JPH0351315B2 - - Google Patents

Info

Publication number
JPH0351315B2
JPH0351315B2 JP29014885A JP29014885A JPH0351315B2 JP H0351315 B2 JPH0351315 B2 JP H0351315B2 JP 29014885 A JP29014885 A JP 29014885A JP 29014885 A JP29014885 A JP 29014885A JP H0351315 B2 JPH0351315 B2 JP H0351315B2
Authority
JP
Japan
Prior art keywords
ceramic
printed
wet
bent
multilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP29014885A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62149189A (ja
Inventor
Ryuji Tanaka
Yukyoshi Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP29014885A priority Critical patent/JPS62149189A/ja
Publication of JPS62149189A publication Critical patent/JPS62149189A/ja
Publication of JPH0351315B2 publication Critical patent/JPH0351315B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
JP29014885A 1985-12-23 1985-12-23 セラミツク湿式印刷多層基板 Granted JPS62149189A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29014885A JPS62149189A (ja) 1985-12-23 1985-12-23 セラミツク湿式印刷多層基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29014885A JPS62149189A (ja) 1985-12-23 1985-12-23 セラミツク湿式印刷多層基板

Publications (2)

Publication Number Publication Date
JPS62149189A JPS62149189A (ja) 1987-07-03
JPH0351315B2 true JPH0351315B2 (cg-RX-API-DMAC7.html) 1991-08-06

Family

ID=17752397

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29014885A Granted JPS62149189A (ja) 1985-12-23 1985-12-23 セラミツク湿式印刷多層基板

Country Status (1)

Country Link
JP (1) JPS62149189A (cg-RX-API-DMAC7.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6450592A (en) * 1987-08-21 1989-02-27 Shinko Chem Super-heat dissipation type composite circuit board
US5028473A (en) * 1989-10-02 1991-07-02 Hughes Aircraft Company Three dimensional microcircuit structure and process for fabricating the same from ceramic tape
WO2015194434A1 (ja) * 2014-06-20 2015-12-23 株式会社村田製作所 樹脂多層基板

Also Published As

Publication number Publication date
JPS62149189A (ja) 1987-07-03

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