JPH0354472B2 - - Google Patents

Info

Publication number
JPH0354472B2
JPH0354472B2 JP58141631A JP14163183A JPH0354472B2 JP H0354472 B2 JPH0354472 B2 JP H0354472B2 JP 58141631 A JP58141631 A JP 58141631A JP 14163183 A JP14163183 A JP 14163183A JP H0354472 B2 JPH0354472 B2 JP H0354472B2
Authority
JP
Japan
Prior art keywords
conduit
integrated circuit
cooling
heat sink
sectional
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58141631A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6032349A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP58141631A priority Critical patent/JPS6032349A/ja
Publication of JPS6032349A publication Critical patent/JPS6032349A/ja
Publication of JPH0354472B2 publication Critical patent/JPH0354472B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4338—Pistons, e.g. spring-loaded members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP58141631A 1983-08-02 1983-08-02 集積回路パツケ−ジの冷却構造 Granted JPS6032349A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58141631A JPS6032349A (ja) 1983-08-02 1983-08-02 集積回路パツケ−ジの冷却構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58141631A JPS6032349A (ja) 1983-08-02 1983-08-02 集積回路パツケ−ジの冷却構造

Publications (2)

Publication Number Publication Date
JPS6032349A JPS6032349A (ja) 1985-02-19
JPH0354472B2 true JPH0354472B2 (cs) 1991-08-20

Family

ID=15296527

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58141631A Granted JPS6032349A (ja) 1983-08-02 1983-08-02 集積回路パツケ−ジの冷却構造

Country Status (1)

Country Link
JP (1) JPS6032349A (cs)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2716129B2 (ja) * 1987-07-24 1998-02-18 日本電気株式会社 集積回路の冷却構造
JP2786193B2 (ja) * 1987-10-26 1998-08-13 株式会社日立製作所 半導体冷却装置
JPH036848A (ja) * 1989-06-03 1991-01-14 Hitachi Ltd 半導体冷却モジュール
US6665180B2 (en) 2001-06-22 2003-12-16 International Business Machines Corporation System for cooling a component in a computer system
JP4682938B2 (ja) * 2006-07-07 2011-05-11 株式会社デンソー 積層型冷却器

Also Published As

Publication number Publication date
JPS6032349A (ja) 1985-02-19

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