JPH0357624B2 - - Google Patents
Info
- Publication number
- JPH0357624B2 JPH0357624B2 JP1614089A JP1614089A JPH0357624B2 JP H0357624 B2 JPH0357624 B2 JP H0357624B2 JP 1614089 A JP1614089 A JP 1614089A JP 1614089 A JP1614089 A JP 1614089A JP H0357624 B2 JPH0357624 B2 JP H0357624B2
- Authority
- JP
- Japan
- Prior art keywords
- outer frame
- frame
- resin
- electronic device
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 25
- 229920005989 resin Polymers 0.000 claims description 25
- 238000000465 moulding Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- 238000005520 cutting process Methods 0.000 claims description 6
- 238000005192 partition Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 6
- 238000005259 measurement Methods 0.000 description 5
- 239000008188 pellet Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 235000016496 Panda oleosa Nutrition 0.000 description 1
- 240000000220 Panda oleosa Species 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1614089A JPH01230263A (ja) | 1989-01-27 | 1989-01-27 | 電子装置の組立方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1614089A JPH01230263A (ja) | 1989-01-27 | 1989-01-27 | 電子装置の組立方法 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6392887A Division JPS62252959A (ja) | 1987-03-20 | 1987-03-20 | リ−ドフレ−ム |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01230263A JPH01230263A (ja) | 1989-09-13 |
JPH0357624B2 true JPH0357624B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1991-09-02 |
Family
ID=11908194
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1614089A Granted JPH01230263A (ja) | 1989-01-27 | 1989-01-27 | 電子装置の組立方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01230263A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6743802B2 (ja) * | 2017-11-22 | 2020-08-19 | Tdk株式会社 | 半導体装置 |
-
1989
- 1989-01-27 JP JP1614089A patent/JPH01230263A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH01230263A (ja) | 1989-09-13 |