JPH0370736B2 - - Google Patents
Info
- Publication number
- JPH0370736B2 JPH0370736B2 JP57170751A JP17075182A JPH0370736B2 JP H0370736 B2 JPH0370736 B2 JP H0370736B2 JP 57170751 A JP57170751 A JP 57170751A JP 17075182 A JP17075182 A JP 17075182A JP H0370736 B2 JPH0370736 B2 JP H0370736B2
- Authority
- JP
- Japan
- Prior art keywords
- curing agent
- parts
- epoxy resin
- curing
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Polyurethanes Or Polyureas (AREA)
- Epoxy Resins (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57170751A JPS5959720A (ja) | 1982-09-29 | 1982-09-29 | 新規な一成分型エポキシ樹脂用硬化剤 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57170751A JPS5959720A (ja) | 1982-09-29 | 1982-09-29 | 新規な一成分型エポキシ樹脂用硬化剤 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5959720A JPS5959720A (ja) | 1984-04-05 |
JPH0370736B2 true JPH0370736B2 (enrdf_load_stackoverflow) | 1991-11-08 |
Family
ID=15910708
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57170751A Granted JPS5959720A (ja) | 1982-09-29 | 1982-09-29 | 新規な一成分型エポキシ樹脂用硬化剤 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5959720A (enrdf_load_stackoverflow) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61192722A (ja) * | 1985-02-21 | 1986-08-27 | Asahi Chem Ind Co Ltd | 硬化性組成物 |
JPS61190521A (ja) * | 1985-02-18 | 1986-08-25 | Asahi Chem Ind Co Ltd | エポキシ樹脂組成物 |
JPH066624B2 (ja) * | 1987-05-15 | 1994-01-26 | 三洋化成工業株式会社 | エポキシ樹脂硬化剤 |
US5001542A (en) * | 1988-12-05 | 1991-03-19 | Hitachi Chemical Company | Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips |
JP2688694B2 (ja) * | 1989-01-20 | 1997-12-10 | 旭化成工業株式会社 | コンデンサー封止用一液性エポキシ樹脂組成物 |
JPH0578444A (ja) * | 1991-09-19 | 1993-03-30 | Ajinomoto Co Inc | 液状酸無水物系一液性エポキシ樹脂組成物 |
WO2002092718A1 (en) | 2001-05-16 | 2002-11-21 | Sekisui Chemical Co., Ltd. | Curing resin composition and sealants and end-sealing materials for displays |
JP2007186547A (ja) * | 2006-01-11 | 2007-07-26 | Adeka Corp | エポキシ樹脂用硬化剤組成物および一成分系加熱硬化性エポキシ樹脂組成物 |
JP6331526B2 (ja) | 2014-03-14 | 2018-05-30 | オムロン株式会社 | 樹脂組成物およびその硬化物 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5883023A (ja) * | 1981-11-11 | 1983-05-18 | Taoka Chem Co Ltd | 硬化性組成物 |
-
1982
- 1982-09-29 JP JP57170751A patent/JPS5959720A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5959720A (ja) | 1984-04-05 |
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