JPH0340417Y2 - - Google Patents
Info
- Publication number
- JPH0340417Y2 JPH0340417Y2 JP1987070486U JP7048687U JPH0340417Y2 JP H0340417 Y2 JPH0340417 Y2 JP H0340417Y2 JP 1987070486 U JP1987070486 U JP 1987070486U JP 7048687 U JP7048687 U JP 7048687U JP H0340417 Y2 JPH0340417 Y2 JP H0340417Y2
- Authority
- JP
- Japan
- Prior art keywords
- punch
- cutting
- resin
- tie bar
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Punching Or Piercing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987070486U JPH0340417Y2 (enEXAMPLES) | 1987-05-12 | 1987-05-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987070486U JPH0340417Y2 (enEXAMPLES) | 1987-05-12 | 1987-05-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63180119U JPS63180119U (enEXAMPLES) | 1988-11-21 |
| JPH0340417Y2 true JPH0340417Y2 (enEXAMPLES) | 1991-08-26 |
Family
ID=30912166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987070486U Expired JPH0340417Y2 (enEXAMPLES) | 1987-05-12 | 1987-05-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0340417Y2 (enEXAMPLES) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52151989A (en) * | 1976-06-14 | 1977-12-16 | Hitachi Ltd | Small punching die |
| JPS5538585Y2 (enEXAMPLES) * | 1977-08-10 | 1980-09-09 | ||
| JPH0110108Y2 (enEXAMPLES) * | 1984-09-14 | 1989-03-22 |
-
1987
- 1987-05-12 JP JP1987070486U patent/JPH0340417Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63180119U (enEXAMPLES) | 1988-11-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5070039A (en) | Method of making an integrated circuit using a pre-served dam bar to reduce mold flash and to facilitate flash removal | |
| US8174096B2 (en) | Stamped leadframe and method of manufacture thereof | |
| US7247931B2 (en) | Semiconductor package and leadframe therefor having angled corners | |
| JPH0340417Y2 (enEXAMPLES) | ||
| US6303983B1 (en) | Apparatus for manufacturing resin-encapsulated semiconductor devices | |
| JPH02105448A (ja) | リードフレーム | |
| JP2700902B2 (ja) | リードフレームの製造方法 | |
| JPH0622266B2 (ja) | 半導体装置及びその製造方法 | |
| JPS60164345A (ja) | リ−ドフレ−ムの製造方法 | |
| JP2635851B2 (ja) | 電子部品の製造に使用するリードフレームの構造 | |
| JPH0582694A (ja) | 半導体装置の製造方法 | |
| JPH0735402Y2 (ja) | リードフレーム切断装置 | |
| JPH07120739B2 (ja) | リ−ドの切断成形方法 | |
| JPH07221245A (ja) | 半導体装置用リードフレーム | |
| JPH05109957A (ja) | 樹脂封止型半導体装置の製造方法およびリードフレーム | |
| JPH0474459A (ja) | 半導体装置の製造方法 | |
| JPS63308359A (ja) | リ−ドフレ−ムの製造方法 | |
| JPS58124256A (ja) | 半導体装置の製造方法 | |
| JP2901217B2 (ja) | 半導体装置用リードフレーム | |
| JPH021581B2 (enEXAMPLES) | ||
| JPH01106457A (ja) | 樹脂封止形半導体装置 | |
| JPH0997866A (ja) | リード成形方法及びリード成形用金型 | |
| JPH06151681A (ja) | 半導体装置の製造方法およびその製造において用いるリードフレーム | |
| JPS61194862A (ja) | リ−ドフレ−ムおよびその製造方法 | |
| KR20030042746A (ko) | 엠엘피 성형방법 |