JPH0354863B2 - - Google Patents

Info

Publication number
JPH0354863B2
JPH0354863B2 JP11705384A JP11705384A JPH0354863B2 JP H0354863 B2 JPH0354863 B2 JP H0354863B2 JP 11705384 A JP11705384 A JP 11705384A JP 11705384 A JP11705384 A JP 11705384A JP H0354863 B2 JPH0354863 B2 JP H0354863B2
Authority
JP
Japan
Prior art keywords
transistor
hole
holes
view
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP11705384A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60261159A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11705384A priority Critical patent/JPS60261159A/ja
Publication of JPS60261159A publication Critical patent/JPS60261159A/ja
Publication of JPH0354863B2 publication Critical patent/JPH0354863B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Microwave Amplifiers (AREA)
JP11705384A 1984-06-07 1984-06-07 マイクロ波回路装置 Granted JPS60261159A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11705384A JPS60261159A (ja) 1984-06-07 1984-06-07 マイクロ波回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11705384A JPS60261159A (ja) 1984-06-07 1984-06-07 マイクロ波回路装置

Publications (2)

Publication Number Publication Date
JPS60261159A JPS60261159A (ja) 1985-12-24
JPH0354863B2 true JPH0354863B2 (ar) 1991-08-21

Family

ID=14702254

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11705384A Granted JPS60261159A (ja) 1984-06-07 1984-06-07 マイクロ波回路装置

Country Status (1)

Country Link
JP (1) JPS60261159A (ar)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1013110A (ja) * 1996-06-25 1998-01-16 Murata Mfg Co Ltd 非可逆回路素子

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2661570B2 (ja) * 1994-12-14 1997-10-08 日本電気株式会社 高周波装置
JP2891299B2 (ja) * 1997-05-02 1999-05-17 日本電気株式会社 半導体マイクロ波増幅器
JP7364364B2 (ja) * 2019-06-18 2023-10-18 矢崎総業株式会社 増幅回路基板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1013110A (ja) * 1996-06-25 1998-01-16 Murata Mfg Co Ltd 非可逆回路素子

Also Published As

Publication number Publication date
JPS60261159A (ja) 1985-12-24

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