JPS5721469A - Heat-resisting, electrically conductive adhesive - Google Patents

Heat-resisting, electrically conductive adhesive

Info

Publication number
JPS5721469A
JPS5721469A JP9592380A JP9592380A JPS5721469A JP S5721469 A JPS5721469 A JP S5721469A JP 9592380 A JP9592380 A JP 9592380A JP 9592380 A JP9592380 A JP 9592380A JP S5721469 A JPS5721469 A JP S5721469A
Authority
JP
Japan
Prior art keywords
electrically conductive
pref
conductive adhesive
resisting
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9592380A
Other languages
Japanese (ja)
Inventor
Hitoshi Yoshida
Kenji Kondo
Masatoshi Onoda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Soken Inc
Original Assignee
Nippon Soken Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Soken Inc filed Critical Nippon Soken Inc
Priority to JP9592380A priority Critical patent/JPS5721469A/en
Publication of JPS5721469A publication Critical patent/JPS5721469A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE: A thermosetting, electrically conductive adhesive with excellent heat resistance and high-temp. adhesion, useful for bonding an IC chip to an electrode, a semiconductor heating element to a metal sheet, etc. which is prep. by mixing a liquid epoxy resin, a polyimide resin powder and an electrically conductive metal powder.
CONSTITUTION: A liquid epoxy resin (A) pref. having viscosity ≤500cps at room temp., a polyimide resin powder (B) pref. having particle size ≤100μ, and an electricaly conductive metal powder (C) pref. of a particle size ≤30μ are mixed to obtain the titled electrically conductive adhesive. It is pref. for the component C to account for 70W90wt% of the total component. It is possible to cure said adhesive for examle, by keeping it at 150°C for 3hr.
EFFECT: Simply applicable in the absence of any solvents.
COPYRIGHT: (C)1982,JPO&Japio
JP9592380A 1980-07-14 1980-07-14 Heat-resisting, electrically conductive adhesive Pending JPS5721469A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9592380A JPS5721469A (en) 1980-07-14 1980-07-14 Heat-resisting, electrically conductive adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9592380A JPS5721469A (en) 1980-07-14 1980-07-14 Heat-resisting, electrically conductive adhesive

Publications (1)

Publication Number Publication Date
JPS5721469A true JPS5721469A (en) 1982-02-04

Family

ID=14150793

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9592380A Pending JPS5721469A (en) 1980-07-14 1980-07-14 Heat-resisting, electrically conductive adhesive

Country Status (1)

Country Link
JP (1) JPS5721469A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6185475A (en) * 1984-09-26 1986-05-01 ダブリユー・アール・グレイス・アンド・カンパニー―コネチカット Conductive thermosetting dispersion composition
JPS6366278A (en) * 1986-09-08 1988-03-24 Sumitomo Metal Mining Co Ltd Electrically conductive adhesive
JPH02110125A (en) * 1988-10-19 1990-04-23 Mitsubishi Plastics Ind Ltd Resin composition with high thermal conductivity
DE112016004647T5 (en) 2016-01-12 2018-06-28 Yamaha Hatsudoki Kabushiki Kaisha Assembly body work device
DE112016006208T5 (en) 2016-01-12 2018-09-20 Yamaha Hatsudoki Kabushiki Kaisha Mounting target working device
DE112017006808T5 (en) 2017-01-13 2019-10-02 Yamaha Hatsudoki Kabushiki Kaisha The component mounting apparatus

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6185475A (en) * 1984-09-26 1986-05-01 ダブリユー・アール・グレイス・アンド・カンパニー―コネチカット Conductive thermosetting dispersion composition
JPH0580510B2 (en) * 1984-09-26 1993-11-09 Grace W R & Co
JPS6366278A (en) * 1986-09-08 1988-03-24 Sumitomo Metal Mining Co Ltd Electrically conductive adhesive
JPH02110125A (en) * 1988-10-19 1990-04-23 Mitsubishi Plastics Ind Ltd Resin composition with high thermal conductivity
DE112016004647T5 (en) 2016-01-12 2018-06-28 Yamaha Hatsudoki Kabushiki Kaisha Assembly body work device
DE112016006208T5 (en) 2016-01-12 2018-09-20 Yamaha Hatsudoki Kabushiki Kaisha Mounting target working device
DE112017006808T5 (en) 2017-01-13 2019-10-02 Yamaha Hatsudoki Kabushiki Kaisha The component mounting apparatus

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