JPH0340072B2 - - Google Patents

Info

Publication number
JPH0340072B2
JPH0340072B2 JP61208358A JP20835886A JPH0340072B2 JP H0340072 B2 JPH0340072 B2 JP H0340072B2 JP 61208358 A JP61208358 A JP 61208358A JP 20835886 A JP20835886 A JP 20835886A JP H0340072 B2 JPH0340072 B2 JP H0340072B2
Authority
JP
Japan
Prior art keywords
resin
adhesive
epoxy resin
gallic acid
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61208358A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6363770A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP20835886A priority Critical patent/JPS6363770A/ja
Publication of JPS6363770A publication Critical patent/JPS6363770A/ja
Publication of JPH0340072B2 publication Critical patent/JPH0340072B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP20835886A 1986-09-03 1986-09-03 銅張積層板用接着剤 Granted JPS6363770A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20835886A JPS6363770A (ja) 1986-09-03 1986-09-03 銅張積層板用接着剤

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20835886A JPS6363770A (ja) 1986-09-03 1986-09-03 銅張積層板用接着剤

Publications (2)

Publication Number Publication Date
JPS6363770A JPS6363770A (ja) 1988-03-22
JPH0340072B2 true JPH0340072B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-06-17

Family

ID=16554968

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20835886A Granted JPS6363770A (ja) 1986-09-03 1986-09-03 銅張積層板用接着剤

Country Status (1)

Country Link
JP (1) JPS6363770A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6872762B2 (en) * 2000-07-13 2005-03-29 Loctite (R&D) Limited Epoxy resin composition with solid organic acid
DE102004049717A1 (de) * 2004-10-11 2006-04-13 Henkel Kgaa Alterungsbeständige Beschichtungen und Klebeverbunde
JP5526891B2 (ja) * 2010-03-15 2014-06-18 セメダイン株式会社 フェノール樹脂・ポリビニルアセタール樹脂系接着剤

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5214731B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1973-01-29 1977-04-23
JPS6032875A (ja) * 1983-08-01 1985-02-20 Matsushita Electric Works Ltd 金属張積層板用接着剤

Also Published As

Publication number Publication date
JPS6363770A (ja) 1988-03-22

Similar Documents

Publication Publication Date Title
US5160783A (en) Epoxy resin-impregnated glass cloth sheet having adhesive layer
CN101974205A (zh) 用于埋入式电容器的树脂组合物、使用其制作的介电层及覆金属箔板
CN1296433C (zh) 一种胶液、使用该胶液的无卤阻燃覆铜箔基板及其制作方法
JP3248424B2 (ja) 変成ポリフェニレンオキサイドの製法、この製法による変成ポリフェニレンオキサイドを用いたエポキシ樹脂組成物、この組成物を用いたプリプレグ、及びこのプリプレグを用いた積層板
EP0702070A2 (en) Adhesive for copper foils and adhesive-backed copper foil
JPH0340072B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP3339301B2 (ja) エポキシ樹脂組成物、この樹脂組成物を用いたプリプレグ及びこのプリプレグを用いた積層板
JP3265984B2 (ja) エポキシ樹脂組成物、この樹脂組成物を用いたプリプレグ、及びこのプリプレグを用いた積層板
JPS61179224A (ja) エポキシ樹脂組成物
JP3319650B2 (ja) 銅張積層板用銅箔
JP3031795B2 (ja) ボンディングシート
JP3552621B2 (ja) エポキシ樹脂組成物、樹脂付き金属箔及び多層板
JPH0552873B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP3054466B2 (ja) 異方導電性接着膜とその製造方法
JPH04288318A (ja) 電気積層板用エポキシ樹脂組成物
JPH06128547A (ja) 銅張積層板用銅箔接着剤
JPH0377815B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP3265871B2 (ja) 積層板用エポキシ樹脂組成物
JP2603603B2 (ja) 金属張積層板用接着剤
JPS6119621A (ja) エポキシ樹脂組成物
JPH0552872B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH0257813B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS6079080A (ja) 接着剤組成物
KR20040056169A (ko) 비할로겐계 난연성 에폭시 수지 조성물, 이를 이용하여제조한 수지코팅동박 및 동박적층판
JPS6119623A (ja) エポキシ樹脂を含有する組成物