JPH0338943B2 - - Google Patents
Info
- Publication number
- JPH0338943B2 JPH0338943B2 JP23479084A JP23479084A JPH0338943B2 JP H0338943 B2 JPH0338943 B2 JP H0338943B2 JP 23479084 A JP23479084 A JP 23479084A JP 23479084 A JP23479084 A JP 23479084A JP H0338943 B2 JPH0338943 B2 JP H0338943B2
- Authority
- JP
- Japan
- Prior art keywords
- cooling plate
- target
- tin
- copper
- aluminum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001816 cooling Methods 0.000 claims description 35
- 229910052802 copper Inorganic materials 0.000 claims description 26
- 239000010949 copper Substances 0.000 claims description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 25
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 20
- 229910052718 tin Inorganic materials 0.000 claims description 19
- 239000011135 tin Substances 0.000 claims description 17
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 14
- 239000010409 thin film Substances 0.000 claims description 14
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052782 aluminium Inorganic materials 0.000 claims description 11
- 229910000838 Al alloy Inorganic materials 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 229910052725 zinc Inorganic materials 0.000 claims description 8
- 239000011701 zinc Substances 0.000 claims description 8
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 239000011261 inert gas Substances 0.000 claims description 4
- 238000005304 joining Methods 0.000 claims description 4
- 238000005477 sputtering target Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 2
- 238000007796 conventional method Methods 0.000 description 8
- 230000007547 defect Effects 0.000 description 7
- 238000004544 sputter deposition Methods 0.000 description 7
- 239000010408 film Substances 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 238000005219 brazing Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000007733 ion plating Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 2
- 229910018125 Al-Si Inorganic materials 0.000 description 1
- 229910018182 Al—Cu Inorganic materials 0.000 description 1
- 229910018520 Al—Si Inorganic materials 0.000 description 1
- 229910018594 Si-Cu Inorganic materials 0.000 description 1
- 229910008465 Si—Cu Inorganic materials 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- FAKFSJNVVCGEEI-UHFFFAOYSA-J tin(4+);disulfate Chemical compound [Sn+4].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O FAKFSJNVVCGEEI-UHFFFAOYSA-J 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23479084A JPS61115667A (ja) | 1984-11-07 | 1984-11-07 | スパツタリング用タ−ゲツトを冷却板に接合する方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23479084A JPS61115667A (ja) | 1984-11-07 | 1984-11-07 | スパツタリング用タ−ゲツトを冷却板に接合する方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61115667A JPS61115667A (ja) | 1986-06-03 |
| JPH0338943B2 true JPH0338943B2 (enrdf_load_stackoverflow) | 1991-06-12 |
Family
ID=16976422
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23479084A Granted JPS61115667A (ja) | 1984-11-07 | 1984-11-07 | スパツタリング用タ−ゲツトを冷却板に接合する方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61115667A (enrdf_load_stackoverflow) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0586462A (ja) * | 1991-06-28 | 1993-04-06 | Mitsubishi Materials Corp | スパツタリング用ターゲツト及びその製造方法 |
| JP3983862B2 (ja) * | 1997-10-24 | 2007-09-26 | Ｄｏｗａホールディングス株式会社 | スパッタリングターゲットとその接合方法及び接合装置 |
| WO2008041350A1 (en) * | 2006-09-29 | 2008-04-10 | Kabushiki Kaisha Toshiba | Joint with first and second members with a joining layer located therebetween containing sn metal and another metallic material; methods for forming the same joint |
| JP5546369B2 (ja) | 2010-06-25 | 2014-07-09 | 千住金属工業株式会社 | 蓄電デバイス用電極、その製造方法及びその接続方法 |
| JP6854306B2 (ja) * | 2019-02-12 | 2021-04-07 | Ｊｘ金属株式会社 | スパッタリングターゲット−バッキングプレート接合体 |
-
1984
- 1984-11-07 JP JP23479084A patent/JPS61115667A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61115667A (ja) | 1986-06-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4988035A (en) | Method of liquid phase diffusion bonding of metal bodies | |
| CA1284898C (en) | Titanium-copper-nickel braze filler metal | |
| US4643875A (en) | Tin based ductile brazing alloys | |
| Minor | Growth of a Au-Ni-Sn intermetallic compound on the solder-substrate interface after aging | |
| KR960010166B1 (ko) | 확산접합된 스패터링타게트조립체 및 그 제조방법 | |
| US4451972A (en) | Method of making electronic chip with metalized back including a surface stratum of solder | |
| JPH07504945A (ja) | スパッタ・ターゲット受け板組立体を結合する方法とそれにより製造される組立体 | |
| MXPA01011258A (es) | Producto de hoja latonada y metodo para su fabricacion. | |
| JPH0217509B2 (enrdf_load_stackoverflow) | ||
| EP0069510A1 (en) | Method of metallizing sintered ceramics materials | |
| US3393446A (en) | Method for joining aluminum to metals | |
| US4606981A (en) | Ductile brazing alloys containing reactive metals | |
| JPH0338943B2 (enrdf_load_stackoverflow) | ||
| JPH0748667A (ja) | 高い接合強度を有するスパッタリングターゲット | |
| JPH0263680A (ja) | 金属化された材料へのろう被覆物の形成法 | |
| US5664723A (en) | Brazing technology | |
| US3581382A (en) | Diffusion brazing of aluminum and aluminum base alloys | |
| US20040060962A1 (en) | Method of joining surfaces | |
| JPH0867978A (ja) | スパッタリング用ターゲットのはんだ付け方法 | |
| JPS6033269A (ja) | 金属とセラミツクの接合方法 | |
| US3683488A (en) | Methods of bonding metals together | |
| JPH0677805B2 (ja) | スパツタリング用タ−ゲツトのボンデイング方法 | |
| JP3629578B2 (ja) | Ｔｉ系材料とＣｕ系の接合方法 | |
| US3393447A (en) | Fluxless brazing of aluminum | |
| JP2006509636A (ja) | ろう付けシート製品およびその製造方法 |