FR2549454B1 - Installation pour la manutention et le revetement de substrats mines - Google Patents

Installation pour la manutention et le revetement de substrats mines

Info

Publication number
FR2549454B1
FR2549454B1 FR8411470A FR8411470A FR2549454B1 FR 2549454 B1 FR2549454 B1 FR 2549454B1 FR 8411470 A FR8411470 A FR 8411470A FR 8411470 A FR8411470 A FR 8411470A FR 2549454 B1 FR2549454 B1 FR 2549454B1
Authority
FR
France
Prior art keywords
mined
substrates
handling
plant
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8411470A
Other languages
English (en)
Other versions
FR2549454A1 (fr
Inventor
Donald Rex Boys
Walter Edgar Graves Jr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Varian Medical Systems Inc
Original Assignee
Varian Associates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Varian Associates Inc filed Critical Varian Associates Inc
Publication of FR2549454A1 publication Critical patent/FR2549454A1/fr
Application granted granted Critical
Publication of FR2549454B1 publication Critical patent/FR2549454B1/fr
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y10S414/138—Wafers positioned vertically within cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
FR8411470A 1983-07-19 1984-07-19 Installation pour la manutention et le revetement de substrats mines Expired FR2549454B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/515,247 US4500407A (en) 1983-07-19 1983-07-19 Disk or wafer handling and coating system

Publications (2)

Publication Number Publication Date
FR2549454A1 FR2549454A1 (fr) 1985-01-25
FR2549454B1 true FR2549454B1 (fr) 1987-12-04

Family

ID=24050563

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8411470A Expired FR2549454B1 (fr) 1983-07-19 1984-07-19 Installation pour la manutention et le revetement de substrats mines

Country Status (7)

Country Link
US (1) US4500407A (fr)
JP (1) JPS6040532A (fr)
CA (1) CA1214326A (fr)
DE (1) DE3425267C2 (fr)
FR (1) FR2549454B1 (fr)
GB (2) GB2143546B (fr)
NL (1) NL8402287A (fr)

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US4558984A (en) * 1984-05-18 1985-12-17 Varian Associates, Inc. Wafer lifting and holding apparatus
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US4735701A (en) * 1984-08-21 1988-04-05 Komag, Inc. Disk carrier
US4634512A (en) * 1984-08-21 1987-01-06 Komag, Inc. Disk and plug
US4595481A (en) * 1984-08-21 1986-06-17 Komag, Inc. Disk carrier
US4790921A (en) * 1984-10-12 1988-12-13 Hewlett-Packard Company Planetary substrate carrier method and apparatus
US4663009A (en) * 1985-02-08 1987-05-05 Hewlett-Packard Company System and method for depositing plural thin film layers on a substrate
EP0222877A4 (fr) * 1985-05-09 1989-03-21 Seagate Technology Systeme de traitement en ligne de disques par pulverisation.
US4749465A (en) * 1985-05-09 1988-06-07 Seagate Technology In-line disk sputtering system
US4705444A (en) * 1985-07-24 1987-11-10 Hewlett-Packard Company Apparatus for automated cassette handling
JPH0533006Y2 (fr) * 1985-10-28 1993-08-23
US5082747A (en) * 1985-11-12 1992-01-21 Hedgcoth Virgle L Magnetic recording disk and sputtering process and apparatus for producing same
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DE3814924A1 (de) * 1988-05-03 1989-11-16 Leybold Ag Vorrichtung zum ein- und ausschleusen von substraten aus einem vakuumkessel
JP2598305B2 (ja) * 1988-06-06 1997-04-09 日東電工株式会社 半導体ウエハの処理システム
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DE3912295C2 (de) * 1989-04-14 1997-05-28 Leybold Ag Katodenzerstäubungsanlage
DE3912297C2 (de) * 1989-04-14 1996-07-18 Leybold Ag Katodenzerstäubungsanlage
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JPH07110991B2 (ja) * 1989-10-02 1995-11-29 株式会社日立製作所 プラズマ処理装置およびプラズマ処理方法
US4981408A (en) * 1989-12-18 1991-01-01 Varian Associates, Inc. Dual track handling and processing system
US5019234A (en) * 1990-06-08 1991-05-28 Vlsi Technology, Inc. System and method for depositing tungsten/titanium films
JPH0449523A (ja) * 1990-06-18 1992-02-18 Denki Kagaku Kogyo Kk 磁気記録媒体の製造法及びその装置
JP2938160B2 (ja) * 1990-07-20 1999-08-23 東京エレクトロン株式会社 真空処理装置
DE69113553T2 (de) * 1990-07-23 1996-06-20 Dainippon Screen Mfg Schnittstellenvorrichtung zum Transportieren von Substraten zwischen Verarbeitungsgeräten.
JP3416910B2 (ja) * 1991-04-04 2003-06-16 シーゲイト テクノロジィ リミテッド ライアビリティ カンパニー スループットの高いスパッタリング装置及び方法
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US5271702A (en) * 1992-02-03 1993-12-21 Environmental Research Institute Of Michigan Robotic substrate manipulator
DE4309092C2 (de) * 1993-03-22 1998-11-12 Joachim Dr Scheerer Verfahren und Vorrichtung zur Handhabung und zum Transport von Wafern in Reinst-Räumen
KR100267617B1 (ko) * 1993-04-23 2000-10-16 히가시 데쓰로 진공처리장치 및 진공처리방법
US5651868A (en) * 1994-10-26 1997-07-29 International Business Machines Corporation Method and apparatus for coating thin film data storage disks
DE4441117C1 (de) * 1994-11-18 1995-10-26 Plasma Applikation Mbh Ges Verfahren zur Beschichtung von Substraten und Vorrichtung zur Durchführung des Verfahrens
DE19549487C2 (de) * 1995-01-05 2000-11-16 Steag Micro Tech Gmbh Anlage zur chemischen Naßbehandlung
DE19546990C2 (de) * 1995-01-05 1997-07-03 Steag Micro Tech Gmbh Anlage zur chemischen Naßbehandlung
JP3732250B2 (ja) * 1995-03-30 2006-01-05 キヤノンアネルバ株式会社 インライン式成膜装置
JPH0936198A (ja) * 1995-07-19 1997-02-07 Hitachi Ltd 真空処理装置およびそれを用いた半導体製造ライン
US5705044A (en) * 1995-08-07 1998-01-06 Akashic Memories Corporation Modular sputtering machine having batch processing and serial thin film sputtering
US5997588A (en) * 1995-10-13 1999-12-07 Advanced Semiconductor Materials America, Inc. Semiconductor processing system with gas curtain
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DE10037566C2 (de) * 2000-08-02 2002-10-24 Karlsruhe Forschzent Substratheizung zum gleichzeitig beidseitigen Beheizen eines Wafers
JP2002203885A (ja) * 2000-12-27 2002-07-19 Anelva Corp インターバック型基板処理装置
JP4856308B2 (ja) * 2000-12-27 2012-01-18 キヤノンアネルバ株式会社 基板処理装置及び経由チャンバー
US6500264B2 (en) * 2001-04-06 2002-12-31 Wafermasters, Inc. Continuous thermal evaporation system
US6558750B2 (en) 2001-07-16 2003-05-06 Technic Inc. Method of processing and plating planar articles
US6524463B2 (en) 2001-07-16 2003-02-25 Technic, Inc. Method of processing wafers and other planar articles within a processing cell
JP2006066057A (ja) * 2004-07-30 2006-03-09 Showa Denko Kk 磁気記録媒体の製造方法及び磁気記録媒体並びに磁気記憶装置
US7438175B2 (en) * 2005-06-10 2008-10-21 Applied Materials, Inc. Linear vacuum deposition system
EP2006411A1 (fr) * 2007-06-19 2008-12-24 Applied Materials, Inc. Appareil d'évaporation comportant un réceptacle d'unité d'évaporation rotatif
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Also Published As

Publication number Publication date
GB2176502A (en) 1986-12-31
JPS6040532A (ja) 1985-03-02
GB2176502B (en) 1987-08-19
GB2143546B (en) 1987-08-19
GB2143546A (en) 1985-02-13
GB8613082D0 (en) 1986-07-02
FR2549454A1 (fr) 1985-01-25
CA1214326A (fr) 1986-11-25
NL8402287A (nl) 1985-02-18
GB8418027D0 (en) 1984-08-22
DE3425267C2 (de) 1993-12-16
US4500407A (en) 1985-02-19
DE3425267A1 (de) 1985-01-31
JPH0345455B2 (fr) 1991-07-11

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Legal Events

Date Code Title Description
ER Errata listed in the french official journal (bopi)

Free format text: 4/85

ST Notification of lapse