JPH0336305B2 - - Google Patents
Info
- Publication number
- JPH0336305B2 JPH0336305B2 JP58017141A JP1714183A JPH0336305B2 JP H0336305 B2 JPH0336305 B2 JP H0336305B2 JP 58017141 A JP58017141 A JP 58017141A JP 1714183 A JP1714183 A JP 1714183A JP H0336305 B2 JPH0336305 B2 JP H0336305B2
- Authority
- JP
- Japan
- Prior art keywords
- powder
- organic binder
- substrate material
- semiconductor substrate
- oxidizing atmosphere
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/142—Metallic substrates having insulating layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Powder Metallurgy (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58017141A JPS59143347A (ja) | 1983-02-03 | 1983-02-03 | 半導体基板材料の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58017141A JPS59143347A (ja) | 1983-02-03 | 1983-02-03 | 半導体基板材料の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59143347A JPS59143347A (ja) | 1984-08-16 |
| JPH0336305B2 true JPH0336305B2 (cs) | 1991-05-31 |
Family
ID=11935723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58017141A Granted JPS59143347A (ja) | 1983-02-03 | 1983-02-03 | 半導体基板材料の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59143347A (cs) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2632886B2 (ja) * | 1987-12-22 | 1997-07-23 | 川崎製鉄株式会社 | 複相組織焼結体の製造方法 |
| JP2746279B2 (ja) * | 1990-06-18 | 1998-05-06 | 日本タングステン 株式会社 | 半導体装置用基板材料及びその製造方法 |
| JP2591855B2 (ja) * | 1990-09-12 | 1997-03-19 | 日本タングステン株式会社 | 高精度ウェイト部品とその製造方法 |
| US5574959A (en) * | 1993-09-16 | 1996-11-12 | Sumitomo Electric Industries, Ltd. | Metal casing for semiconductor device having high thermal conductivity and thermal expansion coefficient |
| WO1997001187A1 (fr) * | 1995-06-23 | 1997-01-09 | Toho Kinzoku Co., Ltd. | Procede de fabrication d'une matiere pour substrats de semi-conducteurs, matiere pour substrats de semi-conducteurs, et boitier pour semi-conducteur |
-
1983
- 1983-02-03 JP JP58017141A patent/JPS59143347A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59143347A (ja) | 1984-08-16 |
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