JPH0336305B2 - - Google Patents
Info
- Publication number
- JPH0336305B2 JPH0336305B2 JP58017141A JP1714183A JPH0336305B2 JP H0336305 B2 JPH0336305 B2 JP H0336305B2 JP 58017141 A JP58017141 A JP 58017141A JP 1714183 A JP1714183 A JP 1714183A JP H0336305 B2 JPH0336305 B2 JP H0336305B2
- Authority
- JP
- Japan
- Prior art keywords
- powder
- organic binder
- substrate material
- semiconductor substrate
- oxidizing atmosphere
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000843 powder Substances 0.000 claims description 50
- 239000000463 material Substances 0.000 claims description 32
- 239000011230 binding agent Substances 0.000 claims description 25
- 239000000758 substrate Substances 0.000 claims description 24
- 239000004065 semiconductor Substances 0.000 claims description 21
- 238000004519 manufacturing process Methods 0.000 claims description 19
- 230000001590 oxidative effect Effects 0.000 claims description 17
- 239000002904 solvent Substances 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 15
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 14
- 239000002245 particle Substances 0.000 claims description 13
- 229910001182 Mo alloy Inorganic materials 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 8
- 238000004898 kneading Methods 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 238000001125 extrusion Methods 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 2
- 238000005245 sintering Methods 0.000 description 14
- 239000000919 ceramic Substances 0.000 description 13
- 229910052750 molybdenum Inorganic materials 0.000 description 12
- 229910052721 tungsten Inorganic materials 0.000 description 12
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000011148 porous material Substances 0.000 description 7
- 239000000203 mixture Substances 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 238000005470 impregnation Methods 0.000 description 5
- 238000004663 powder metallurgy Methods 0.000 description 5
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical group OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 238000009776 industrial production Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000011362 coarse particle Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- -1 plasticity improver Substances 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/142—Metallic substrates having insulating layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Powder Metallurgy (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58017141A JPS59143347A (ja) | 1983-02-03 | 1983-02-03 | 半導体基板材料の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58017141A JPS59143347A (ja) | 1983-02-03 | 1983-02-03 | 半導体基板材料の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59143347A JPS59143347A (ja) | 1984-08-16 |
| JPH0336305B2 true JPH0336305B2 (enrdf_load_stackoverflow) | 1991-05-31 |
Family
ID=11935723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58017141A Granted JPS59143347A (ja) | 1983-02-03 | 1983-02-03 | 半導体基板材料の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59143347A (enrdf_load_stackoverflow) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2632886B2 (ja) * | 1987-12-22 | 1997-07-23 | 川崎製鉄株式会社 | 複相組織焼結体の製造方法 |
| JP2746279B2 (ja) * | 1990-06-18 | 1998-05-06 | 日本タングステン 株式会社 | 半導体装置用基板材料及びその製造方法 |
| JP2591855B2 (ja) * | 1990-09-12 | 1997-03-19 | 日本タングステン株式会社 | 高精度ウェイト部品とその製造方法 |
| EP0645804B1 (en) * | 1993-09-16 | 2003-04-23 | Sumitomo Electric Industries, Limited | Metal casing for semiconductor device having high thermal conductivity and thermal expansion coefficient similar to that of semiconductor and method for manufacturing the same |
| JP3336370B2 (ja) * | 1995-06-23 | 2002-10-21 | 東邦金属株式会社 | 半導体基板材料の製造方法、半導体基板材料および半導体用パッケージ |
-
1983
- 1983-02-03 JP JP58017141A patent/JPS59143347A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59143347A (ja) | 1984-08-16 |
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