JPH0365016B2 - - Google Patents

Info

Publication number
JPH0365016B2
JPH0365016B2 JP57113253A JP11325382A JPH0365016B2 JP H0365016 B2 JPH0365016 B2 JP H0365016B2 JP 57113253 A JP57113253 A JP 57113253A JP 11325382 A JP11325382 A JP 11325382A JP H0365016 B2 JPH0365016 B2 JP H0365016B2
Authority
JP
Japan
Prior art keywords
electrode
via hole
semiconductor substrate
capacitor
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57113253A
Other languages
English (en)
Japanese (ja)
Other versions
JPS594175A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP57113253A priority Critical patent/JPS594175A/ja
Priority to EP19830303769 priority patent/EP0098167B1/en
Priority to DE8383303769T priority patent/DE3377960D1/de
Publication of JPS594175A publication Critical patent/JPS594175A/ja
Priority to US07/105,472 priority patent/US4751562A/en
Publication of JPH0365016B2 publication Critical patent/JPH0365016B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76898Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/481Internal lead connections, e.g. via connections, feedthrough structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/58Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64Impedance arrangements
    • H01L23/642Capacitive arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/06Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
    • H01L27/0688Integrated circuits having a three-dimensional layout
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/80Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015Shape
    • H01L2924/10155Shape being other than a cuboid
    • H01L2924/10158Shape being other than a cuboid at the passive surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP57113253A 1982-06-30 1982-06-30 電界効果半導体装置 Granted JPS594175A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP57113253A JPS594175A (ja) 1982-06-30 1982-06-30 電界効果半導体装置
EP19830303769 EP0098167B1 (en) 1982-06-30 1983-06-29 A field-effect semiconductor device
DE8383303769T DE3377960D1 (en) 1982-06-30 1983-06-29 A field-effect semiconductor device
US07/105,472 US4751562A (en) 1982-06-30 1987-09-30 Field-effect semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57113253A JPS594175A (ja) 1982-06-30 1982-06-30 電界効果半導体装置

Publications (2)

Publication Number Publication Date
JPS594175A JPS594175A (ja) 1984-01-10
JPH0365016B2 true JPH0365016B2 (US06534493-20030318-C00166.png) 1991-10-09

Family

ID=14607458

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57113253A Granted JPS594175A (ja) 1982-06-30 1982-06-30 電界効果半導体装置

Country Status (2)

Country Link
US (1) US4751562A (US06534493-20030318-C00166.png)
JP (1) JPS594175A (US06534493-20030318-C00166.png)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4807022A (en) * 1987-05-01 1989-02-21 Raytheon Company Simultaneous formation of via hole and tub structures for GaAs monolithic microwave integrated circuits
US4970578A (en) * 1987-05-01 1990-11-13 Raytheon Company Selective backside plating of GaAs monolithic microwave integrated circuits
JPH0273664A (ja) * 1988-09-08 1990-03-13 Nec Corp 電界効果トランジスタ
US4937660A (en) * 1988-12-21 1990-06-26 At&T Bell Laboratories Silicon-based mounting structure for semiconductor optical devices
JPH02257643A (ja) * 1989-03-29 1990-10-18 Mitsubishi Electric Corp 半導体装置及びその製造方法
US4974039A (en) * 1989-08-14 1990-11-27 Raytheon Company Field effect transistor having an integrated capacitor
US5319237A (en) * 1990-03-09 1994-06-07 Thomson Composants Microondes Power semiconductor component
FR2697698A1 (fr) * 1992-11-04 1994-05-06 Philips Electronique Lab Dispositif semiconducteur comprenant un circuit amplificateur distribué monolithiquement intégré, à large bande et fort gain.
DE19851458C2 (de) * 1998-11-09 2000-11-16 Bosch Gmbh Robert Monolithisch integrierte Schaltung mit mehreren, einen Nebenschluß nach Masse bildenden Kapazitäten und Verstärkerschaltung
CA2342175A1 (en) * 1999-06-30 2001-01-11 Kazuhiko Nakahara Microwave amplifier
EP1085572A3 (en) * 1999-09-16 2006-04-19 Texas Instruments Incorporated Low pass filter integral with semiconductor package
US6538300B1 (en) * 2000-09-14 2003-03-25 Vishay Intertechnology, Inc. Precision high-frequency capacitor formed on semiconductor substrate
US7151036B1 (en) * 2002-07-29 2006-12-19 Vishay-Siliconix Precision high-frequency capacitor formed on semiconductor substrate
WO2004064159A1 (ja) * 2003-01-15 2004-07-29 Fujitsu Limited 半導体装置及び三次元実装半導体装置、並びに半導体装置の製造方法
US7199039B2 (en) * 2003-05-19 2007-04-03 Intel Corporation Interconnect routing over semiconductor for editing through the back side of an integrated circuit
US20050034075A1 (en) * 2003-06-05 2005-02-10 Ch2M Hill, Inc. GIS-based emergency management
JP4353861B2 (ja) 2004-06-30 2009-10-28 Necエレクトロニクス株式会社 半導体装置
FI20051236A0 (fi) * 2005-12-01 2005-12-01 Artto Mikael Aurola Puolijohde apparaatti
US7557036B2 (en) * 2006-03-30 2009-07-07 Intel Corporation Method, system, and apparatus for filling vias
CN101473433B (zh) * 2006-06-20 2011-12-07 Nxp股份有限公司 功率放大器装置
KR101096041B1 (ko) * 2009-12-10 2011-12-19 주식회사 하이닉스반도체 반도체 패키지

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57104265A (en) * 1980-12-19 1982-06-29 Fujitsu Ltd Semiconductor device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3969745A (en) * 1974-09-18 1976-07-13 Texas Instruments Incorporated Interconnection in multi element planar structures
US3986196A (en) * 1975-06-30 1976-10-12 Varian Associates Through-substrate source contact for microwave FET
US4183041A (en) * 1978-06-26 1980-01-08 Rca Corporation Self biasing of a field effect transistor mounted in a flip-chip carrier
US4456888A (en) * 1981-03-26 1984-06-26 Raytheon Company Radio frequency network having plural electrically interconnected field effect transistor cells

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57104265A (en) * 1980-12-19 1982-06-29 Fujitsu Ltd Semiconductor device

Also Published As

Publication number Publication date
US4751562A (en) 1988-06-14
JPS594175A (ja) 1984-01-10

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