JPH0334848Y2 - - Google Patents
Info
- Publication number
- JPH0334848Y2 JPH0334848Y2 JP4637683U JP4637683U JPH0334848Y2 JP H0334848 Y2 JPH0334848 Y2 JP H0334848Y2 JP 4637683 U JP4637683 U JP 4637683U JP 4637683 U JP4637683 U JP 4637683U JP H0334848 Y2 JPH0334848 Y2 JP H0334848Y2
- Authority
- JP
- Japan
- Prior art keywords
- vertical
- conductor
- resin
- electronic component
- small electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 16
- 229920005989 resin Polymers 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 5
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 239000000725 suspension Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4637683U JPS59152762U (ja) | 1983-03-30 | 1983-03-30 | 小型電子部品 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4637683U JPS59152762U (ja) | 1983-03-30 | 1983-03-30 | 小型電子部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59152762U JPS59152762U (ja) | 1984-10-13 |
| JPH0334848Y2 true JPH0334848Y2 (US20100012521A1-20100121-C00001.png) | 1991-07-24 |
Family
ID=30176930
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4637683U Granted JPS59152762U (ja) | 1983-03-30 | 1983-03-30 | 小型電子部品 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59152762U (US20100012521A1-20100121-C00001.png) |
-
1983
- 1983-03-30 JP JP4637683U patent/JPS59152762U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59152762U (ja) | 1984-10-13 |
