JPS6366278A - Electrically conductive adhesive - Google Patents
Electrically conductive adhesiveInfo
- Publication number
- JPS6366278A JPS6366278A JP20947686A JP20947686A JPS6366278A JP S6366278 A JPS6366278 A JP S6366278A JP 20947686 A JP20947686 A JP 20947686A JP 20947686 A JP20947686 A JP 20947686A JP S6366278 A JPS6366278 A JP S6366278A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- epoxy resin
- electrically conductive
- curing
- curing agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 title claims description 15
- 230000001070 adhesive effect Effects 0.000 title claims description 15
- 239000000843 powder Substances 0.000 claims abstract description 18
- 239000003822 epoxy resin Substances 0.000 claims abstract description 16
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 16
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 12
- 239000002904 solvent Substances 0.000 claims abstract description 6
- 239000000203 mixture Substances 0.000 claims abstract description 4
- ZRALSGWEFCBTJO-UHFFFAOYSA-N Guanidine Chemical compound NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 abstract description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 abstract description 4
- 229910052581 Si3N4 Inorganic materials 0.000 abstract description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 2
- CHJJGSNFBQVOTG-UHFFFAOYSA-N N-methyl-guanidine Natural products CNC(N)=N CHJJGSNFBQVOTG-UHFFFAOYSA-N 0.000 abstract description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 abstract description 2
- 239000004202 carbamide Substances 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- SWSQBOPZIKWTGO-UHFFFAOYSA-N dimethylaminoamidine Natural products CN(C)C(N)=N SWSQBOPZIKWTGO-UHFFFAOYSA-N 0.000 abstract description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052737 gold Inorganic materials 0.000 abstract description 2
- 239000010931 gold Substances 0.000 abstract description 2
- 229910052759 nickel Inorganic materials 0.000 abstract description 2
- 229910010271 silicon carbide Inorganic materials 0.000 abstract description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052709 silver Inorganic materials 0.000 abstract description 2
- 239000004332 silver Substances 0.000 abstract description 2
- 238000004026 adhesive bonding Methods 0.000 abstract 1
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910000952 Be alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- MGJKQDOBUOMPEZ-UHFFFAOYSA-N N,N'-dimethylurea Chemical compound CNC(=O)NC MGJKQDOBUOMPEZ-UHFFFAOYSA-N 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明はＩＣ素子、ＬＥＤ素子などを基体に接着するた
めの導電性樹脂組成物の改善に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to improvements in conductive resin compositions for bonding IC elements, LED elements, etc. to substrates.
（従来の技術）
ＩＣ素子やＬＥＤ素子などを基体に接着するために、導
電性粉末を液状のエポキシ樹脂及び硬化剤に均一分散せ
しめてペースト状とした導電性接着剤が用いられている
。この接着作業は、素子を接着すべき個所に上記接着剤
を塗付し、ＩＣ素子やＬＥＤ素子を該塗膜上に載置し、
所定の温度に加熱してエポキシ樹脂を硬化せしめる、と
いう工程により行われる。(Prior Art) In order to bond IC elements, LED elements, etc. to a substrate, a conductive adhesive is used in which conductive powder is uniformly dispersed in a liquid epoxy resin and a hardening agent to form a paste. This bonding work involves applying the above adhesive to the location where the device is to be bonded, placing the IC device or LED device on the coating film, and
This is done by heating the epoxy resin to a predetermined temperature to harden it.
このように接着されたＩＣ素子やＬ Ｅ Ｄ素子に対し
、次いでワイヤーボンディングが施されるが、このワイ
ヤーボンディングを通常の熱圧着方式で行った場合素子
が剥れたり位置ずれを生じることがあった。これはワイ
ヤーボンディング時の加熱によって硬化エポキシ樹脂が
軟化するためと考えられるが、このような不具合はワイ
ヤーボンディング作業を困難にし、製品歩留りを低下す
る原因となる。Wire bonding is then performed on the IC elements and LED elements that have been bonded in this way, but if this wire bonding is performed using the normal thermocompression bonding method, the elements may peel off or become misaligned. Ta. This is thought to be because the cured epoxy resin is softened by heating during wire bonding, but such defects make wire bonding work difficult and cause a decrease in product yield.
（発明が解決しようとする問題点）
上記欠点を解消するにはエポキシ樹脂より高温に耐える
樹脂を用いれば良いと考えられるが、硬化条件、作業性
の面で問題ないものでなければならず、単に耐熱性が良
好なだけでは不充分である。(Problems to be Solved by the Invention) In order to eliminate the above drawbacks, it may be possible to use a resin that can withstand higher temperatures than epoxy resin, but it must be satisfactory in terms of curing conditions and workability. Merely having good heat resistance is not sufficient.
本発明はこのような見地から為されたものであり、硬化
条件、作業性を従来品と変えることなく硬化後の接着剤
の軟化を効果的に防止できる導電性接着剤を提供するも
のである。The present invention has been made from this perspective, and provides a conductive adhesive that can effectively prevent softening of the adhesive after curing without changing the curing conditions and workability from conventional products. .
（問題点を解決するための手段）
この目的を達成するための本発明の接着剤は、導電性粉
末５０〜９５重量％と、残部がエポキシ樹脂と硬化剤及
び必要により硬化促進剤、溶剤等とからなる混合物１０
０重量部に対し、１〜２０重量部の耐熱性ホイスカーを
添加した点に特徴がある。(Means for Solving the Problems) The adhesive of the present invention to achieve this object contains 50 to 95% by weight of conductive powder, the balance being epoxy resin, curing agent, and if necessary, curing accelerator, solvent, etc. A mixture 10 consisting of
It is characterized in that 1 to 20 parts by weight of heat-resistant whiskers are added to 0 parts by weight.
導電性粉末は金、銀、白金等の貴金属粉末、ニッケル、
銅、アルミニウム等の卑金属粉末、又は炭素のような非
金属粉末を用いることができ、これら粉末は合金でも良
く、非導電性粉末が導電性物質で被覆されていても良く
、又これらの粉末が２種以上混合されていても良い。こ
の粉末は粒径０．１〜１０μｍ程度であれば良く、粉末
形状は粒状でもフレーク状でも良いが、フレーク状粉末
の方が導電性が良好である。Conductive powders include precious metal powders such as gold, silver, and platinum, nickel,
Base metal powders such as copper and aluminum or non-metallic powders such as carbon may be used; these powders may be alloys; non-conductive powders may be coated with conductive substances; Two or more types may be mixed. This powder only needs to have a particle size of about 0.1 to 10 μm, and the powder shape may be granular or flaky, but flaky powder has better conductivity.
導電性粉末の最適含有量は使用する粉末の比重によって
変るが、５０〜９５重量％の範囲が適当である。５０重
量％未満では樹脂分の割合が多過ぎて硬化後、導電性を
示さず、又９５重量％を超えると樹脂分の割合が少な過
ぎて接着剤の強度が不足するからである。The optimum content of the conductive powder varies depending on the specific gravity of the powder used, but is suitably in the range of 50 to 95% by weight. If it is less than 50% by weight, the resin content will be too high and will not exhibit conductivity after curing, and if it exceeds 95% by weight, the resin content will be too small and the strength of the adhesive will be insufficient.
エポキシ樹脂は１分子中に２個以上のエポキシ基を有す
る液状のエポキシ樹脂であれば良く、ビスフェノールＡ
、ビスフェノールＦ、エポキシ化ノボラック、エポキシ
化オレフィンなどが挙げられる。The epoxy resin may be a liquid epoxy resin having two or more epoxy groups in one molecule, and bisphenol A
, bisphenol F, epoxidized novolak, epoxidized olefin, and the like.
硬化剤にはエポキシ樹脂の潜在性硬化剤として知られて
いるものは全て使用でき、尿素、グアニジン、ヒドラジ
ン、アソ化合物等が挙げられる。All known latent curing agents for epoxy resins can be used as the curing agent, and examples thereof include urea, guanidine, hydrazine, and aso compounds.
硬化剤の使用量は各硬化剤毎に指定されているのでそれ
に従えば良く、概ねエポキシ樹脂１００重量部当り０．
１〜３０重量部である。The amount of curing agent to be used is specified for each curing agent, so just follow it, and it is generally 0.000 parts per 100 parts by weight of epoxy resin.
It is 1 to 30 parts by weight.
上記エポキシ樹脂と硬化剤の含有量は前記導電性粉末含
有量の残部即ち５０〜５重量％の範囲か適当であるが、
この中に必要により硬化促進剤。The content of the epoxy resin and curing agent is the balance of the content of the conductive powder, that is, the range of 50 to 5% by weight, or is appropriate.
If necessary, add a curing accelerator.
溶剤、希釈剤を混合しても良い。A solvent and a diluent may be mixed.
耐熱性ホイスカーとして窒化珪素、炭化珪素のホイスカ
ーが挙げられ、これらのホイスカーは導電性粉末、エポ
キシ樹脂、硬化剤等の混合物１００重量部当り、１〜２
０重量部添加する必要がある。Examples of heat-resistant whiskers include silicon nitride and silicon carbide whiskers.
It is necessary to add 0 parts by weight.
１重量部未満では加熱下の強度向上にあまり効果がなく
、又、２０重量％を超えると硬化後導電性を示さなくな
るからである。好ましい添加量は２．５〜１０重量部で
ある。This is because if it is less than 1 part by weight, it will not be very effective in improving the strength under heating, and if it exceeds 20% by weight, it will not exhibit conductivity after curing. The preferred amount added is 2.5 to 10 parts by weight.
（作 用）
本発明品が従来と同じエポキシ樹脂及び硬化剤を用い、
しかも従来と同様の硬化条件であるにも掛ねらず加熱下
の強度が従来品より高くなる理由は、前記ホイスカーが
硬化接着剤中にからみ合って存在するため樹脂自体が軟
化しても流動が妨げられるためと考えられる。(Function) The product of the present invention uses the same epoxy resin and curing agent as the conventional one,
Moreover, the reason why the strength under heating is higher than that of conventional products even under the same curing conditions as before is because the whiskers are entangled in the cured adhesive, so even if the resin itself softens, it does not flow. This is thought to be because it is obstructed.
（実施例）
導電性充填剤として主にフレーク状銀粉（０，１μｍ〜
１０μｍ ） 、反応性溶剤としてフェニルグリシジル
エーテル、エポキシ樹脂としてビスフェノールＡ型エポ
キシ樹脂（エポキシ当量１９０ｇ／ｅｑｕｉν）、硬化
剤としてジシアンジアミド、及び３−（３，４−ジクロ
ロフェニル）−Ｃ１−ジメチル尿素を、硬化促進剤とし
てスミエポキシＥＳＣＮ−２２０Ｌ （住友化学工業■
製りレゾールノボランク型エポキシ樹脂の商品名、硬化
点７０℃、エポキシ当量２１５ ｇ ／ｅｑｕｉｖ）に
ジメチルアミンを反応させて得たものを使用した。更に
実験Ｎｏ、 ２〜８及び１６のＳｉ３Ｎ４は直径０．０
５〜０．２ μｍ 。(Example) Mainly flaky silver powder (0.1 μm ~
10 μm), phenyl glycidyl ether as the reactive solvent, bisphenol A type epoxy resin (epoxy equivalent: 190 g/equiν) as the epoxy resin, dicyandiamide as the curing agent, and 3-(3,4-dichlorophenyl)-C1-dimethylurea. Sumiepoxy ESCN-220L (Sumitomo Chemical ■) as an accelerator
A product obtained by reacting a manufactured resol novolank type epoxy resin (trade name, curing point: 70° C., epoxy equivalent: 215 g/equiv) with dimethylamine was used. Furthermore, the diameter of Si3N4 in experiment Nos. 2 to 8 and 16 is 0.0.
5-0.2 μm.
長さ１０〜４０μｍ１実験Ｎｏ、９〜１５のＳｉＣは直
径０．２〜０．５μ、長さ５０μ〜３００μｍのホイス
カーを使用した。Length: 10 to 40 μm 1 For SiC in Experiment No. 9 to 15, a whisker having a diameter of 0.2 to 0.5 μm and a length of 50 μm to 300 μm was used.
上記エポキシ樹脂１００重量部にジシアンジアミド１０
重ｉｔ部、３−（３，４−ジクロロフェニル）−１，１
−ジメチル尿素５重量部、硬化促進剤１２重量部を予め
良く混合し樹脂組成物とした。次いで導電性充填剤及び
反応性溶剤、ホイスカーを加えて三本ロールで充分混練
し、導電性樹脂ペーストとした。10 parts by weight of the above epoxy resin and 10 parts by weight of dicyandiamide
heavy it part, 3-(3,4-dichlorophenyl)-1,1
- 5 parts by weight of dimethyl urea and 12 parts by weight of a curing accelerator were thoroughly mixed in advance to prepare a resin composition. Next, a conductive filler, a reactive solvent, and a whisker were added and thoroughly kneaded using three rolls to obtain a conductive resin paste.
この様にして作製したペーストの特性は次のようにして
測定した。The properties of the paste produced in this way were measured as follows.
（１） シート抵抗値・・・ペーストをアルミナ基板
上に幅２．５ ｔｎ、長さ５． Ｑ ｍｕのパターンに
印刷し、１５０°Ｃて３０分間硬化せしめ、硬化した被
膜の長さ方向両端の抵抗値を測定して面積抵抗で表示し
た。(1) Sheet resistance value... Paste is placed on an alumina substrate with a width of 2.5 tn and a length of 5. A Q mu pattern was printed and cured at 150°C for 30 minutes, and the resistance values at both longitudinal ends of the cured film were measured and expressed as sheet resistance.
（２）接着強度及び熱間強度・・・」二記方法で印刷し
たパターンにＳｉ チップ（１，５酊×１．５龍ＸＱ、
３ｉｎ）を付着させ、１５０°Ｃで３０分間硬化せしめ
樹脂とＳｉチップとの接着強度を測定し、更に３５０℃
で
３０秒間加熱時の接着強度も測定した。(2) Adhesive strength and hot strength...” Si chips (1.5 x 1.5 dragon x Q,
3 inch) was applied, cured at 150°C for 30 minutes, measured the adhesive strength between the resin and the Si chip, and then cured at 150°C for 30 minutes.
The adhesive strength was also measured when heated for 30 seconds.
接着強度及び熱間強度はＳｉチップの側面を治具で押し
、Ｓｉチップが剥れた時の押圧力で示す。The adhesive strength and hot strength are shown by the pressing force when the side surface of the Si chip is pressed with a jig and the Si chip is peeled off.
これらの特性値を表に示す。（％は重量％）この表から
ホイスカーが１重量％未満では熱間強度が充分でなく、
２０重量％を超えると抵抗値が高くなり過ぎて導電性接
着剤として不適当になることが分る。These characteristic values are shown in the table. (% is weight%) From this table, if the whisker content is less than 1% by weight, the hot strength is insufficient.
It can be seen that if it exceeds 20% by weight, the resistance value becomes too high and it becomes unsuitable as a conductive adhesive.
（発明の効果）
本発明の導電性接着剤によれば硬化膜の加熱下における
軟化がかなり緩和されるため、熱圧着式ワイヤーボンデ
ィングを適用しても素子の剥離、位置ずれを効果的に防
止することができる。(Effects of the Invention) The conductive adhesive of the present invention considerably reduces softening of the cured film under heating, effectively preventing element peeling and misalignment even when thermocompression wire bonding is applied. can do.
Claims (1)
硬化剤及び必要により硬化促進剤、溶剤等とからなる混
合物１００重量部に対し、１〜２０重量部の耐熱性ホイ
スカーが添加されてなる導電性接着剤。1 to 20 parts by weight of a heat-resistant whisker is added to 100 parts by weight of a mixture consisting of 50 to 95% by weight of conductive powder, the balance being an epoxy resin, a curing agent, and if necessary a curing accelerator, a solvent, etc. conductive adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20947686A JPS6366278A (en) | 1986-09-08 | 1986-09-08 | Electrically conductive adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20947686A JPS6366278A (en) | 1986-09-08 | 1986-09-08 | Electrically conductive adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6366278A true JPS6366278A (en) | 1988-03-24 |
Family
ID=16573478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20947686A Pending JPS6366278A (en) | 1986-09-08 | 1986-09-08 | Electrically conductive adhesive |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6366278A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1192739A (en) * | 1997-09-18 | 1999-04-06 | Sumitomo Bakelite Co Ltd | Conductive resin paste and semiconductor device produced by using it |
| JP2007062103A (en) * | 2005-08-30 | 2007-03-15 | Chugoku Electric Power Co Inc:The | Easily sealable printing web for handy terminal and handy terminal |
| CN110184008A (en) * | 2019-05-20 | 2019-08-30 | 秦臻 | A kind of preparation method of epoxy group heat conductive insulating compound cutan |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5721469A (en) * | 1980-07-14 | 1982-02-04 | Nippon Soken Inc | Heat-resisting, electrically conductive adhesive |
| JPS59172571A (en) * | 1983-03-18 | 1984-09-29 | Hitachi Chem Co Ltd | Electrically conductive adhesive |
| JPS6166772A (en) * | 1984-09-10 | 1986-04-05 | Tateho Kagaku Kogyo Kk | Adhesive containing needle-like ceramic fiber |
-
1986
- 1986-09-08 JP JP20947686A patent/JPS6366278A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5721469A (en) * | 1980-07-14 | 1982-02-04 | Nippon Soken Inc | Heat-resisting, electrically conductive adhesive |
| JPS59172571A (en) * | 1983-03-18 | 1984-09-29 | Hitachi Chem Co Ltd | Electrically conductive adhesive |
| JPS6166772A (en) * | 1984-09-10 | 1986-04-05 | Tateho Kagaku Kogyo Kk | Adhesive containing needle-like ceramic fiber |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1192739A (en) * | 1997-09-18 | 1999-04-06 | Sumitomo Bakelite Co Ltd | Conductive resin paste and semiconductor device produced by using it |
| JP2007062103A (en) * | 2005-08-30 | 2007-03-15 | Chugoku Electric Power Co Inc:The | Easily sealable printing web for handy terminal and handy terminal |
| CN110184008A (en) * | 2019-05-20 | 2019-08-30 | 秦臻 | A kind of preparation method of epoxy group heat conductive insulating compound cutan |
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