JPH0341475Y2 - - Google Patents

Info

Publication number
JPH0341475Y2
JPH0341475Y2 JP1985192324U JP19232485U JPH0341475Y2 JP H0341475 Y2 JPH0341475 Y2 JP H0341475Y2 JP 1985192324 U JP1985192324 U JP 1985192324U JP 19232485 U JP19232485 U JP 19232485U JP H0341475 Y2 JPH0341475 Y2 JP H0341475Y2
Authority
JP
Japan
Prior art keywords
conductor
solder
thick film
dielectric
hybrid integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1985192324U
Other languages
English (en)
Japanese (ja)
Other versions
JPS62101234U (OSRAM
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985192324U priority Critical patent/JPH0341475Y2/ja
Publication of JPS62101234U publication Critical patent/JPS62101234U/ja
Application granted granted Critical
Publication of JPH0341475Y2 publication Critical patent/JPH0341475Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP1985192324U 1985-12-16 1985-12-16 Expired JPH0341475Y2 (OSRAM)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985192324U JPH0341475Y2 (OSRAM) 1985-12-16 1985-12-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985192324U JPH0341475Y2 (OSRAM) 1985-12-16 1985-12-16

Publications (2)

Publication Number Publication Date
JPS62101234U JPS62101234U (OSRAM) 1987-06-27
JPH0341475Y2 true JPH0341475Y2 (OSRAM) 1991-08-30

Family

ID=31147295

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985192324U Expired JPH0341475Y2 (OSRAM) 1985-12-16 1985-12-16

Country Status (1)

Country Link
JP (1) JPH0341475Y2 (OSRAM)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2591999Y2 (ja) * 1990-01-22 1999-03-10 日本電気株式会社 集積回路のパッケージの構造

Also Published As

Publication number Publication date
JPS62101234U (OSRAM) 1987-06-27

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