JPH0351119B2 - - Google Patents
Info
- Publication number
- JPH0351119B2 JPH0351119B2 JP57227221A JP22722182A JPH0351119B2 JP H0351119 B2 JPH0351119 B2 JP H0351119B2 JP 57227221 A JP57227221 A JP 57227221A JP 22722182 A JP22722182 A JP 22722182A JP H0351119 B2 JPH0351119 B2 JP H0351119B2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- plate
- ceramic
- metal plate
- component mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 claims description 52
- 239000002184 metal Substances 0.000 claims description 52
- 239000000919 ceramic Substances 0.000 claims description 34
- 239000000758 substrate Substances 0.000 claims description 11
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000013078 crystal Substances 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
- Laminated Bodies (AREA)
- Ceramic Products (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22722182A JPS59121890A (ja) | 1982-12-28 | 1982-12-28 | セラミツクスと金属との接合体 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22722182A JPS59121890A (ja) | 1982-12-28 | 1982-12-28 | セラミツクスと金属との接合体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59121890A JPS59121890A (ja) | 1984-07-14 |
JPH0351119B2 true JPH0351119B2 (US20090163788A1-20090625-C00002.png) | 1991-08-05 |
Family
ID=16857389
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22722182A Granted JPS59121890A (ja) | 1982-12-28 | 1982-12-28 | セラミツクスと金属との接合体 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59121890A (US20090163788A1-20090625-C00002.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07309688A (ja) * | 1994-05-18 | 1995-11-28 | Denki Kagaku Kogyo Kk | 絶縁放熱板 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0649622B2 (ja) * | 1987-08-28 | 1994-06-29 | 株式会社東芝 | セラミックスと金属の接合方法 |
JPS6459986A (en) * | 1987-08-31 | 1989-03-07 | Toshiba Corp | Ceramic circuit board |
JPH0723964Y2 (ja) * | 1988-11-11 | 1995-05-31 | 三菱マテリアル株式会社 | 半導体装置用軽量基板 |
US5100740A (en) * | 1989-09-25 | 1992-03-31 | General Electric Company | Direct bonded symmetric-metallic-laminate/substrate structures |
JP3011433B2 (ja) * | 1990-05-25 | 2000-02-21 | 株式会社東芝 | セラミックス回路基板の製造方法 |
JP2642574B2 (ja) * | 1992-12-17 | 1997-08-20 | 同和鉱業株式会社 | セラミックス電子回路基板の製造方法 |
JP2918191B2 (ja) | 1994-04-11 | 1999-07-12 | 同和鉱業株式会社 | 金属−セラミックス複合部材の製造方法 |
US5965193A (en) * | 1994-04-11 | 1999-10-12 | Dowa Mining Co., Ltd. | Process for preparing a ceramic electronic circuit board and process for preparing aluminum or aluminum alloy bonded ceramic material |
JP2007165600A (ja) * | 2005-12-14 | 2007-06-28 | Omron Corp | パワーモジュール構造及びこれを用いたソリッドステートリレー |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5443576A (en) * | 1977-09-12 | 1979-04-06 | Fujitsu Ltd | Method of manufacturing printed board |
-
1982
- 1982-12-28 JP JP22722182A patent/JPS59121890A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5443576A (en) * | 1977-09-12 | 1979-04-06 | Fujitsu Ltd | Method of manufacturing printed board |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07309688A (ja) * | 1994-05-18 | 1995-11-28 | Denki Kagaku Kogyo Kk | 絶縁放熱板 |
Also Published As
Publication number | Publication date |
---|---|
JPS59121890A (ja) | 1984-07-14 |
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