JPS59143347A - 半導体基板材料の製造方法 - Google Patents

半導体基板材料の製造方法

Info

Publication number
JPS59143347A
JPS59143347A JP58017141A JP1714183A JPS59143347A JP S59143347 A JPS59143347 A JP S59143347A JP 58017141 A JP58017141 A JP 58017141A JP 1714183 A JP1714183 A JP 1714183A JP S59143347 A JPS59143347 A JP S59143347A
Authority
JP
Japan
Prior art keywords
powder
organic binder
solvent
semiconductor substrate
substrate material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58017141A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0336305B2 (cs
Inventor
Mitsuo Osada
光生 長田
Sogo Hase
長谷　宗吾
Akira Otsuka
昭 大塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP58017141A priority Critical patent/JPS59143347A/ja
Publication of JPS59143347A publication Critical patent/JPS59143347A/ja
Publication of JPH0336305B2 publication Critical patent/JPH0336305B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142—Metallic substrates having insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Powder Metallurgy (AREA)
  • Die Bonding (AREA)
JP58017141A 1983-02-03 1983-02-03 半導体基板材料の製造方法 Granted JPS59143347A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58017141A JPS59143347A (ja) 1983-02-03 1983-02-03 半導体基板材料の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58017141A JPS59143347A (ja) 1983-02-03 1983-02-03 半導体基板材料の製造方法

Publications (2)

Publication Number Publication Date
JPS59143347A true JPS59143347A (ja) 1984-08-16
JPH0336305B2 JPH0336305B2 (cs) 1991-05-31

Family

ID=11935723

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58017141A Granted JPS59143347A (ja) 1983-02-03 1983-02-03 半導体基板材料の製造方法

Country Status (1)

Country Link
JP (1) JPS59143347A (cs)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01165706A (ja) * 1987-12-22 1989-06-29 Kawasaki Steel Corp 複相組織焼結体およびその製造方法
JPH0449642A (ja) * 1990-06-18 1992-02-19 Nippon Tungsten Co Ltd 半導体装置用基板材料及びその製造方法
JPH04124205A (ja) * 1990-09-12 1992-04-24 Nippon Tungsten Co Ltd 高精度ウェイト部品とその製造方法
EP0645804A3 (en) * 1993-09-16 1996-05-29 Sumitomo Electric Industries Metal housing for semiconductor device and method for its production.
EP0784341A4 (en) * 1995-06-23 1997-05-14 Toho Kinzoku Kk METHOD OF PRODUCING A MATERIAL FOR A SEMICONDUCTOR SUBSTRATE, MATERIAL FOR A SEMICONDUCTOR SUBSTRATE AND PACKING FOR A SEMICONDUCTOR

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01165706A (ja) * 1987-12-22 1989-06-29 Kawasaki Steel Corp 複相組織焼結体およびその製造方法
JPH0449642A (ja) * 1990-06-18 1992-02-19 Nippon Tungsten Co Ltd 半導体装置用基板材料及びその製造方法
JPH04124205A (ja) * 1990-09-12 1992-04-24 Nippon Tungsten Co Ltd 高精度ウェイト部品とその製造方法
EP0645804A3 (en) * 1993-09-16 1996-05-29 Sumitomo Electric Industries Metal housing for semiconductor device and method for its production.
EP1282166A3 (en) * 1993-09-16 2003-03-05 Sumitomo Electric Industries, Ltd. Metal casing for semiconductor device having high thermal conductivity and thermal expansion coefficient similar to that of semiconductor and method for manufacturing the same
EP0784341A4 (en) * 1995-06-23 1997-05-14 Toho Kinzoku Kk METHOD OF PRODUCING A MATERIAL FOR A SEMICONDUCTOR SUBSTRATE, MATERIAL FOR A SEMICONDUCTOR SUBSTRATE AND PACKING FOR A SEMICONDUCTOR
US5905938A (en) * 1995-06-23 1999-05-18 Toho Kinzoku Co., Ltd. Method of manufacturing a semiconductor substrate material

Also Published As

Publication number Publication date
JPH0336305B2 (cs) 1991-05-31

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