JPH0368554B2 - - Google Patents
Info
- Publication number
- JPH0368554B2 JPH0368554B2 JP61262529A JP26252986A JPH0368554B2 JP H0368554 B2 JPH0368554 B2 JP H0368554B2 JP 61262529 A JP61262529 A JP 61262529A JP 26252986 A JP26252986 A JP 26252986A JP H0368554 B2 JPH0368554 B2 JP H0368554B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- printed circuit
- cavity
- mold
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26252986A JPS63164294A (ja) | 1986-11-04 | 1986-11-04 | プリント回路基板の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26252986A JPS63164294A (ja) | 1986-11-04 | 1986-11-04 | プリント回路基板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63164294A JPS63164294A (ja) | 1988-07-07 |
JPH0368554B2 true JPH0368554B2 (c_deeref_Disk_and_Scratch_Disk_Pools_and_Their_Defaults.html) | 1991-10-28 |
Family
ID=17377062
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP26252986A Granted JPS63164294A (ja) | 1986-11-04 | 1986-11-04 | プリント回路基板の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63164294A (c_deeref_Disk_and_Scratch_Disk_Pools_and_Their_Defaults.html) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4944087A (en) * | 1988-10-05 | 1990-07-31 | Rogers Corporation | Method of making a curved plastic body with circuit pattern |
JPH10163660A (ja) * | 1996-11-29 | 1998-06-19 | Hitachi Ltd | 空冷電子機器装置 |
JP3552559B2 (ja) * | 1998-03-11 | 2004-08-11 | 株式会社デンソー | 発熱体冷却装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61102093A (ja) * | 1984-10-25 | 1986-05-20 | シャープ株式会社 | プリント基板の製造方法 |
-
1986
- 1986-11-04 JP JP26252986A patent/JPS63164294A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS63164294A (ja) | 1988-07-07 |