JPH0365662B2 - - Google Patents

Info

Publication number
JPH0365662B2
JPH0365662B2 JP59128918A JP12891884A JPH0365662B2 JP H0365662 B2 JPH0365662 B2 JP H0365662B2 JP 59128918 A JP59128918 A JP 59128918A JP 12891884 A JP12891884 A JP 12891884A JP H0365662 B2 JPH0365662 B2 JP H0365662B2
Authority
JP
Japan
Prior art keywords
wiring
bonding pad
seal ring
chip
embedded wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59128918A
Other languages
English (en)
Japanese (ja)
Other versions
JPS617656A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP59128918A priority Critical patent/JPS617656A/ja
Publication of JPS617656A publication Critical patent/JPS617656A/ja
Publication of JPH0365662B2 publication Critical patent/JPH0365662B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W76/60—
    • H10W70/611—
    • H10W70/685—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/884—
    • H10W90/734—
    • H10W90/754—

Landscapes

  • Wire Bonding (AREA)
JP59128918A 1984-06-22 1984-06-22 マルチチップパッケ−ジ Granted JPS617656A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59128918A JPS617656A (ja) 1984-06-22 1984-06-22 マルチチップパッケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59128918A JPS617656A (ja) 1984-06-22 1984-06-22 マルチチップパッケ−ジ

Publications (2)

Publication Number Publication Date
JPS617656A JPS617656A (ja) 1986-01-14
JPH0365662B2 true JPH0365662B2 (cg-RX-API-DMAC10.html) 1991-10-14

Family

ID=14996590

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59128918A Granted JPS617656A (ja) 1984-06-22 1984-06-22 マルチチップパッケ−ジ

Country Status (1)

Country Link
JP (1) JPS617656A (cg-RX-API-DMAC10.html)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03211757A (ja) * 1989-12-21 1991-09-17 General Electric Co <Ge> 気密封じの物体
JPH03113852U (cg-RX-API-DMAC10.html) * 1990-03-09 1991-11-21
JP2960560B2 (ja) * 1991-02-28 1999-10-06 株式会社日立製作所 超小型電子機器
EP0547807A3 (en) * 1991-12-16 1993-09-22 General Electric Company Packaged electronic system
US5280413A (en) * 1992-09-17 1994-01-18 Ceridian Corporation Hermetically sealed circuit modules having conductive cap anchors
US8072066B2 (en) * 2004-06-04 2011-12-06 Omnivision Technologies, Inc. Metal interconnects for integrated circuit die comprising non-oxidizing portions extending outside seal ring

Also Published As

Publication number Publication date
JPS617656A (ja) 1986-01-14

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term