JPS54149758A - Heat-resistant resin paste composition - Google Patents

Heat-resistant resin paste composition

Info

Publication number
JPS54149758A
JPS54149758A JP5803778A JP5803778A JPS54149758A JP S54149758 A JPS54149758 A JP S54149758A JP 5803778 A JP5803778 A JP 5803778A JP 5803778 A JP5803778 A JP 5803778A JP S54149758 A JPS54149758 A JP S54149758A
Authority
JP
Japan
Prior art keywords
weight
parts
pref
polyamic acid
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5803778A
Other languages
Japanese (ja)
Other versions
JPS5726699B2 (en
Inventor
Kaoru Omura
Takeo Kimura
Ichiro Shibazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Chemical Industry Co Ltd
Original Assignee
Asahi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Industry Co Ltd filed Critical Asahi Chemical Industry Co Ltd
Priority to JP5803778A priority Critical patent/JPS54149758A/en
Publication of JPS54149758A publication Critical patent/JPS54149758A/en
Publication of JPS5726699B2 publication Critical patent/JPS5726699B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Epoxy Resins (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

PURPOSE: To prepare a heat-resistant resin paste composition having excellent adhesiveness, chemical resistance, etc., by dispersing a fine particulate material, e.g. metal, in an aromatic polyamic acid solution.
CONSTITUTION: (A) 100 parts by weight of an aromatic polyamic acid is dissolved in 100W5,000, preferably 200W1,000 parts by weight of a solvent (pref. dimethylformamide, etc.) to give a binder solution. (B) 5W2,000, preferably 50W1,000 parts by weight of one or more fine particulate materials (pref. fine particles having a size of 20ÅW500μ) selected from metals (pref. Au, etc.) and their oxides, are dispersed in the solution under stirring until the polyamic acid dissolves completely. Addition of 2W100, preferably 5W60 parts by weight of an epoxy resin and further heat treatment at about 300°C improve heat resistance, adhesiveness, chemical resistance, etc.
USE: Conductive resin-heating elements, adhesives, bonding materials, etc. used at 250W500°C.
COPYRIGHT: (C)1979,JPO&Japio
JP5803778A 1978-05-16 1978-05-16 Heat-resistant resin paste composition Granted JPS54149758A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5803778A JPS54149758A (en) 1978-05-16 1978-05-16 Heat-resistant resin paste composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5803778A JPS54149758A (en) 1978-05-16 1978-05-16 Heat-resistant resin paste composition

Publications (2)

Publication Number Publication Date
JPS54149758A true JPS54149758A (en) 1979-11-24
JPS5726699B2 JPS5726699B2 (en) 1982-06-05

Family

ID=13072728

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5803778A Granted JPS54149758A (en) 1978-05-16 1978-05-16 Heat-resistant resin paste composition

Country Status (1)

Country Link
JP (1) JPS54149758A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60170658A (en) * 1984-02-15 1985-09-04 Toshiba Chem Corp Electrically conductive paste
US5378533A (en) * 1989-07-17 1995-01-03 Fujii Kinzoku Kako Co., Ltd. Electrically conductive exothermic composition comprising non-magnetic hollow particles and heating unit made thereof
JP2013032522A (en) * 2011-07-29 2013-02-14 Namics Corp Liquid epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59160897U (en) * 1983-04-14 1984-10-27 株式会社ノーリツ Blower

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60170658A (en) * 1984-02-15 1985-09-04 Toshiba Chem Corp Electrically conductive paste
JPH0376339B2 (en) * 1984-02-15 1991-12-05 Toshiba Chem Prod
US5378533A (en) * 1989-07-17 1995-01-03 Fujii Kinzoku Kako Co., Ltd. Electrically conductive exothermic composition comprising non-magnetic hollow particles and heating unit made thereof
JP2013032522A (en) * 2011-07-29 2013-02-14 Namics Corp Liquid epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same

Also Published As

Publication number Publication date
JPS5726699B2 (en) 1982-06-05

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