JPH0362037B2 - - Google Patents
Info
- Publication number
- JPH0362037B2 JPH0362037B2 JP58143748A JP14374883A JPH0362037B2 JP H0362037 B2 JPH0362037 B2 JP H0362037B2 JP 58143748 A JP58143748 A JP 58143748A JP 14374883 A JP14374883 A JP 14374883A JP H0362037 B2 JPH0362037 B2 JP H0362037B2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- mold
- wiring board
- multilayer printed
- stepped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000003475 lamination Methods 0.000 claims description 22
- 239000000853 adhesive Substances 0.000 claims description 14
- 230000001070 adhesive effect Effects 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 13
- 238000010030 laminating Methods 0.000 claims description 11
- 238000003780 insertion Methods 0.000 claims description 7
- 230000037431 insertion Effects 0.000 claims description 7
- 239000011888 foil Substances 0.000 claims description 6
- 229920003002 synthetic resin Polymers 0.000 claims description 6
- 239000000057 synthetic resin Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000007796 conventional method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58143748A JPS6035596A (ja) | 1983-08-08 | 1983-08-08 | 多層印刷配線板の積層接着用金型 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58143748A JPS6035596A (ja) | 1983-08-08 | 1983-08-08 | 多層印刷配線板の積層接着用金型 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6035596A JPS6035596A (ja) | 1985-02-23 |
| JPH0362037B2 true JPH0362037B2 (enrdf_load_stackoverflow) | 1991-09-24 |
Family
ID=15346094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58143748A Granted JPS6035596A (ja) | 1983-08-08 | 1983-08-08 | 多層印刷配線板の積層接着用金型 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6035596A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6313395A (ja) * | 1986-07-03 | 1988-01-20 | 日本電気株式会社 | 多層印刷配線板の製造方法 |
| JP2006202957A (ja) * | 2005-01-20 | 2006-08-03 | Shinko Seisakusho:Kk | 補強板付きプリント配線板の製造方法 |
-
1983
- 1983-08-08 JP JP58143748A patent/JPS6035596A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6035596A (ja) | 1985-02-23 |