JPH0336241B2 - - Google Patents

Info

Publication number
JPH0336241B2
JPH0336241B2 JP58079730A JP7973083A JPH0336241B2 JP H0336241 B2 JPH0336241 B2 JP H0336241B2 JP 58079730 A JP58079730 A JP 58079730A JP 7973083 A JP7973083 A JP 7973083A JP H0336241 B2 JPH0336241 B2 JP H0336241B2
Authority
JP
Japan
Prior art keywords
copper
stainless steel
cross
sectional area
stress
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58079730A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59205105A (ja
Inventor
Susumu Yamamoto
Kazuyoshi Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP58079730A priority Critical patent/JPS59205105A/ja
Priority to US06/602,984 priority patent/US4537808A/en
Priority to DE3416825A priority patent/DE3416825C2/de
Publication of JPS59205105A publication Critical patent/JPS59205105A/ja
Publication of JPH0336241B2 publication Critical patent/JPH0336241B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12333—Helical or with helical component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/1291—Next to Co-, Cu-, or Ni-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/12917—Next to Fe-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/12917—Next to Fe-base component
    • Y10T428/12924—Fe-base has 0.01-1.7% carbon [i.e., steel]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Springs (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Laminated Bodies (AREA)
JP58079730A 1983-05-07 1983-05-07 導電性複合材料 Granted JPS59205105A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP58079730A JPS59205105A (ja) 1983-05-07 1983-05-07 導電性複合材料
US06/602,984 US4537808A (en) 1983-05-07 1984-04-23 Electrically conductive composite material
DE3416825A DE3416825C2 (de) 1983-05-07 1984-05-07 Elektrisch leitendes Verbundmaterial

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58079730A JPS59205105A (ja) 1983-05-07 1983-05-07 導電性複合材料

Publications (2)

Publication Number Publication Date
JPS59205105A JPS59205105A (ja) 1984-11-20
JPH0336241B2 true JPH0336241B2 (OSRAM) 1991-05-30

Family

ID=13698320

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58079730A Granted JPS59205105A (ja) 1983-05-07 1983-05-07 導電性複合材料

Country Status (3)

Country Link
US (1) US4537808A (OSRAM)
JP (1) JPS59205105A (OSRAM)
DE (1) DE3416825C2 (OSRAM)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0731939B2 (ja) * 1985-10-11 1995-04-10 住友電気工業株式会社 高強度、良屈曲性導体
JPH01225009A (ja) * 1988-03-01 1989-09-07 Hitachi Chem Co Ltd 配線板
US5015803A (en) * 1989-05-31 1991-05-14 Olin Corporation Thermal performance package for integrated circuit chip
FR2655814B1 (fr) * 1989-12-15 1994-03-25 Catherine Bellon Clotures electriques a elements conducteurs metalliques a base d'un alliage binaire cuivre/cadmium.
GB2250629A (en) * 1990-11-23 1992-06-10 Chloride Silent Power Ltd Battery of high temperature cells
DE4211167A1 (de) * 1992-03-31 1993-10-07 Thaelmann Schwermaschbau Veb Verfahren und Vorrichtung zur kontinuierlichen thermischen Oberflächenbehandlung stab- bzw. strangförmiger Materialien mit metallischer Oberfläche
US7073254B2 (en) 1993-11-16 2006-07-11 Formfactor, Inc. Method for mounting a plurality of spring contact elements
US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US6624648B2 (en) * 1993-11-16 2003-09-23 Formfactor, Inc. Probe card assembly
US6246247B1 (en) 1994-11-15 2001-06-12 Formfactor, Inc. Probe card assembly and kit, and methods of using same
JP3045460B2 (ja) * 1995-04-19 2000-05-29 株式会社小松製作所 焼結接合方法およびその方法を用いる焼結複合部材
AU5964196A (en) * 1995-05-26 1996-12-11 Formfactor, Inc. Spring element electrical contact and methods
US6483328B1 (en) * 1995-11-09 2002-11-19 Formfactor, Inc. Probe card for probing wafers with raised contact elements
US5994152A (en) 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US20030099854A1 (en) * 2001-11-26 2003-05-29 David Smith Method for producing a clad metal product
EP1362941A1 (en) * 2002-05-13 2003-11-19 N.V. Bekaert S.A. Electrically conductive yarn
US7700215B2 (en) * 2006-04-19 2010-04-20 Delphi Technologies, Inc. Clad current carrier for a solid oxide fuel cell stack
ES2969563T3 (es) * 2007-07-16 2024-05-21 Micrometal Tech Inc Material de blindaje eléctrico compuesto por hilo monofilamento de acero inoxidable metalizado
US20100289198A1 (en) * 2009-04-28 2010-11-18 Pete Balsells Multilayered canted coil springs and associated methods
CN111156271B (zh) 2015-06-29 2022-04-19 日本发条株式会社 弹性部件以及弹性部件用线材
US11395446B2 (en) * 2019-04-10 2022-07-19 Glenair, Inc. Electromagnetically shielding material
WO2023013523A1 (ja) * 2021-08-06 2023-02-09 住友電気工業株式会社 導電性線材
JP7290187B2 (ja) * 2021-08-06 2023-06-13 住友電気工業株式会社 導電性線材

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS559437A (en) * 1978-07-07 1980-01-23 Toshiba Corp Composite wire for glass sealing
JPS60912B2 (ja) * 1980-06-04 1985-01-10 住友金属工業株式会社 スポツト溶接可能な接着クラツド金属板

Also Published As

Publication number Publication date
JPS59205105A (ja) 1984-11-20
DE3416825C2 (de) 1986-11-27
US4537808A (en) 1985-08-27
DE3416825A1 (de) 1984-11-08

Similar Documents

Publication Publication Date Title
JPH0336241B2 (OSRAM)
JP4845069B2 (ja) 配線用電線導体、配線用電線導体の製造方法、配線用電線および銅合金素線
JP5306591B2 (ja) 配線用電線導体、配線用電線、及びそれらの製造方法
WO2015064357A1 (ja) 銅合金線、銅合金撚線、被覆電線、ワイヤーハーネス及び銅合金線の製造方法
EP3362581B1 (en) Aluminum-iron-zirconium alloys
US4599120A (en) Processing of copper alloys
US4818634A (en) Composite metal spring material, method of making, and spring members formed therefrom
US6254702B1 (en) Copper base alloys and terminals using the same
US4724013A (en) Processing of copper alloys and product
US4233066A (en) Electrical conductor of aluminium
JPS619563A (ja) 銅合金の製造方法
JP7195054B2 (ja) 銅合金板材およびその製造方法
JPH03188247A (ja) 曲げ加工性の良好な高強度高導電銅合金の製造方法
JP2019157153A (ja) Ｃｕ−Ｎｉ−Ｓｉ系銅合金
JPH06207232A (ja) 電子電気機器用銅合金とその製造法
CA1285460C (en) Composites having improved resistance to stress relaxation
JP6619389B2 (ja) Ｃｕ−Ｎｉ−Ｓｉ系銅合金
JPS5839912B2 (ja) リ−ド用銅合金材の製造方法
US3881965A (en) Wire product and method of manufacture
JP6328166B2 (ja) Ｃｕ−Ｎｉ−Ｓｉ系圧延銅合金及びその製造方法
JP5578991B2 (ja) 高強度銅合金線材
JPWO2009154239A1 (ja) 配線用電線導体、配線用電線および配線用電線導体の製造方法
JPH0118139B2 (OSRAM)
JPH0453935B2 (OSRAM)
JPS6312930B2 (OSRAM)