JPH0351119B2 - - Google Patents

Info

Publication number
JPH0351119B2
JPH0351119B2 JP57227221A JP22722182A JPH0351119B2 JP H0351119 B2 JPH0351119 B2 JP H0351119B2 JP 57227221 A JP57227221 A JP 57227221A JP 22722182 A JP22722182 A JP 22722182A JP H0351119 B2 JPH0351119 B2 JP H0351119B2
Authority
JP
Japan
Prior art keywords
metal
plate
ceramic
metal plate
component mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57227221A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59121890A (ja
Inventor
Nobuyuki Mizunoya
Hajime Kohama
Yasuyuki Sugiura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP22722182A priority Critical patent/JPS59121890A/ja
Publication of JPS59121890A publication Critical patent/JPS59121890A/ja
Publication of JPH0351119B2 publication Critical patent/JPH0351119B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

Landscapes

  • Pressure Welding/Diffusion-Bonding (AREA)
  • Laminated Bodies (AREA)
  • Ceramic Products (AREA)
  • Structure Of Printed Boards (AREA)
JP22722182A 1982-12-28 1982-12-28 セラミツクスと金属との接合体 Granted JPS59121890A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22722182A JPS59121890A (ja) 1982-12-28 1982-12-28 セラミツクスと金属との接合体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22722182A JPS59121890A (ja) 1982-12-28 1982-12-28 セラミツクスと金属との接合体

Publications (2)

Publication Number Publication Date
JPS59121890A JPS59121890A (ja) 1984-07-14
JPH0351119B2 true JPH0351119B2 (US20090163788A1-20090625-C00002.png) 1991-08-05

Family

ID=16857389

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22722182A Granted JPS59121890A (ja) 1982-12-28 1982-12-28 セラミツクスと金属との接合体

Country Status (1)

Country Link
JP (1) JPS59121890A (US20090163788A1-20090625-C00002.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07309688A (ja) * 1994-05-18 1995-11-28 Denki Kagaku Kogyo Kk 絶縁放熱板

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0649622B2 (ja) * 1987-08-28 1994-06-29 株式会社東芝 セラミックスと金属の接合方法
JPS6459986A (en) * 1987-08-31 1989-03-07 Toshiba Corp Ceramic circuit board
JPH0723964Y2 (ja) * 1988-11-11 1995-05-31 三菱マテリアル株式会社 半導体装置用軽量基板
US5100740A (en) * 1989-09-25 1992-03-31 General Electric Company Direct bonded symmetric-metallic-laminate/substrate structures
JP3011433B2 (ja) * 1990-05-25 2000-02-21 株式会社東芝 セラミックス回路基板の製造方法
JP2642574B2 (ja) * 1992-12-17 1997-08-20 同和鉱業株式会社 セラミックス電子回路基板の製造方法
JP2918191B2 (ja) 1994-04-11 1999-07-12 同和鉱業株式会社 金属−セラミックス複合部材の製造方法
US5965193A (en) * 1994-04-11 1999-10-12 Dowa Mining Co., Ltd. Process for preparing a ceramic electronic circuit board and process for preparing aluminum or aluminum alloy bonded ceramic material
JP2007165600A (ja) * 2005-12-14 2007-06-28 Omron Corp パワーモジュール構造及びこれを用いたソリッドステートリレー

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5443576A (en) * 1977-09-12 1979-04-06 Fujitsu Ltd Method of manufacturing printed board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5443576A (en) * 1977-09-12 1979-04-06 Fujitsu Ltd Method of manufacturing printed board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07309688A (ja) * 1994-05-18 1995-11-28 Denki Kagaku Kogyo Kk 絶縁放熱板

Also Published As

Publication number Publication date
JPS59121890A (ja) 1984-07-14

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