JPH0354875B2 - - Google Patents

Info

Publication number
JPH0354875B2
JPH0354875B2 JP59115263A JP11526384A JPH0354875B2 JP H0354875 B2 JPH0354875 B2 JP H0354875B2 JP 59115263 A JP59115263 A JP 59115263A JP 11526384 A JP11526384 A JP 11526384A JP H0354875 B2 JPH0354875 B2 JP H0354875B2
Authority
JP
Japan
Prior art keywords
layer material
fluorocarbon resin
inner layer
printed wiring
multilayer printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59115263A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60257592A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11526384A priority Critical patent/JPS60257592A/ja
Publication of JPS60257592A publication Critical patent/JPS60257592A/ja
Publication of JPH0354875B2 publication Critical patent/JPH0354875B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP11526384A 1984-06-04 1984-06-04 多層プリント配線板 Granted JPS60257592A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11526384A JPS60257592A (ja) 1984-06-04 1984-06-04 多層プリント配線板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11526384A JPS60257592A (ja) 1984-06-04 1984-06-04 多層プリント配線板

Publications (2)

Publication Number Publication Date
JPS60257592A JPS60257592A (ja) 1985-12-19
JPH0354875B2 true JPH0354875B2 (cs) 1991-08-21

Family

ID=14658338

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11526384A Granted JPS60257592A (ja) 1984-06-04 1984-06-04 多層プリント配線板

Country Status (1)

Country Link
JP (1) JPS60257592A (cs)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62285498A (ja) * 1986-06-03 1987-12-11 松下電工株式会社 多層プリント配線基板
JPH0815235B2 (ja) * 1986-06-14 1996-02-14 松下電工株式会社 多層プリント配線板
JPH07120858B2 (ja) * 1990-03-30 1995-12-20 株式会社日立製作所 多層プリント回路板およびその製造方法
JPH0818403B2 (ja) * 1993-06-03 1996-02-28 日本ピラー工業株式会社 積層板および積層板用未焼結複合フィルム
GB0703172D0 (en) 2007-02-19 2007-03-28 Pa Knowledge Ltd Printed circuit boards
BRPI0917289A8 (pt) 2008-08-18 2019-09-17 Semblant Global Ltd revestimento polimérico de halo-hidrocarboneto
US8995146B2 (en) 2010-02-23 2015-03-31 Semblant Limited Electrical assembly and method
GB201621177D0 (en) 2016-12-13 2017-01-25 Semblant Ltd Protective coating

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5745997A (en) * 1980-09-02 1982-03-16 Matsushita Electric Works Ltd Multilayer printed circuit board
JPS57150567A (en) * 1981-03-13 1982-09-17 Hitachi Cable Copper lined laminated board
JPS5846691A (ja) * 1981-09-14 1983-03-18 東レ株式会社 高周波用電気回路基板およびその製造法

Also Published As

Publication number Publication date
JPS60257592A (ja) 1985-12-19

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