JP5559220B2 - Manufacturing method of semiconductor module to which high heat conductive adhesive sheet with metal foil or high heat conductive adhesive sheet with metal plate is bonded - Google Patents
Manufacturing method of semiconductor module to which high heat conductive adhesive sheet with metal foil or high heat conductive adhesive sheet with metal plate is bonded Download PDFInfo
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- JP5559220B2 JP5559220B2 JP2012039394A JP2012039394A JP5559220B2 JP 5559220 B2 JP5559220 B2 JP 5559220B2 JP 2012039394 A JP2012039394 A JP 2012039394A JP 2012039394 A JP2012039394 A JP 2012039394A JP 5559220 B2 JP5559220 B2 JP 5559220B2
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- metal foil
- heat conductive
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- 229910052751 metal Inorganic materials 0.000 title claims description 98
- 239000002184 metal Substances 0.000 title claims description 98
- 239000011888 foil Substances 0.000 title claims description 67
- 239000000853 adhesive Substances 0.000 title claims description 62
- 230000001070 adhesive effect Effects 0.000 title claims description 62
- 239000004065 semiconductor Substances 0.000 title claims description 17
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 229920005989 resin Polymers 0.000 claims description 80
- 239000011347 resin Substances 0.000 claims description 80
- 239000003822 epoxy resin Substances 0.000 claims description 49
- 229920000647 polyepoxide Polymers 0.000 claims description 49
- 239000011342 resin composition Substances 0.000 claims description 48
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims description 34
- 229910052582 BN Inorganic materials 0.000 claims description 22
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 22
- 239000002245 particle Substances 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 6
- 238000005266 casting Methods 0.000 claims description 5
- DRQFBCMQBWNTNV-UHFFFAOYSA-N 2-[bis(2-hydroxyethyl)amino]ethanol;trifluoroborane Chemical compound FB(F)F.OCCN(CCO)CCO DRQFBCMQBWNTNV-UHFFFAOYSA-N 0.000 claims description 4
- JDVIRCVIXCMTPU-UHFFFAOYSA-N ethanamine;trifluoroborane Chemical compound CCN.FB(F)F JDVIRCVIXCMTPU-UHFFFAOYSA-N 0.000 claims description 4
- DBIWHDFLQHGOCS-UHFFFAOYSA-N piperidine;trifluoroborane Chemical compound FB(F)F.C1CCNCC1 DBIWHDFLQHGOCS-UHFFFAOYSA-N 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 79
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 28
- 239000000945 filler Substances 0.000 description 17
- 239000011256 inorganic filler Substances 0.000 description 16
- 229910003475 inorganic filler Inorganic materials 0.000 description 16
- 229910015900 BF3 Inorganic materials 0.000 description 14
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 229920001187 thermosetting polymer Polymers 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000011049 filling Methods 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000011265 semifinished product Substances 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000005488 sandblasting Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- WIOWSZFVJSZSCX-UHFFFAOYSA-N 2,4-dimethylaniline;trifluoroborane Chemical compound FB(F)F.CC1=CC=C(N)C(C)=C1 WIOWSZFVJSZSCX-UHFFFAOYSA-N 0.000 description 1
- LSAMTNWZBYOWMZ-UHFFFAOYSA-N 4-methylaniline;trifluoroborane Chemical compound FB(F)F.CC1=CC=C(N)C=C1 LSAMTNWZBYOWMZ-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- VXMBSVVTXYWGMF-UHFFFAOYSA-N B(F)(F)F.C(C)N(CC)CC.B(F)(F)F Chemical compound B(F)(F)F.C(C)N(CC)CC.B(F)(F)F VXMBSVVTXYWGMF-UHFFFAOYSA-N 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Natural products CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 1
- KSMUFOFMTRJIRJ-UHFFFAOYSA-N N-methylaniline trifluoroborane Chemical compound CNC1=CC=CC=C1.B(F)(F)F KSMUFOFMTRJIRJ-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- VWKLICCSBFEWSZ-UHFFFAOYSA-N aniline;trifluoroborane Chemical compound FB(F)F.NC1=CC=CC=C1 VWKLICCSBFEWSZ-UHFFFAOYSA-N 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- ILHOQKCVIFZHGS-UHFFFAOYSA-N n,n-dimethylaniline;trifluoroborane Chemical compound FB(F)F.CN(C)C1=CC=CC=C1 ILHOQKCVIFZHGS-UHFFFAOYSA-N 0.000 description 1
- ONIBTRZKRVDUDR-UHFFFAOYSA-N n-ethylaniline;trifluoroborane Chemical compound FB(F)F.CCNC1=CC=CC=C1 ONIBTRZKRVDUDR-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- CHNLPLHJUPMEOI-UHFFFAOYSA-N oxolane;trifluoroborane Chemical compound FB(F)F.C1CCOC1 CHNLPLHJUPMEOI-UHFFFAOYSA-N 0.000 description 1
- VENBJVSTINLYEU-UHFFFAOYSA-N phenol;trifluoroborane Chemical compound FB(F)F.OC1=CC=CC=C1 VENBJVSTINLYEU-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- YRZFHTRSHNGOSR-UHFFFAOYSA-N phenylmethanamine;trifluoroborane Chemical compound FB(F)F.NCC1=CC=CC=C1 YRZFHTRSHNGOSR-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 1
Images
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesive Tapes (AREA)
- Epoxy Resins (AREA)
Description
本発明は、無機フィラーとエポキシ樹脂とを含む樹脂組成物、無機フィラーとエポキシ樹脂とを含む樹脂組成物が用いられた熱伝導シート、無機フィラーとエポキシ樹脂とを含む樹脂組成物が用いられた高熱伝導性樹脂層と、金属箔が用いられた金属箔層とが積層されてシート状に形成されており、加熱条件下において前記高熱伝導性樹脂層側を被着体に当接させることにより前記高熱伝導性樹脂層を熱硬化させて被着体に接着させて用いられる金属箔付高熱伝導接着シート、ならびに、無機フィラーとエポキシ樹脂とを含む樹脂組成物が用いられた高熱伝導性樹脂層と、金属板が用いられた金属板層とが積層されてシート状に形成されており、加熱条件下において前記高熱伝導性樹脂層側を被着体に当接させることにより前記高熱伝導性樹脂層を熱硬化させて被着体に接着させて用いられる金属板付高熱伝導接着シートに関する。 The present invention uses a resin composition containing an inorganic filler and an epoxy resin, a heat conductive sheet using a resin composition containing an inorganic filler and an epoxy resin, and a resin composition containing an inorganic filler and an epoxy resin. A high thermal conductive resin layer and a metal foil layer using a metal foil are laminated to form a sheet, and the high thermal conductive resin layer side is brought into contact with the adherend under heating conditions. High heat conductive adhesive sheet with metal foil used by thermally curing the high heat conductive resin layer and adhering to an adherend, and high heat conductive resin layer using a resin composition containing an inorganic filler and an epoxy resin And a metal plate layer using a metal plate are laminated to form a sheet, and the high thermal conductivity resin layer is brought into contact with the adherend under heating conditions by contacting the high thermal conductivity resin layer side with the adherend. The layers are thermally cured by adhesive for Metal Backed high thermal conductive adhesive sheet used to the adherend.
従来、ベース樹脂と無機フィラーとを含む樹脂組成物でシート状に形成された熱伝導シートや、ベース樹脂と無機フィラーとを含む樹脂組成物により形成された高熱伝導性樹脂層と、金属箔が用いられて形成された金属箔層とが積層されてシート状に形成された金属箔付高熱伝導接着シート、あるいは、高熱伝導性樹脂層と金属板層とが積層されてシート状に形成された金属板付高熱伝導接着シートなどが電子部品用途などに用いられている。
例えば、特許文献１には、半導体チップのボンディング面と反対側の面に高熱伝導性樹脂層を接着させて金属箔付高熱伝導接着シートが用いられることが記載されている。
Conventionally, a heat conductive sheet formed in a sheet shape with a resin composition containing a base resin and an inorganic filler, a high heat conductive resin layer formed with a resin composition containing a base resin and an inorganic filler, and a metal foil High heat conductive adhesive sheet with metal foil formed into a sheet by laminating and forming a metal foil layer used, or formed into a sheet by laminating a high heat conductive resin layer and a metal plate layer High heat conductive adhesive sheets with metal plates are used for electronic parts.
For example, Patent Document 1 describes that a high thermal conductive resin layer with a metal foil is used by bonding a high thermal conductive resin layer to a surface opposite to the bonding surface of a semiconductor chip.
この熱伝導シートは、通常、一方を発熱部材などの被着体に接着させ、他方を放熱器などに接着させて用いられ、発熱部材側から放熱器側にすばやく熱を伝達すべく無機フィラーが樹脂成分に対して高充填された樹脂組成物によりシート状に形成されている。
また、金属箔付高熱伝導接着シートは、通常、この高熱伝導性樹脂層の表面を発熱部材などの被着体に接着させて用いられ、高熱伝導性樹脂層は、通常、発熱部材側から金属箔層側にすばやく熱を伝達すべく無機フィラーが樹脂成分に対して高充填された樹脂組成物により形成されている。
This heat conductive sheet is usually used by adhering one side to an adherend such as a heat generating member and the other adhering to a radiator or the like, and an inorganic filler is used to quickly transfer heat from the heat generating member side to the heat radiator side. It is formed into a sheet shape by a resin composition highly filled with respect to the resin component.
In addition, the high thermal conductive adhesive sheet with metal foil is usually used by bonding the surface of the high thermal conductive resin layer to an adherend such as a heat generating member, and the high thermal conductive resin layer is usually metal from the heat generating member side. In order to quickly transfer heat to the foil layer side, it is formed of a resin composition in which an inorganic filler is highly filled with respect to the resin component.
また、この熱伝導シートや金属箔付高熱伝導接着シートの高熱伝導性樹脂層の形成には、無機物の中でも特に熱伝導性に優れている窒化ホウ素が用いられた窒化ホウ素フィラーを含む樹脂組成物が用いられたりしている。
また、高熱伝導性樹脂層には、高温下においても接着力を維持させること、ならびに、優れた耐熱性が求められていることから、この樹脂組成物の樹脂成分にはエポキシ樹脂などの熱硬化性樹脂が用いられたりしている。
In addition, a resin composition containing a boron nitride filler in which boron nitride, which is particularly excellent in thermal conductivity among inorganic substances, is used for forming the high thermal conductive resin layer of the thermal conductive sheet or the high thermal conductive adhesive sheet with metal foil. Is used.
In addition, since the high thermal conductive resin layer is required to maintain adhesive force even at high temperatures and to have excellent heat resistance, the resin component of this resin composition is thermosetting such as epoxy resin. An adhesive resin is used.
この高熱伝導性樹脂層の形成にエポキシ樹脂などの熱硬化性樹脂が用いられる場合においては、加熱条件下において高熱伝導性樹脂層側が被着体に当接されてこの高熱伝導性樹脂層が熱硬化され、被着体に接着されたりしている。
したがって、より短時間で硬化させ得る樹脂組成物を用いることにより被着体への接着作業性を良好なものとさせ得る。
このように、熱伝導性および耐熱性に優れた高熱伝導性樹脂層を有し、しかも、良好な接着作業性となるように高熱伝導性樹脂層が形成されている金属箔付高熱伝導接着シートが従来求められている。
しかし、従来、エポキシ樹脂を含む樹脂組成物の熱硬化の挙動については、十分な検討がなされていない。したがって、従来の熱伝導シートや、金属箔付高熱伝導接着シートあるいは金属板付高熱伝導接着シートなどにおいては、その要望を満足するものが得られていない。
When a thermosetting resin such as an epoxy resin is used to form the high thermal conductivity resin layer, the high thermal conductivity resin layer is brought into contact with the adherend under heating conditions so that the high thermal conductivity resin layer is heated. It is cured and adhered to the adherend.
Therefore, by using a resin composition that can be cured in a shorter time, the workability of adhesion to the adherend can be improved.
As described above, a highly heat conductive adhesive sheet with a metal foil having a high heat conductive resin layer excellent in heat conductivity and heat resistance and having a high heat conductive resin layer formed so as to have good bonding workability. Has been sought in the past.
However, sufficient studies have not been made on the thermosetting behavior of a resin composition containing an epoxy resin. Therefore, the conventional heat conductive sheet, the high heat conductive adhesive sheet with metal foil, the high heat conductive adhesive sheet with metal plate, or the like has not been able to satisfy the requirements.
本発明は、熱伝導性、耐熱性などに優れ、しかも、接着作業性の良好な金属箔付高熱伝導接着シート、又は、金属板付高熱伝導接着シートの接着された半導体モジュールの製造方法の提供を課題としている。 The present invention, thermal conductivity, excellent heat resistance, moreover, bonding work of good gold Shokuhakuzuke high thermal conductive adhesive sheet, or providing a method for producing a bonded semiconductor module metal fitted with high thermal conductivity adhesive sheet Is an issue.
本発明者らは、窒化ホウ素フィラーとエポキシ樹脂とを用いた樹脂組成物に着目して上記課題について鋭意検討を行った結果、無機フィラーとして窒化ホウ素が用いられる場合においては、この窒化ホウ素に含まれている不純物成分である三酸化ホウ素が、エポキシ樹脂の硬化促進剤に対して影響を与えていることを見出した。
また、所定の硬化促進剤を用いたエポキシ樹脂の硬化反応においては、三酸化ホウ素の存在によって硬化反応が加速されエポキシ樹脂の硬化時間が短縮されることを見出し本発明の完成に到ったのである。
As a result of intensive investigations on the above-mentioned problems by paying attention to a resin composition using a boron nitride filler and an epoxy resin, the present inventors have included boron nitride in the case where boron nitride is used as an inorganic filler. It has been found that boron trioxide, which is an impurity component, has an influence on the curing accelerator for epoxy resin.
In addition, in the curing reaction of the epoxy resin using a predetermined curing accelerator, it was found that the curing reaction was accelerated by the presence of boron trioxide and the curing time of the epoxy resin was shortened. is there.
すなわち、本発明は、前記課題を解決すべく、金属箔からなる金属箔層上に高熱伝導性樹脂層が積層されている金属箔付高熱伝導接着シート、又は、金属板からなる金属板層上に高熱伝導性樹脂層が積層されてなる金属板付高熱伝導接着シートを用い、且つ、窒化ホウ素粒子が２５体積％以上含有されている樹脂組成物で前記高熱伝導性樹脂層が形成されており、該樹脂組成物がエポキシ樹脂と前記窒化ホウ素粒子とを含み、該窒化ホウ素粒子が三酸化ホウ素成分を０．０１％〜０．５％含み、該樹脂組成物に前記エポキシ樹脂を熱硬化させるための硬化促進剤として三フッ化ホウ素モノエチルアミン、三フッ化ホウ素トリエタノールアミンおよび三フッ化ホウ素ピペリジンのいずれかが含まれている金属箔付高熱伝導接着シート、又は、金属板付高熱伝導接着シートを用い、半導体モジュールのヒートシンクに前記高熱伝導性樹脂層を接着させて該高熱伝導性樹脂層を熱硬化させることを特徴とする金属箔付高熱伝導接着シート、又は、金属板付高熱伝導接着シートの接着された半導体モジュールの製造方法を提供する。 That is, in order to solve the above-mentioned problems, the present invention provides a highly heat conductive adhesive sheet with a metal foil in which a high heat conductive resin layer is laminated on a metal foil layer made of a metal foil, or a metal plate layer made of a metal plate. A high thermal conductive resin sheet with a metal plate formed by laminating a high thermal conductive resin layer, and the high thermal conductive resin layer is formed of a resin composition containing 25% by volume or more of boron nitride particles , and a said boron nitride particles the resin composition is an epoxy resin, comprises nitride boron particles 0.01% to 0.5% boron trioxide component, the epoxy resin in the resin composition for thermally curing High heat conductive adhesive sheet with metal foil containing boron trifluoride monoethylamine, boron trifluoride triethanolamine and boron trifluoride piperidine as a curing accelerator of A high heat conductive adhesive sheet with a metal foil, characterized by using a high heat conductive adhesive sheet with a plate and bonding the high heat conductive resin layer to a heat sink of a semiconductor module to thermally cure the high heat conductive resin layer, or with a metal plate A method for manufacturing a semiconductor module to which a high thermal conductive adhesive sheet is bonded is provided.
本発明によれば、エポキシ樹脂の硬化促進剤として、三酸化ホウ素成分の存在によってエポキシ樹脂の硬化反応をいっそう促進させ得る三フッ化ホウ素系硬化促進剤が含まれることから、樹脂組成物の硬化時間を短縮させ得る。
また、本発明によれば、高熱伝導性樹脂層の形成に用いられている樹脂組成物中に無機フィラーとエポキシ樹脂とを含んでいることから、熱伝導性シートや、金属箔付高熱伝導接着シート、あるいは、金属板付高熱伝導接着シートの高熱伝導性樹脂層を熱伝導性、耐熱性などに優れたものとさせ得る。
しかも、エポキシ樹脂の硬化促進剤として、三酸化ホウ素成分の存在によってエポキシ樹脂の硬化反応をいっそう促進させ得る三フッ化ホウ素系硬化促進剤が樹脂組成物中に含まれることから、例えば、窒化ホウ素のように三酸化ホウ素成分を含む物質が無機フィラーとして用いられた場合に、他の硬化促進剤が用いられた場合と比べてエポキシ樹脂の硬化時間を短縮させ得る。
すなわち、本発明によれば、熱硬化性に優れた樹脂組成物を提供し得る。
また、熱伝導性、耐熱性などに優れ、しかも、接着作業性の良好な熱伝導性シート、金属箔付高熱伝導接着シート、ならびに、金属板付高熱伝導接着シートを提供し得る。
本発明によれば、このような金属箔付高熱伝導接着シート、又は、金属板付高熱伝導接着シートの接着された半導体モジュールの製造方法が提供され得る。
According to the present invention, the epoxy resin curing accelerator includes a boron trifluoride-based curing accelerator that can further accelerate the curing reaction of the epoxy resin due to the presence of the boron trioxide component. Time can be shortened.
Further, according to the present invention, since the resin composition used for forming the high thermal conductive resin layer contains an inorganic filler and an epoxy resin, the thermal conductive sheet or the high thermal conductive adhesive with metal foil is used. The sheet or the high thermal conductive resin layer of the high thermal conductive adhesive sheet with metal plate can be made excellent in thermal conductivity, heat resistance and the like.
Moreover, since a boron trifluoride-based curing accelerator that can further accelerate the curing reaction of the epoxy resin due to the presence of a boron trioxide component is included in the resin composition as a curing accelerator for the epoxy resin, for example, boron nitride Thus, when the substance containing a boron trioxide component is used as an inorganic filler, the curing time of the epoxy resin can be shortened compared to the case where other curing accelerators are used.
That is, according to the present invention, a resin composition excellent in thermosetting can be provided.
In addition, it is possible to provide a heat conductive sheet excellent in heat conductivity, heat resistance, etc., and having good adhesion workability, a high heat conductive adhesive sheet with metal foil, and a high heat conductive adhesive sheet with metal plate.
According to this invention, the manufacturing method of the semiconductor module with which such a high heat conductive adhesive sheet with a metal foil or a high heat conductive adhesive sheet with a metal plate was bonded can be provided.
以下に、本発明の好ましい実施の形態について、図１を参照しつつ説明する。
本実施形態における金属箔付高熱伝導接着シートは、金属箔層と高熱伝導性樹脂層との積層構造を有し、シート状に形成されている。
この図１では、半導体モジュールのヒートシンクに前記高熱伝導性樹脂層が接着されて使用される場合を例示している。
A preferred embodiment of the present invention will be described below with reference to FIG.
The high heat conductive adhesive sheet with metal foil in this embodiment has a laminated structure of a metal foil layer and a high heat conductive resin layer, and is formed in a sheet shape.
In this FIG. 1, the case where the said high thermal conductive resin layer is adhere | attached and used for the heat sink of a semiconductor module is illustrated.
この金属箔付高熱伝導接着シートの金属箔層については、通常、５０〜３００μｍの厚さの金属箔を用いて形成することができ、この金属箔としては、銅、アルミニウム、ニッケル、鉄などの純金属や合金が用いられたものをあげることができる。
また、このような金属箔としては、各種メッキが施されたものや、あるいは、複数種類の金属が積層されているクラッド箔なども用いることができる。
About the metal foil layer of this high heat conductive adhesive sheet with a metal foil, it can usually be formed using a metal foil having a thickness of 50 to 300 μm, and as this metal foil, copper, aluminum, nickel, iron, etc. The thing using the pure metal and the alloy can be mention | raise | lifted.
In addition, as such a metal foil, those plated with various types, or clad foil in which a plurality of types of metals are laminated can be used.
また、この金属箔層の金属箔は、高熱伝導性樹脂層との接着力を向上させるべく、高熱伝導性樹脂層との界面側が表面粗化されていることが好ましい。
この表面粗化については、金属箔の表面をサンドブラスト処理や酸化処理するなどして施すことができる。
なお、電解金属箔を用いる場合においては、そのマット面（粗化面）を高熱伝導性樹脂層との積層界面として利用することができ、サンドブラスト処理や酸化処理などの特段の処理を必要としない点において好適である。
Moreover, it is preferable that the metal foil of this metal foil layer is roughened on the interface side with the high thermal conductive resin layer in order to improve the adhesive force with the high thermal conductive resin layer.
This surface roughening can be performed by sandblasting or oxidizing the surface of the metal foil.
In the case of using an electrolytic metal foil, the mat surface (roughened surface) can be used as a laminated interface with the high thermal conductive resin layer, and no special treatment such as sandblasting or oxidation treatment is required. This is preferable in terms of points.
なお、この金属箔層の形成に用いる電解金属箔としては、比較的安価であり、耐腐蝕性にも優れ、高い熱伝導性を有する点において、電解銅箔を用いることが好ましい。
さらに、この電解銅箔には、マット面にジンケート処理が施されているものを用いることが好ましい。
In addition, as electrolytic metal foil used for formation of this metal foil layer, it is preferable to use electrolytic copper foil in the point which is comparatively cheap, is excellent also in corrosion resistance, and has high thermal conductivity.
Furthermore, it is preferable to use the electrolytic copper foil whose zinc surface has been subjected to a zincate treatment.
前記高熱伝導性樹脂層は、三酸化ホウ素成分を含む無機フィラーとエポキシ樹脂とを含む樹脂組成物が用いられて形成されている。 The high thermal conductive resin layer is formed using a resin composition containing an inorganic filler containing a boron trioxide component and an epoxy resin.
この三酸化ホウ素成分を含む無機フィラーとしては、窒化ホウ素フィラーが例示でき、一般に市販の窒化ホウ素フィラーには、通常、三酸化ホウ素成分が０．０１〜数％含有されている。
この窒化ホウ素フィラーとしては、通常、鱗片形状を有する平均粒子径１〜２０μｍのものを用いることができる。この平均粒子径については、レーザー回折法によるＤ５０値を測定することにより求めることができる。
なお、高熱伝導性樹脂層の形成に用いられる樹脂組成物には、この窒化ホウ素フィラーに加えて、アルミナフィラー、窒化アルミニウムフィラー、窒化ケイ素フィラー、炭化ケイ素フィラー、二酸化ケイ素フィラー、ダイヤモンドフィラーなどを併用することができる。
An example of the inorganic filler containing the boron trioxide component is a boron nitride filler. Generally, commercially available boron nitride fillers usually contain 0.01 to several percent of the boron trioxide component.
As this boron nitride filler, those having an average particle diameter of 1 to 20 μm having a scale shape can be usually used. This average particle diameter can be determined by measuring the D50 value by laser diffraction.
In addition to this boron nitride filler, alumina resin, aluminum nitride filler, silicon nitride filler, silicon carbide filler, silicon dioxide filler, diamond filler, etc. are used in combination with the resin composition used for forming the high thermal conductive resin layer. can do.
前記エポキシ樹脂としては、特に限定されるものではないが、常温固体のものが好ましい。この常温固体のエポキシが好ましいのは、常温液体状のエポキシ樹脂を用いた場合には、金属箔付高熱伝導接着シートを被着体に接着すべく加熱条件下において高熱伝導性樹脂層側を被着体に当接させた場合に、エポキシ樹脂の粘度が低下しすぎて、金属箔付高熱伝導接着シートの端縁部から外にエポキシ樹脂が大きく滲み出してしまうおそれがあるためである。
このエポキシ樹脂の滲み出しが激しい場合には、例えば、金属箔層の背面側など本来金属部分が露出しているべき個所にエポキシ樹脂被膜を形成させてしまうおそれがある。
Although it does not specifically limit as said epoxy resin, A normal temperature solid thing is preferable. This room temperature solid epoxy is preferable when the room temperature liquid epoxy resin is used, so that the high thermal conductive resin layer side is coated under heating conditions so as to adhere the high thermal conductive adhesive sheet with metal foil to the adherend. This is because when the epoxy resin is brought into contact with the adherend, the viscosity of the epoxy resin is too low and the epoxy resin may ooze out from the edge of the high thermal conductive adhesive sheet with metal foil.
When the oozing of the epoxy resin is severe, there is a possibility that the epoxy resin film is formed at a place where the metal part should be exposed, such as the back side of the metal foil layer.
一方で、被着体への接着時にある程度の粘度低下が生じないと被着体と高熱伝導性樹脂層側との間に空隙などが生じやすく被着体側から金属箔層側への熱伝導性を低下させるおそれもある。
樹脂組成物に適度な流れ性を付与して、これらの問題をより確実に抑制させ得る点において、このエポキシ樹脂としては、エポキシ当量４５０〜２０００ｇ／ｅｑの常温固体のビスフェノールＡ型エポキシ樹脂と、エポキシ当量１６０〜２２０ｇ／ｅｑの多官能の常温固体で８７℃から９３℃の間に軟化点を有するノボラック型エポキシ樹脂とが（ビスフェノールＡ型エポキシ樹脂／ノボラック型エポキシ樹脂）＝４０／６０〜６０／４０となる重量比率で混合されているものを用いることが好ましい。
なお、このエポキシ当量は、ＪＩＳ Ｋ ７２３６により求めることができる。
On the other hand, if the viscosity does not decrease to some extent when adhering to the adherend, there is a tendency for voids to form between the adherend and the high thermal conductive resin layer side, and the thermal conductivity from the adherend side to the metal foil layer side May also be reduced.
As the epoxy resin, in which a moderate flowability is imparted to the resin composition and these problems can be more reliably suppressed, a normal temperature solid bisphenol A type epoxy resin having an epoxy equivalent of 450 to 2000 g / eq, A novolac type epoxy resin having a softening point between 87 ° C. and 93 ° C. with a polyfunctional normal temperature solid having an epoxy equivalent of 160 to 220 g / eq (bisphenol A type epoxy resin / novolak type epoxy resin) = 40/60 to 60 It is preferable to use one that is mixed at a weight ratio of / 40.
In addition, this epoxy equivalent can be calculated | required by JISK7236.
また、高熱伝導性樹脂層の形成に用いられる樹脂組成物には、このエポキシ樹脂が用いられた樹脂組成物を改質すべく、エポキシ樹脂以外に、フェノール樹脂、アクリル樹脂、ポリアミド樹脂などの樹脂を本発明の効果を損ねない範囲において添加することができる。 In addition to the epoxy resin, a resin such as a phenol resin, an acrylic resin, or a polyamide resin is used for the resin composition used for forming the high thermal conductive resin layer in order to modify the resin composition using the epoxy resin. It can add in the range which does not impair the effect of this invention.
また、高熱伝導性樹脂層の形成に用いられる樹脂組成物には、このエポキシ樹脂の硬化促進剤として、三フッ化ホウ素系硬化促進剤がさらに含まれる。
この、三フッ化ホウ素系硬化促進剤としては、三フッ化ホウ素アニリン、三フッ化ホウ素ｐ−トルイジン、三フッ化ホウ素Ｎ−メチルアニリン、三フッ化ホウ素Ｎ−エチルアニリン、三フッ化ホウ素２，４−ジメチルアニリン、三フッ化ホウ素ベンジルアミン、三フッ化ホウ素モノエチルアミン、三フッ化ホウ素Ｎ，Ｎ−ジメチルアニリン、三フッ化ホウ素トリエタノールアミン、三フッ化ホウ素ピペリジン、三フッ化ホウ素トリエチルアミン、三フッ化ホウ素エチルエーテル、三フッ化ホウ素メチルエーテル、三フッ化ホウ素ｎ−ブチルエーテル、三フッ化ホウ素テトラヒドロフラン、三フッ化ホウ素フェノールなどがあげられる。
なかでも、三フッ化ホウ素モノエチルアミン、三フッ化ホウ素トリエタノールアミン、三フッ化ホウ素ピペリジンが好ましい。
The resin composition used for forming the high thermal conductive resin layer further includes a boron trifluoride-based curing accelerator as a curing accelerator for the epoxy resin.
As the boron trifluoride-based curing accelerator, boron trifluoride aniline, boron trifluoride p-toluidine, boron trifluoride N-methylaniline, boron trifluoride N-ethylaniline, boron trifluoride 2 , 4-dimethylaniline, boron trifluoride benzylamine, boron trifluoride monoethylamine, boron trifluoride N, N-dimethylaniline, boron trifluoride triethanolamine, boron trifluoride piperidine, boron trifluoride triethylamine Boron trifluoride ethyl ether, boron trifluoride methyl ether, boron trifluoride n-butyl ether, boron trifluoride tetrahydrofuran, boron trifluoride phenol and the like.
Of these, boron trifluoride monoethylamine, boron trifluoride triethanolamine, and boron trifluoride piperidine are preferable.
なお、本発明の効果を損なわない範囲において、上記三フッ化ホウ素系硬化促進剤以外の硬化促進剤を三フッ化ホウ素系硬化促進剤と併用して用いることもできる。 In addition, in the range which does not impair the effect of this invention, hardening accelerators other than the said boron trifluoride type hardening accelerator can also be used together with a boron trifluoride type hardening accelerator.
また、三フッ化ホウ素系硬化促進剤とともに、エポキシ樹脂に用いられる一般的な硬化剤を用いることができる。
なかでも、エポキシ樹脂が、上記に示したようなビスフェノールＡ型エポキシ樹脂とノボラック型エポキシ樹脂とが重量で４０／６０〜６０／４０の割合で混合されている場合においては、４，４’−ジアミノジフェニルスルホンが、優れた硬化性能を発揮する点において好適である。
Moreover, the general hardening | curing agent used for an epoxy resin can be used with a boron trifluoride type hardening accelerator.
In particular, in the case where the bisphenol A type epoxy resin and the novolac type epoxy resin as described above are mixed in a ratio of 40/60 to 60/40 by weight, the epoxy resin is 4,4′- Diaminodiphenyl sulfone is preferred in that it exhibits excellent curing performance.
また、高熱伝導性樹脂層の形成に用いられる樹脂組成物には、本発明の効果を損なわない範囲において、老化防止剤、酸化防止剤、安定剤、分散助剤、消泡剤、難燃剤、増粘剤、顔料などといった各種配合剤を適宜加えることができる。 In addition, the resin composition used for forming the high thermal conductive resin layer has an anti-aging agent, an antioxidant, a stabilizer, a dispersion aid, an antifoaming agent, a flame retardant, and the like within a range not impairing the effects of the present invention. Various compounding agents such as thickeners and pigments can be appropriately added.
なお、図１に示すヒートシンクのような、電荷が加えられる被着体に用いられる場合においては、上記材料が用いられてなる樹脂組成物により高熱伝導性樹脂層が、例えば、１×１０10Ω・ｃｍ以上の体積抵抗率となるように形成されることが好ましく、１×１０13Ω・ｃｍ以上の体積抵抗率に形成されることがさらに好ましい。 In the case of being used for an adherend to which an electric charge is applied, such as the heat sink shown in FIG. 1, the high thermal conductive resin layer is made of, for example, 1 × 10 10 Ω by the resin composition using the above material. It is preferably formed so as to have a volume resistivity of cm or more, more preferably 1 × 10 13 Ω · cm or more.
次いで、これらの材料により金属箔付高熱伝導接着シートを製造する製造方法について説明する。 Subsequently, the manufacturing method which manufactures the high heat conductive adhesive sheet with metal foil with these materials is demonstrated.
まず、金属箔層上に樹脂組成物による高熱伝導性樹脂層を形成させるために、この樹脂組成物を液状化させた塗工液を作製する。
この塗工液の作製方法については、一般的な、樹脂溶液の作製方法を採用することができ、例えば、エポキシ樹脂、三フッ化ホウ素系硬化促進剤などを一旦溶媒などに溶解させたエポキシ樹脂溶液にミキサーなどにより窒化ホウ素フィラーを分散させる方法などを採用することができる。
First, in order to form a highly thermally conductive resin layer made of a resin composition on a metal foil layer, a coating liquid in which the resin composition is liquefied is prepared.
About the preparation method of this coating liquid, the general preparation method of a resin solution can be employ | adopted, for example, the epoxy resin which once melt | dissolved the epoxy resin, the boron trifluoride type hardening accelerator, etc. in the solvent etc. A method of dispersing the boron nitride filler in the solution with a mixer or the like can be employed.
次いで、例えば、電解銅箔のマット面上に上記のように作製した塗工液を乾燥後の厚さ、すなわち、高熱伝導性樹脂層の形成厚さが所定厚さとなるように、コーティングマシーンなどによりコーティングし、乾燥炉を通過させるなどして乾燥を実施して、金属箔層上に高熱伝導性樹脂層が積層された金属箔付高熱伝導接着シートを製造することができる。 Next, for example, a coating machine or the like so that the thickness after drying the coating liquid prepared as described above on the mat surface of the electrolytic copper foil, that is, the formation thickness of the high thermal conductive resin layer becomes a predetermined thickness. It is possible to produce a highly heat conductive adhesive sheet with a metal foil in which a high heat conductive resin layer is laminated on a metal foil layer by coating with, and passing through a drying furnace.
さらに、このようにして製造された金属箔付高熱伝導接着シートの使用方法について説明する。
図１では、半導体モジュールのヒートシンクに対して高熱伝導性樹脂層が接着されて用いられる場合を示している。
このように半導体モジュールのヒートシンクに対して高熱伝導性樹脂層を接着させるには、例えば、加熱状態の熱板上に高熱伝導性樹脂層を表向きにして載置して高熱伝導性樹脂層を熱板の熱により軟化させ、半導体モジュールのヒートシンク露出面をこの軟化状態の高熱伝導性樹脂層表面に押圧して高熱伝導性樹脂層のエポキシ樹脂が硬化するまで保持して、半導体モジュールに対する金属箔付高熱伝導接着シートの接着を完了させる方法があげられる。
Furthermore, the usage method of the highly heat-conductive adhesive sheet with metal foil manufactured in this way is demonstrated.
FIG. 1 shows a case where a high thermal conductive resin layer is bonded to a heat sink of a semiconductor module.
In order to bond the high thermal conductivity resin layer to the heat sink of the semiconductor module in this way, for example, the high thermal conductivity resin layer is placed on a heated hot plate so that the high thermal conductivity resin layer is heated. Soften by heat of the board, press the exposed surface of the heat sink of the semiconductor module against the surface of the soft heat-resistant resin layer and hold it until the epoxy resin of the high heat-conductive resin layer is cured. A method for completing the adhesion of the high thermal conductive adhesive sheet is mentioned.
また、あるいは、半導体モジュールが、加熱溶融されたモールド樹脂が注型されて一体成型されているものであれば、この半導体モジュールのモールド樹脂の注型時に同時に金属箔付高熱伝導接着シートの接着を実施させることもできる。
例えば、リードフレームが固定されたケース内に、ハンダ付けされた半導体チップを搭載したヒートシンクを配置し、この半導体チップとリードフレームとをワイヤーボンドにより電気的に接続させた半製品を用いて、注型用金型内に金属箔付高熱伝導接着シートを高熱伝導性樹脂層を表向きにしてセットし、この金属箔付高熱伝導接着シート上にヒートシンクが位置するようにして前記半製品を載置して、半製品のケース内に加熱溶融されたモールド樹脂を注入することにより、このモールド樹脂の熱で、あるいは注型用金型を加熱して高熱伝導性樹脂層を軟化させてヒートシンクに接着硬化させる方法、すなわち、半導体モジュールの製造と同時に金属箔付高熱伝導接着シートの接着を実施させる方法などがあげられる。
Alternatively, if the semiconductor module is molded and integrally molded with heat-melted mold resin, the high-heat conductive adhesive sheet with metal foil is bonded at the same time when the mold resin of the semiconductor module is cast. It can also be implemented.
For example, using a semi-finished product in which a heat sink carrying a soldered semiconductor chip is placed in a case where the lead frame is fixed, and the semiconductor chip and the lead frame are electrically connected by wire bonding, Place the high heat conductive adhesive sheet with metal foil in the mold for mold with the high heat conductive resin layer facing up, and place the semi-finished product so that the heat sink is positioned on this metal foil high heat conductive adhesive sheet Then, by injecting the mold resin that has been heated and melted into the case of the semi-finished product, the heat of the mold resin or by heating the casting mold softens the high thermal conductive resin layer and adheres and cures to the heat sink. For example, a method of bonding a highly heat conductive adhesive sheet with a metal foil simultaneously with the manufacture of a semiconductor module.
なお、このとき高熱伝導性樹脂層を形成する樹脂組成物には、三酸化ホウ素成分を含む窒化ホウ素フィラーと、エポキシ樹脂と、三フッ化ホウ素系硬化促進剤とを含んでいることから三酸化ホウ素成分を含んでいない無機フィラーが用いられる場合や、他の硬化促進剤が用いられる場合などに比べて硬化時間を短縮させることができる。 At this time, the resin composition for forming the high thermal conductive resin layer contains a boron nitride filler containing a boron trioxide component, an epoxy resin, and a boron trifluoride-based curing accelerator. The curing time can be shortened as compared to the case where an inorganic filler not containing a boron component is used, or the case where another curing accelerator is used.
この窒化ホウ素フィラーに含まれている三酸化ホウ素成分は、エポキシ樹脂の硬化反応に影響を与える。例えば、硬化促進剤の種類によっては、硬化促進剤としての機能が抑制されてしまい、長時間の硬化時間を設けてもエポキシ樹脂を完全に硬化させることが困難になってしまうものもある。 The boron trioxide component contained in the boron nitride filler affects the curing reaction of the epoxy resin. For example, depending on the type of curing accelerator, the function as a curing accelerator may be suppressed, and it may be difficult to completely cure the epoxy resin even if a long curing time is provided.
しかし、本発明においては、上記に説明したように三酸化ホウ素成分の存在によって硬化反応が加速される三フッ化ホウ素系硬化促進剤が高熱伝導性樹脂層を形成する樹脂組成物に用いられていることから、むしろ、樹脂組成物中に窒化ホウ素フィラーをより高充填させることにより樹脂組成物中のエポキシ樹脂の硬化時間、すなわち、金属箔付高熱伝導接着シートの接着作業時間を短縮させることができる。
したがって、本実施形態の金属箔付高熱伝導接着シートにおいては、窒化ホウ素を樹脂組成物中により多く含有させて、金属箔付高熱伝導接着シートの接着作業性と、高熱伝導性樹脂層の熱伝導率とを同時に向上させ得るという優れた効果を奏する。
例えば、０．０１〜０．５％程度に三酸化ホウ素成分が含まれている窒化ホウ素フィラーを用いる場合であれば三フッ化ホウ素系硬化促進剤とともに高熱伝導性樹脂層中に、通常、体積で２５％以上の割合で充填させることで、優れた接着作業性を有する金属箔付高熱伝導接着シートとすることができ、５０％以上の割合で充填させることで、接着作業性とともに熱伝導性に優れた金属箔付高熱伝導接着シートとすることができる。また、重量で６５％以上の割合で充填させることで、さらに優れた熱伝導性と接着作業性を有する金属箔付高熱伝導接着シートとすることができる。
However, in the present invention, as described above, a boron trifluoride-based curing accelerator whose curing reaction is accelerated by the presence of the boron trioxide component is used in the resin composition for forming the high thermal conductive resin layer. Rather, it is possible to reduce the curing time of the epoxy resin in the resin composition, that is, the bonding work time of the high thermal conductive adhesive sheet with metal foil, by filling the resin composition with a higher amount of boron nitride filler. it can.
Therefore, in the high thermal conductive adhesive sheet with metal foil of this embodiment, more boron nitride is contained in the resin composition so that the bonding workability of the high thermal conductive adhesive sheet with metal foil and the thermal conductivity of the high thermal conductive resin layer are increased. It has an excellent effect that the rate can be improved at the same time.
For example, in the case of using a boron nitride filler containing a boron trioxide component in about 0.01 to 0.5%, a high volume of heat conductive resin layer together with a boron trifluoride-based curing accelerator is usually By filling at a rate of 25% or more, a highly heat conductive adhesive sheet with metal foil having excellent adhesion workability can be obtained. By filling at a rate of 50% or more, thermal conductivity as well as adhesion workability is achieved. It can be set as the highly heat-conductive adhesive sheet with metal foil excellent in. Moreover, it can be set as the highly heat-conductive adhesive sheet with metal foil which has the further outstanding heat conductivity and adhesive workability | operativity by making it fill in the ratio of 65% or more by weight.
なお、このような効果については、窒化ホウ素フィラーを用いた場合のみならず、三酸化ホウ素成分を含む無機フィラーが用いられる場合に共通して得られるものである。 Such an effect is commonly obtained not only when a boron nitride filler is used, but also when an inorganic filler containing a boron trioxide component is used.
本実施形態においては、熱硬化作業の短期化が特に求められており、本発明の効果をより顕著に発揮させ得る点から、本発明の樹脂組成物を、金属箔付高熱伝導接着シートの高熱伝導性樹脂層の形成に用いる場合を例に説明したが、本発明の樹脂組成物の用途は、金属箔付高熱伝導接着シートに限定されるものではない。 In the present embodiment, the shortening of the thermosetting operation is particularly required, and from the point that the effects of the present invention can be exhibited more remarkably, the resin composition of the present invention is heated to a high heat conductive adhesive sheet with a metal foil. Although the case where it used for formation of a conductive resin layer was demonstrated to the example, the use of the resin composition of this invention is not limited to the high heat conductive adhesive sheet with metal foil.
例えば、金属箔に代えて、３００μｍを超える厚さを有する金属板、例えば、数ｍｍ厚さのアルミニウム板や銅板などといった金属板層に高熱伝導性樹脂層が積層された金属板付高熱伝導接着シートなどにも本発明にかかる樹脂組成物を採用し得る。 For example, instead of metal foil, a metal plate having a thickness exceeding 300 μm, for example, a high heat conductive adhesive sheet with a metal plate in which a high heat conductive resin layer is laminated on a metal plate layer such as an aluminum plate or copper plate having a thickness of several mm For example, the resin composition according to the present invention may be employed.
また、本発明の樹脂組成物の用途は、この金属箔層や金属板層などの金属層と高熱伝導性樹脂層とが積層された金属層付高熱伝導接着シートに限定されるものでもなく、例えば、高熱伝導性樹脂層を単層あるいは複数積層させてシート状となした熱伝導性シートなどにも本発明の樹脂組成物を採用し得る。
すなわち、上記に例示の金属箔付高熱伝導接着シートの製造方法における電解銅箔に代えて、例えば、表面離型処理されたポリエチレンテレフタレート（ＰＥＴ）フィルムを用い、三酸化ホウ素成分を含む無機フィラーとエポキシ樹脂とを含む塗工液をこのＰＥＴフィルムにコーティングして乾燥を実施してＰＥＴフィルム上にシート状物を形成させて熱伝導シートを作製することができる。
また、このようにして形成されたシート状物を複数積層一体化させて厚みの厚い熱伝導シートを形成させることもできる。
さらに、本発明は、樹脂組成物の使用態様を、コーティングによるシート状物の形成に限定するものでもなく注型金型などを用いた成形加工などにも使用し得る。
In addition, the use of the resin composition of the present invention is not limited to the metal layer high heat conductive adhesive sheet in which the metal layer such as the metal foil layer or the metal plate layer and the high heat conductive resin layer are laminated, For example, the resin composition of the present invention can be used for a heat conductive sheet or the like in which a single layer or a plurality of highly heat conductive resin layers are laminated to form a sheet.
That is, instead of the electrolytic copper foil in the method for producing the high heat conductive adhesive sheet with metal foil exemplified above, for example, a polyethylene terephthalate (PET) film subjected to surface release treatment is used, and an inorganic filler containing a boron trioxide component and A coating liquid containing an epoxy resin can be coated on this PET film and dried to form a sheet-like material on the PET film to produce a heat conductive sheet.
Also, a plurality of sheet-like materials thus formed can be laminated and integrated to form a thick heat conductive sheet.
Furthermore, the present invention does not limit the use mode of the resin composition to the formation of a sheet-like material by coating, and can be used for molding processing using a casting mold or the like.
次に実施例を挙げて本発明をさらに詳しく説明するが、本発明はこれらに限定されるものではない。
（実施例１〜４、比較例１〜８）
（配合：樹脂組成物の作製）
表１に示す材料を表１に示す割合で溶剤に溶解させた樹脂組成物を作製した。
EXAMPLES Next, although an Example is given and this invention is demonstrated in more detail, this invention is not limited to these.
(Examples 1-4, Comparative Examples 1-8)
(Formulation: Preparation of resin composition)
A resin composition was prepared by dissolving the materials shown in Table 1 in a solvent at the ratio shown in Table 1.
（評価）
（ゲルタイムの測定）
得られた樹脂組成物を約１ｃｍ3、１４０℃に加熱された熱盤上に滴下し、この滴下された樹脂組成物をステンレス製スパチュラの先端で熱盤上に輪を描くように数秒に１回の割合で攪拌し、攪拌後にスパチュラの先端を熱盤表面から約１ｃｍ高さに持ち上げて樹脂組成物の糸引き状況を目視にて観察した。
このスパチュラの先端を持ち上げた際に糸引きを生じないか、あるいは、糸引きが生じてもすぐに切れてしまう状況となるまでに要する時間をゲルタイムとして測定した。
結果を、表２に示す。
(Evaluation)
(Measurement of gel time)
The obtained resin composition was dropped on a hot platen heated to about 1 cm 3 and 140 ° C., and the dropped resin composition was added to the hot platen at the tip of a stainless spatula at a rate of 1 every few seconds. After stirring, the tip of the spatula was lifted to a height of about 1 cm from the surface of the hot platen, and the stringing state of the resin composition was visually observed.
The gel time was measured as the time required for thread pulling not to occur when the tip of the spatula was lifted, or for a situation where it would break immediately even if thread pulling occurred.
The results are shown in Table 2.
この表２からも三フッ化ホウ素系硬化促進剤は、三酸化ホウ素成分存在下においてエポキシ樹脂の硬化時間を短縮させ得ることがわかる。 Table 2 also shows that the boron trifluoride-based curing accelerator can shorten the curing time of the epoxy resin in the presence of the boron trioxide component.
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