JPH0365242U - - Google Patents

Info

Publication number
JPH0365242U
JPH0365242U JP12769789U JP12769789U JPH0365242U JP H0365242 U JPH0365242 U JP H0365242U JP 12769789 U JP12769789 U JP 12769789U JP 12769789 U JP12769789 U JP 12769789U JP H0365242 U JPH0365242 U JP H0365242U
Authority
JP
Japan
Prior art keywords
lead
die bond
semiconductor
semiconductor pellet
detecting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12769789U
Other languages
English (en)
Other versions
JPH083016Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12769789U priority Critical patent/JPH083016Y2/ja
Publication of JPH0365242U publication Critical patent/JPH0365242U/ja
Application granted granted Critical
Publication of JPH083016Y2 publication Critical patent/JPH083016Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案による半導体用リードフレーム
の１実施例における略線的拡大平面図、第２図は
従来の半導体用リードフレームの略線的拡大平面
図である。 １はダイボンド部、２はコーナー部、３はリー
ド導出部、４は位置検出用光反射層、４ｘ及び４
ｙは縁部、５はリード先端部、６はリード、７は
枠体、１０はリードフレームである。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体ペレツトのダイボンド部のコーナー部に
    、上記ダイボンド部のリード導出部から離間した
    位置に限定的に半導体ペレツトのダイボンド位置
    検出用光反射層を設けて成る半導体用リードフレ
    ーム。
JP12769789U 1989-10-31 1989-10-31 半導体用リードフレーム Expired - Fee Related JPH083016Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12769789U JPH083016Y2 (ja) 1989-10-31 1989-10-31 半導体用リードフレーム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12769789U JPH083016Y2 (ja) 1989-10-31 1989-10-31 半導体用リードフレーム

Publications (2)

Publication Number Publication Date
JPH0365242U true JPH0365242U (ja) 1991-06-25
JPH083016Y2 JPH083016Y2 (ja) 1996-01-29

Family

ID=31675444

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12769789U Expired - Fee Related JPH083016Y2 (ja) 1989-10-31 1989-10-31 半導体用リードフレーム

Country Status (1)

Country Link
JP (1) JPH083016Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009032899A (ja) * 2007-07-27 2009-02-12 Renesas Technology Corp 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009032899A (ja) * 2007-07-27 2009-02-12 Renesas Technology Corp 半導体装置

Also Published As

Publication number Publication date
JPH083016Y2 (ja) 1996-01-29

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees