, and the conductive adhesives according to the examples were mixed. I got an agent.

With respect to the obtained conductive adhesives according to the respective examples, "sheet resistance value (mΩ)", "adhesive strength (N: Newton)", and
"Heat resistance strength 1 (N)", "heat resistance strength 2 (N)", "high temperature humidity resistance", "workability", and "heat conductivity" were measured. In addition, when curing the conductive adhesive,
11, Example 13 and Comparative Examples 1 to 4 are performed in air, whereas Example 12 (using Cu powder) is cured in a nitrogen atmosphere.

The results are shown in Tables 3 and 4 below.

Regarding the metal powders in Tables 1 and 2, silver flake powder (Ag powder) having an average particle diameter of 3 μm, silver spherical powder (Ag powder) having an average particle diameter of 1 μm, silver having an average particle diameter of 10 μm were used. Four kinds of palladium alloy powder (Ag / Pd powder) and copper flake powder (Cu powder) having an average particle diameter of 5 μm were applied.

Two kinds of bisphenol A diglycidyl ether (epoxy resin) and novolac glycidyl ether (epoxy resin) are applied to the epoxy resin as the resin component, and N, N'- is used for the bisalkenyl-substituted nadiimide. Hexamethylene-bis (allylbicyclo [2,2,1] hept-5-ene-2,3-dicarboximide) (nadimide), bis {4- (allylbicyclo [2,2,1] hept-5- Ene-2,3-dicarboximide) phenyl} methane (nadimide)
2 types were applied. The compounding ratio (β / α) of epoxy resin: α and bisalkenyl-substituted nadiimide: β is also shown in Table 1.
It shows in Table 2.

In addition, as a curing agent, dicyandiamide (DICY), adipic acid dihydrazide (ACDH),
2-Phenyl-4,5-dividroxymethylimidazole (PHMZ) was used as a curing accelerator, and phenylglycidyl ether (diluent) and diethylene glycol monobutyl ether (diluent) were used as diluents.

[Comparative Examples 1 to 4] Similar to the Examples, the components having the composition shown in Table 2 were kneaded using a stirrer and a three-roll type kneader, and Comparative Examples 1 to 4 were applied. A conductive adhesive was obtained.

The characteristics of the obtained conductive adhesives according to the comparative examples were evaluated in the same manner as in the examples. The results are also shown in Table 4 below.

[0034]

[Table 1]

[0035]

[Table 2]

(Evaluation method) (1) Measurement of sheet resistance value (mΩ) Between electrodes separated by 2 mm on an alumina substrate, these electrodes are overlapped to form a rectangular shape having a width of 2 mm and a length of 5 mm. Print each conductive adhesive according to, and 200 ℃
After being left in the oven for 60 minutes to cure each conductive adhesive, it was cooled to room temperature and the resistance value between the electrodes was measured. The results are shown in Tables 3 and 4.

(2) Measurement of Adhesive Strength (N: Newton) Each of the conductive adhesives according to Examples and Comparative Examples was dropped onto a silver-plated copper substrate of 2.5 cm square and 1.5 mm.
Place the corner silicon chips and place in an oven at 200 ° C for 6
The conductive adhesive was cured by leaving it for 0 minute. Next, after cooling to room temperature, force was applied to the silicon chip from the horizontal direction with respect to the copper substrate, and the force when the silicon chip was peeled off was measured as the adhesive strength. The results are also shown in Tables 3 and 4.

(3) Measurement of heat resistant strength 1 (N) Each conductive adhesive according to the examples and comparative examples was dropped onto a 2.5 cm square copper substrate plated with silver to give a thickness of 1.5 mm.
Place the corner silicon chips and place in an oven at 200 ° C for 6
The conductive adhesive was cured by leaving it for 0 minute. Next, the copper substrate is left for 20 seconds on a hot plate that has been cooled to room temperature and heated to 350 ° C., and then, while being heated, force is applied to the silicon chip from the horizontal direction on the copper substrate, The force when the silicon chip was peeled off was measured as heat resistance strength 1. The results are also shown in Tables 3 and 4.

(4) Measurement of heat resistance strength 2 (N) Each conductive adhesive of Examples and Comparative Examples was dropped onto a 2.5 cm square copper substrate plated with silver to obtain 1.5 mm.
Place the corner silicon chips and place in an oven at 200 ° C for 6
The conductive adhesive was cured by leaving it for 0 minute. Next, the copper substrate was left for 10 minutes on a hot plate that had been cooled to room temperature and heated to 250 ° C., cooled to room temperature again, and then applied to the silicon chip from the horizontal direction with respect to the copper substrate. Was added, and the force when the silicon chip was peeled off was measured as heat resistance strength 2. This result is also in Table 3,
It shows in Table 4.

(5) Evaluation of high-temperature humidity resistance The sheet resistance measurement sample prepared in (1) above was tested for humidity 8
After holding at 5% RH and a temperature of 85 ° C. for 500 hours, it was cooled to room temperature and the sheet resistance value was measured in the same manner as in (1).
Then, based on the resistance value measured in (1), the magnification of the resistance value measured here was obtained.

A sample prepared in the same manner as the adhesive strength measurement sample prepared in (2) above was held at a humidity of 85% RH and a temperature of 85 ° C. for 500 hours, and then cooled to room temperature.
The adhesive strength was measured in the same manner as (2). Then, based on the adhesive strength measured in (2), the magnification of the adhesive strength measured here was obtained.

Then, the magnification with respect to the sheet resistance value is 1.
If it was within 2 times and the ratio to the adhesive strength was 50% or more, it was rated as good, and otherwise it was rated as x. The results are also shown in Tables 3 and 4.

(6) Evaluation of Workability Each conductive adhesive according to the examples and comparative examples was filled in a syringe, the conductive adhesive was extruded by air pressure and discharged onto a copper plate, and its shape was observed. Threads that are pulled, fallen sideways, or have a height of 1 mm or more are not acceptable, and x is good when these are not observed at all, and is good when they are observed only slightly. It was marked as △.
The results are shown in Tables 3 and 4.

(7) Evaluation of thermal conductivity Each conductive adhesive according to the examples and comparative examples was dropped on a lead frame, a semiconductor chip was mounted, and the temperature was set to 200 ° C.
Left in the oven for 60 minutes to cure. After curing,
A microprobe is applied to the electrode parts of the lead frame and the semiconductor chip, and a current of 5 mA is first applied for 3 ms to measure the voltage. The voltage value at this time is V1. Continuously, 300
A current of mA is applied for 50 ms to heat the semiconductor chip,
After that, a current of 5 mA is passed again for 3 ms and the voltage is measured.
Then, the voltage value at this time was set to V2, and if the value of V1-V2 was 50 mV or less, the thermal conductivity was good and the result was ◯. The results are also shown in Tables 3 and 4.

(8) Comprehensive evaluation In these 7 items, the sheet resistance value is 500 mΩ or less, the adhesive strength is 50 N or more, the heat resistance strength 1 is 8 N or more, the heat resistance strength 2 is 30 N or more, and the high temperature humidity resistance and workability are high. Regarding the thermal conductivity, only those satisfying the conditions of good (∘) and substantially good (Δ) were evaluated as “good”, and if at least one of them did not satisfy the above conditions, it was evaluated as “x”. The results are shown in Tables 3 and 4.

[0046]

[Table 3]

[0047]

[Table 4]

"Discussion" 1. As is clear from Tables 3 and 4, the conductive adhesives according to Examples 1 to 13 have conductivity, adhesiveness, heat resistance,
It is confirmed that it has excellent workability and thermal conductivity.

In the conductive adhesive according to Example 13, since the compounding ratio (β / α) of the weight α of the epoxy resin and the weight β of the bisalkenyl-substituted nadiimide exceeds 4, it is slightly pulled. It was confirmed that the filamentousness was found and the workability was slightly inferior to those of the other examples. 2. On the other hand, none of the conductive adhesives according to Comparative Examples 1 to 4 satisfy all of conductivity, adhesiveness, heat resistance, workability, and heat conductivity, and the comprehensive evaluation is x.

First, in Comparative Example 1, the mixing ratio of Ag powder was 6
Since it is set to less than 0% by weight, the sheet resistance value is increased (800 mΩ), and the thermal conductivity and workability are poor.

On the other hand, in Comparative Example 2, the mixing ratio of Ag powder was 9
Since it is set to exceed 0% by weight, the adhesive strength,
The heat resistance strength 2 is weakened, and the workability is also poor.

Next, in Comparative Examples 3 and 4, since the bisalkenyl-substituted nadiimide was not mixed, the heat resistance strength 2 was weak in both cases, and Comparative Example 4 resulted in poor thermal conductivity. There is.

[0053]

Effect of the Invention According to the invention according to claim 1, the metal powder, epoxy resin, bisalkenyl substituted nadimide represented by the chemical formula (1), and is composed of a curing agent,
In addition, the above metal powder is blended in the range of 60 to 90% by weight and selected from silica, titania and alumina.
Powder, curing accelerator, and epoxy resin
Acts as a diluent for alkenyl-substituted nadiimides and hardens
At least organic compounds that do not exist as liquids when converted
200 to 3 because one kind is added as an additive component
It has heat resistance that can withstand heat treatment at about 00 ° C., and also has an effect of improving conductivity, adhesion, workability, thermal conductivity, etc. of the cured adhesive layer after adhesion.

According to the invention of claim 2, the epoxy resin is blended in the range of 2 to 38% by weight, and the bisalkenyl-substituted nadiimide is blended in the range of 0.1 to 28% by weight. According to the invention of claim 3, since the compounding ratio (β / α) of the weight α of the epoxy resin and the weight β of the bisalkenyl-substituted nadiimide is set in the range of 0.01 to 4, the heat resistance is And, it has the effect of further improving the conductivity, adhesion, workability, thermal conductivity, etc. of the cured adhesive layer after adhesion.

Continuation of front page (56) Reference JP-A-8-245942 (JP, A) JP-A-59-140279 (JP, A) JP-A-62-285968 (JP, A) JP-A-9-124775 (JP , A) JP 7-330872 (JP, A) JP 7-70288 (JP, A) JP 8-277265 (JP, A) JP 7-206991 (JP, A) JP 5-301948 (JP, A) JP-A-9-278849 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) C09J 163/00-163/10 C09J 9/02 H01B 1 / 22 H05K 3/32-3/34

Claims (3)

(57) [Claims] 1. A metal powder, epoxy resin, bisalkenyl substituted nadimide represented by the following chemical formula (1), and is composed of a curing agent, and the metal powder 60
90% by weight, as well as silica and chi
Powder selected from tania and alumina, curing accelerator, and
And epoxy resin and the above bisalkenyl-substituted nadiimide
Acts as a diluent and exists as a liquid when cured
At least 1 kind of organic compound is added as an additive component
Conductive adhesive agent characterized in that it is. [Chemical 1] [In the above chemical formula (1), R ₁ and R ₂ may be the same or different and each represents a hydrogen atom or a methyl group. Also, X
₁ is an alkylene group having 2 to 10 carbon atoms, a cycloalkylene group having 5 to 8 carbon atoms, a divalent aromatic group having 6 to 18 carbon atoms,
Group _{-R-C 6 H 4 - (} R ') m - { However, m is 0 or 1
Of R, R and R ′ may be the same or different and each represents an alkylene group having 2 to 10 carbon atoms or a cycloalkylene group having 5 to 12 carbon atoms, and a group —C ₆ H ₄ —A—C ₆
H ₄ - {where, A is _{-CH 2 -, - C (CH} 3) 2 -, -
CO -, - O -, - shows the _{OC 6 H 4 C (CH 3} ) 2 C 6 H 4 O- or a group selected from any one shows a} of] 2. The epoxy resin is in the range of 2 to 38% by weight, and the bisalkenyl-substituted nadimide is 0.1% by weight.
The conductive adhesive according to claim 1, wherein the conductive adhesive is blended in the range of 28% by weight. 3. The compounding ratio (β / α) of the weight α of the epoxy resin and the weight β of the bisalkenyl-substituted nadiimide is 0.0.
The conductive adhesive according to claim 1 or 2, wherein the conductive adhesive is set in a range of 1 to 4.