JPH0345455B2 - - Google Patents

Info

Publication number
JPH0345455B2
JPH0345455B2 JP59146170A JP14617084A JPH0345455B2 JP H0345455 B2 JPH0345455 B2 JP H0345455B2 JP 59146170 A JP59146170 A JP 59146170A JP 14617084 A JP14617084 A JP 14617084A JP H0345455 B2 JPH0345455 B2 JP H0345455B2
Authority
JP
Japan
Prior art keywords
processing
substrate
chamber
workpiece
substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP59146170A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6040532A (ja
Inventor
Donald Rex Boys
Walter Edgar Graves
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Varian Medical Systems Inc
Original Assignee
Varian Associates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Varian Associates Inc filed Critical Varian Associates Inc
Publication of JPS6040532A publication Critical patent/JPS6040532A/ja
Publication of JPH0345455B2 publication Critical patent/JPH0345455B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • H10P72/00—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y10S414/138—Wafers positioned vertically within cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP59146170A 1983-07-19 1984-07-16 デイスク又はウエ−ハ取り扱い及びコ−テイング装置 Granted JPS6040532A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/515,247 US4500407A (en) 1983-07-19 1983-07-19 Disk or wafer handling and coating system
US515,247 1983-07-19

Publications (2)

Publication Number Publication Date
JPS6040532A JPS6040532A (ja) 1985-03-02
JPH0345455B2 true JPH0345455B2 (cg-RX-API-DMAC10.html) 1991-07-11

Family

ID=24050563

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59146170A Granted JPS6040532A (ja) 1983-07-19 1984-07-16 デイスク又はウエ−ハ取り扱い及びコ−テイング装置

Country Status (7)

Country Link
US (1) US4500407A (cg-RX-API-DMAC10.html)
JP (1) JPS6040532A (cg-RX-API-DMAC10.html)
CA (1) CA1214326A (cg-RX-API-DMAC10.html)
DE (1) DE3425267C2 (cg-RX-API-DMAC10.html)
FR (1) FR2549454B1 (cg-RX-API-DMAC10.html)
GB (2) GB2143546B (cg-RX-API-DMAC10.html)
NL (1) NL8402287A (cg-RX-API-DMAC10.html)

Families Citing this family (88)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4715392A (en) * 1983-11-10 1987-12-29 Nippon Kogaku K. K. Automatic photomask or reticle washing and cleaning system
DE3448599B4 (de) * 1983-11-28 2004-04-08 Hitachi, Ltd. Verfahren zur Durchführung einer Behandlung unter Vakuum
GB8332394D0 (en) * 1983-12-05 1984-01-11 Pilkington Brothers Plc Coating apparatus
US4522697A (en) * 1983-12-22 1985-06-11 Sputtered Films, Inc. Wafer processing machine
US4523985A (en) * 1983-12-22 1985-06-18 Sputtered Films, Inc. Wafer processing machine
US4801241A (en) * 1984-03-09 1989-01-31 Tegal Corporation Modular article processing machine and method of article handling therein
US4604020A (en) * 1984-03-26 1986-08-05 Nanometrics Incorporated Integrated circuit wafer handling system
DE3413001A1 (de) * 1984-04-06 1985-10-17 Leybold-Heraeus GmbH, 5000 Köln Katodenzerstaeubungsanlage mit nebeneinander angeordneten stationen
US4558984A (en) * 1984-05-18 1985-12-17 Varian Associates, Inc. Wafer lifting and holding apparatus
US4611966A (en) * 1984-05-30 1986-09-16 Johnson Lester R Apparatus for transferring semiconductor wafers
US4735701A (en) * 1984-08-21 1988-04-05 Komag, Inc. Disk carrier
US4634512A (en) * 1984-08-21 1987-01-06 Komag, Inc. Disk and plug
US4595481A (en) * 1984-08-21 1986-06-17 Komag, Inc. Disk carrier
US4790921A (en) * 1984-10-12 1988-12-13 Hewlett-Packard Company Planetary substrate carrier method and apparatus
US4663009A (en) * 1985-02-08 1987-05-05 Hewlett-Packard Company System and method for depositing plural thin film layers on a substrate
US4749465A (en) * 1985-05-09 1988-06-07 Seagate Technology In-line disk sputtering system
JPS62502846A (ja) * 1985-05-09 1987-11-12 シ−ゲイト・テクノロジ− 直列型ディスク・スパッタリング体系
US4705444A (en) * 1985-07-24 1987-11-10 Hewlett-Packard Company Apparatus for automated cassette handling
JPH0533006Y2 (cg-RX-API-DMAC10.html) * 1985-10-28 1993-08-23
US4894133A (en) * 1985-11-12 1990-01-16 Virgle L. Hedgcoth Method and apparatus making magnetic recording disk
US5082747A (en) * 1985-11-12 1992-01-21 Hedgcoth Virgle L Magnetic recording disk and sputtering process and apparatus for producing same
US4701251A (en) * 1986-02-03 1987-10-20 Bvt Limited Apparatus for sputter coating discs
US4701096A (en) * 1986-03-05 1987-10-20 Btu Engineering Corporation Wafer handling station
JPH0766584B2 (ja) * 1986-04-11 1995-07-19 富士写真フイルム株式会社 光磁気記録媒体の製造方法
US4917556A (en) * 1986-04-28 1990-04-17 Varian Associates, Inc. Modular wafer transport and processing system
US4670126A (en) * 1986-04-28 1987-06-02 Varian Associates, Inc. Sputter module for modular wafer processing system
US4722298A (en) * 1986-05-19 1988-02-02 Machine Technology, Inc. Modular processing apparatus for processing semiconductor wafers
US4676884A (en) * 1986-07-23 1987-06-30 The Boc Group, Inc. Wafer processing machine with evacuated wafer transporting and storage system
US5110249A (en) * 1986-10-23 1992-05-05 Innotec Group, Inc. Transport system for inline vacuum processing
US4886412A (en) * 1986-10-28 1989-12-12 Tetron, Inc. Method and system for loading wafers
DE3702775A1 (de) * 1987-01-30 1988-08-11 Leybold Ag Vorrichtung zum quasi-kontinuierlichen behandeln von substraten
US4795299A (en) * 1987-04-15 1989-01-03 Genus, Inc. Dial deposition and processing apparatus
JP2643149B2 (ja) * 1987-06-03 1997-08-20 株式会社ブリヂストン 表面処理方法
JPS6431971A (en) * 1987-07-28 1989-02-02 Tokuda Seisakusho Vacuum treatment device
US4808291A (en) * 1987-09-09 1989-02-28 Denton Vacuum Inc. Apparatus for coating compact disks
DE3814924A1 (de) * 1988-05-03 1989-11-16 Leybold Ag Vorrichtung zum ein- und ausschleusen von substraten aus einem vakuumkessel
JP2598305B2 (ja) * 1988-06-06 1997-04-09 日東電工株式会社 半導体ウエハの処理システム
US4857160A (en) * 1988-07-25 1989-08-15 Oerlikon-Buhrle U.S.A. Inc. High vacuum processing system and method
US5259942A (en) * 1989-03-30 1993-11-09 Leybold Aktiengesellschaft Device for transferring a workpiece into and out from a vacuum chamber
DE3912295C2 (de) * 1989-04-14 1997-05-28 Leybold Ag Katodenzerstäubungsanlage
DE3912297C2 (de) * 1989-04-14 1996-07-18 Leybold Ag Katodenzerstäubungsanlage
DE3912296C2 (de) * 1989-04-14 1996-07-18 Leybold Ag Vorrichtung zur Aufnahme und Halterung von Substraten
US5254170A (en) * 1989-08-07 1993-10-19 Asm Vt, Inc. Enhanced vertical thermal reactor system
JPH07110991B2 (ja) * 1989-10-02 1995-11-29 株式会社日立製作所 プラズマ処理装置およびプラズマ処理方法
US4981408A (en) * 1989-12-18 1991-01-01 Varian Associates, Inc. Dual track handling and processing system
US5019234A (en) * 1990-06-08 1991-05-28 Vlsi Technology, Inc. System and method for depositing tungsten/titanium films
JPH0449523A (ja) * 1990-06-18 1992-02-18 Denki Kagaku Kogyo Kk 磁気記録媒体の製造法及びその装置
JP2938160B2 (ja) * 1990-07-20 1999-08-23 東京エレクトロン株式会社 真空処理装置
DE69113553T2 (de) * 1990-07-23 1996-06-20 Dainippon Screen Mfg Schnittstellenvorrichtung zum Transportieren von Substraten zwischen Verarbeitungsgeräten.
WO1992017621A1 (en) * 1991-04-04 1992-10-15 Conner Peripherals, Inc. Apparatus and method for high throughput sputtering
US5215420A (en) * 1991-09-20 1993-06-01 Intevac, Inc. Substrate handling and processing system
US5271702A (en) * 1992-02-03 1993-12-21 Environmental Research Institute Of Michigan Robotic substrate manipulator
DE4309092C2 (de) * 1993-03-22 1998-11-12 Joachim Dr Scheerer Verfahren und Vorrichtung zur Handhabung und zum Transport von Wafern in Reinst-Räumen
KR100267617B1 (ko) * 1993-04-23 2000-10-16 히가시 데쓰로 진공처리장치 및 진공처리방법
US5651868A (en) * 1994-10-26 1997-07-29 International Business Machines Corporation Method and apparatus for coating thin film data storage disks
DE4441117C1 (de) * 1994-11-18 1995-10-26 Plasma Applikation Mbh Ges Verfahren zur Beschichtung von Substraten und Vorrichtung zur Durchführung des Verfahrens
DE19549488C2 (de) * 1995-01-05 2001-08-02 Steag Micro Tech Gmbh Anlage zur chemischen Naßbehandlung
DE19546990C2 (de) * 1995-01-05 1997-07-03 Steag Micro Tech Gmbh Anlage zur chemischen Naßbehandlung
JP3732250B2 (ja) * 1995-03-30 2006-01-05 キヤノンアネルバ株式会社 インライン式成膜装置
JPH0936198A (ja) * 1995-07-19 1997-02-07 Hitachi Ltd 真空処理装置およびそれを用いた半導体製造ライン
US5705044A (en) * 1995-08-07 1998-01-06 Akashic Memories Corporation Modular sputtering machine having batch processing and serial thin film sputtering
US5997588A (en) * 1995-10-13 1999-12-07 Advanced Semiconductor Materials America, Inc. Semiconductor processing system with gas curtain
US5753092A (en) * 1996-08-26 1998-05-19 Velocidata, Inc. Cylindrical carriage sputtering system
US6101972A (en) * 1998-05-13 2000-08-15 Intevac, Inc. Plasma processing system and method
US6203862B1 (en) 1998-05-13 2001-03-20 Intevac, Inc. Processing systems with dual ion sources
US6083566A (en) * 1998-05-26 2000-07-04 Whitesell; Andrew B. Substrate handling and processing system and method
US6517691B1 (en) * 1998-08-20 2003-02-11 Intevac, Inc. Substrate processing system
TW552306B (en) 1999-03-26 2003-09-11 Anelva Corp Method of removing accumulated films from the surfaces of substrate holders in film deposition apparatus, and film deposition apparatus
US6582572B2 (en) 2000-06-01 2003-06-24 Seagate Technology Llc Target fabrication method for cylindrical cathodes
DE10037566C2 (de) * 2000-08-02 2002-10-24 Karlsruhe Forschzent Substratheizung zum gleichzeitig beidseitigen Beheizen eines Wafers
JP4856308B2 (ja) * 2000-12-27 2012-01-18 キヤノンアネルバ株式会社 基板処理装置及び経由チャンバー
JP2002203885A (ja) * 2000-12-27 2002-07-19 Anelva Corp インターバック型基板処理装置
US6500264B2 (en) * 2001-04-06 2002-12-31 Wafermasters, Inc. Continuous thermal evaporation system
US6524463B2 (en) 2001-07-16 2003-02-25 Technic, Inc. Method of processing wafers and other planar articles within a processing cell
US6558750B2 (en) 2001-07-16 2003-05-06 Technic Inc. Method of processing and plating planar articles
JP2006066057A (ja) * 2004-07-30 2006-03-09 Showa Denko Kk 磁気記録媒体の製造方法及び磁気記録媒体並びに磁気記憶装置
RU2296182C2 (ru) * 2005-05-04 2007-03-27 Открытое акционерное общество "Наро-Фоминский машиностроительный завод" Установка для нанесения покрытий в вакууме
US7438175B2 (en) * 2005-06-10 2008-10-21 Applied Materials, Inc. Linear vacuum deposition system
EP2006411A1 (en) * 2007-06-19 2008-12-24 Applied Materials, Inc. Evaporation apparatus having a rotatable evaporation unit receptacle
US8101054B2 (en) * 2009-05-28 2012-01-24 Wd Media, Inc. Magnetic particle trapper for a disk sputtering system
WO2012012394A1 (en) * 2010-07-23 2012-01-26 First Solar, Inc In-line deposition system
US20120305193A1 (en) 2011-06-03 2012-12-06 Arthur Keigler Parallel single substrate processing agitation module
MY171044A (en) * 2011-12-27 2019-09-23 Intevac Inc System architecture for combined static and pass-by processing
US20140119858A1 (en) * 2012-10-31 2014-05-01 Sandisk 3D Llc Semiconductor Device Manufacturing Line
US10566226B2 (en) * 2014-11-11 2020-02-18 Applied Materials, Inc. Multi-cassette carrying case
JP6754530B2 (ja) * 2016-09-06 2020-09-16 株式会社アルバック 成膜装置及び成膜方法並びに太陽電池の製造方法
US11682567B2 (en) * 2020-06-30 2023-06-20 Applied Materials, Inc. Cleaning system with in-line SPM processing
TWI843196B (zh) * 2022-09-08 2024-05-21 凌嘉科技股份有限公司 旋轉移載式立式鍍膜設備及雙面多層膜的鍍膜方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2975753A (en) * 1958-11-18 1961-03-21 Nat Res Corp Vacuum coating apparatus
US3340176A (en) * 1965-07-28 1967-09-05 Western Electric Co Vacuum processing machine
US3521765A (en) * 1967-10-31 1970-07-28 Western Electric Co Closed-end machine for processing articles in a controlled atmosphere
US3717119A (en) * 1971-07-30 1973-02-20 Gen Motors Corp Vacuum processing machine for aluminizing headlamp reflectors
US3856654A (en) * 1971-08-26 1974-12-24 Western Electric Co Apparatus for feeding and coating masses of workpieces in a controlled atmosphere
US3874525A (en) * 1973-06-29 1975-04-01 Ibm Method and apparatus for handling workpieces
CH573985A5 (cg-RX-API-DMAC10.html) * 1973-11-22 1976-03-31 Balzers Patent Beteilig Ag
US3973665A (en) * 1975-03-07 1976-08-10 Gca Corporation Article delivery and transport apparatus for evacuated processing equipment
US3981791A (en) * 1975-03-10 1976-09-21 Signetics Corporation Vacuum sputtering apparatus
US4183797A (en) * 1978-12-22 1980-01-15 International Business Machines Corporation Two-sided bias sputter deposition method and apparatus
DE3051199C3 (de) * 1979-12-21 1994-12-22 Varian Associates Zufördervorrichtung für eine Einrichtung zum Beschicken von Mikroplättchen in eine Behandlungskammer
US4306731A (en) * 1979-12-21 1981-12-22 Varian Associates, Inc. Wafer support assembly
US4311427A (en) * 1979-12-21 1982-01-19 Varian Associates, Inc. Wafer transfer system
US4756815A (en) * 1979-12-21 1988-07-12 Varian Associates, Inc. Wafer coating system

Also Published As

Publication number Publication date
US4500407A (en) 1985-02-19
GB2143546B (en) 1987-08-19
NL8402287A (nl) 1985-02-18
GB2176502A (en) 1986-12-31
GB8613082D0 (en) 1986-07-02
DE3425267C2 (de) 1993-12-16
GB8418027D0 (en) 1984-08-22
DE3425267A1 (de) 1985-01-31
GB2143546A (en) 1985-02-13
CA1214326A (en) 1986-11-25
GB2176502B (en) 1987-08-19
FR2549454B1 (fr) 1987-12-04
FR2549454A1 (fr) 1985-01-25
JPS6040532A (ja) 1985-03-02

Similar Documents

Publication Publication Date Title
JPH0345455B2 (cg-RX-API-DMAC10.html)
US5738767A (en) Substrate handling and processing system for flat panel displays
US4795299A (en) Dial deposition and processing apparatus
KR102500219B1 (ko) 통합된 셔터 개라지를 갖는 사전-세정 챔버
US5883017A (en) Compartmentalized substrate processing chamber
US6971832B2 (en) Magnetically coupled linear delivery system transferring wafers between a cassette and a processing reactor
US20120228122A1 (en) Sputtering apparatus and electronic device manufacturing method
JPH02179874A (ja) 真空環境内で処理する半導体ウェハの保持装置
JP2002517055A (ja) 基板取扱いおよび処理システムと方法
JPH02185971A (ja) 半導体ウェハの真空処理装置
JPS63114969A (ja) ウェ−ハ処理装置
EP0699245B1 (en) Process for coating substrates
EP0665193B1 (en) Substrate handling and processing system for flat panel displays
US4701251A (en) Apparatus for sputter coating discs
US6286452B1 (en) Sputtering apparatus
JPWO2011007753A1 (ja) 基板処理装置
JPH0613751B2 (ja) 連続スパッタ装置
JP2024052560A (ja) 成膜装置
JP3905584B2 (ja) スパッタ装置及びコリメータ付着物の処理方法
KR100622201B1 (ko) 액정 표시 장치용 기판을 위한 플라즈마 처리 장치
JPH09143674A (ja) 成膜装置及びその使用方法
JP2912318B2 (ja) 真空処理装置用搬送システム
JP7770106B2 (ja) 成膜装置
JPH02173263A (ja) スパッタリング装置の基板処理方法およびその装置
JP2676678B2 (ja) 連続スパッタ処理方法