JPS54149758A - Heat-resistant resin paste composition - Google Patents
Heat-resistant resin paste compositionInfo
- Publication number
- JPS54149758A JPS54149758A JP5803778A JP5803778A JPS54149758A JP S54149758 A JPS54149758 A JP S54149758A JP 5803778 A JP5803778 A JP 5803778A JP 5803778 A JP5803778 A JP 5803778A JP S54149758 A JPS54149758 A JP S54149758A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- parts
- pref
- polyamic acid
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Epoxy Resins (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
PURPOSE: To prepare a heat-resistant resin paste composition having excellent adhesiveness, chemical resistance, etc., by dispersing a fine particulate material, e.g. metal, in an aromatic polyamic acid solution.
CONSTITUTION: (A) 100 parts by weight of an aromatic polyamic acid is dissolved in 100W5,000, preferably 200W1,000 parts by weight of a solvent (pref. dimethylformamide, etc.) to give a binder solution. (B) 5W2,000, preferably 50W1,000 parts by weight of one or more fine particulate materials (pref. fine particles having a size of 20ÅW500μ) selected from metals (pref. Au, etc.) and their oxides, are dispersed in the solution under stirring until the polyamic acid dissolves completely. Addition of 2W100, preferably 5W60 parts by weight of an epoxy resin and further heat treatment at about 300°C improve heat resistance, adhesiveness, chemical resistance, etc.
USE: Conductive resin-heating elements, adhesives, bonding materials, etc. used at 250W500°C.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5803778A JPS54149758A (en) | 1978-05-16 | 1978-05-16 | Heat-resistant resin paste composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5803778A JPS54149758A (en) | 1978-05-16 | 1978-05-16 | Heat-resistant resin paste composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS54149758A true JPS54149758A (en) | 1979-11-24 |
JPS5726699B2 JPS5726699B2 (en) | 1982-06-05 |
Family
ID=13072728
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5803778A Granted JPS54149758A (en) | 1978-05-16 | 1978-05-16 | Heat-resistant resin paste composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54149758A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60170658A (en) * | 1984-02-15 | 1985-09-04 | Toshiba Chem Corp | Electrically conductive paste |
US5378533A (en) * | 1989-07-17 | 1995-01-03 | Fujii Kinzoku Kako Co., Ltd. | Electrically conductive exothermic composition comprising non-magnetic hollow particles and heating unit made thereof |
JP2013032522A (en) * | 2011-07-29 | 2013-02-14 | Namics Corp | Liquid epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59160897U (en) * | 1983-04-14 | 1984-10-27 | 株式会社ノーリツ | Blower |
-
1978
- 1978-05-16 JP JP5803778A patent/JPS54149758A/en active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60170658A (en) * | 1984-02-15 | 1985-09-04 | Toshiba Chem Corp | Electrically conductive paste |
JPH0376339B2 (en) * | 1984-02-15 | 1991-12-05 | Toshiba Chem Prod | |
US5378533A (en) * | 1989-07-17 | 1995-01-03 | Fujii Kinzoku Kako Co., Ltd. | Electrically conductive exothermic composition comprising non-magnetic hollow particles and heating unit made thereof |
JP2013032522A (en) * | 2011-07-29 | 2013-02-14 | Namics Corp | Liquid epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same |
Also Published As
Publication number | Publication date |
---|---|
JPS5726699B2 (en) | 1982-06-05 |
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