JPH0332832B2 - - Google Patents

Info

Publication number
JPH0332832B2
JPH0332832B2 JP58066890A JP6689083A JPH0332832B2 JP H0332832 B2 JPH0332832 B2 JP H0332832B2 JP 58066890 A JP58066890 A JP 58066890A JP 6689083 A JP6689083 A JP 6689083A JP H0332832 B2 JPH0332832 B2 JP H0332832B2
Authority
JP
Japan
Prior art keywords
substrate
card
board
module
cards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58066890A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59193596A (ja
Inventor
Masao Muramatsu
Yoshihiko Nakahara
Toshio Haga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyodo Printing Co Ltd
Original Assignee
Kyodo Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyodo Printing Co Ltd filed Critical Kyodo Printing Co Ltd
Priority to JP58066890A priority Critical patent/JPS59193596A/ja
Publication of JPS59193596A publication Critical patent/JPS59193596A/ja
Publication of JPH0332832B2 publication Critical patent/JPH0332832B2/ja
Granted legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C17/00Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/531Shapes of wire connectors
    • H10W72/536Shapes of wire connectors the connected ends being ball-shaped
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/531Shapes of wire connectors
    • H10W72/5363Shapes of wire connectors the connected ends being wedge-shaped
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Credit Cards Or The Like (AREA)
JP58066890A 1983-04-18 1983-04-18 Icカ−ド用icモジユ−ル Granted JPS59193596A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58066890A JPS59193596A (ja) 1983-04-18 1983-04-18 Icカ−ド用icモジユ−ル

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58066890A JPS59193596A (ja) 1983-04-18 1983-04-18 Icカ−ド用icモジユ−ル

Publications (2)

Publication Number Publication Date
JPS59193596A JPS59193596A (ja) 1984-11-02
JPH0332832B2 true JPH0332832B2 (enExample) 1991-05-14

Family

ID=13328953

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58066890A Granted JPS59193596A (ja) 1983-04-18 1983-04-18 Icカ−ド用icモジユ−ル

Country Status (1)

Country Link
JP (1) JPS59193596A (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61133489A (ja) * 1984-12-03 1986-06-20 Mitsubishi Plastics Ind Ltd メモリ−カ−ド
JPH0752462B2 (ja) * 1985-03-04 1995-06-05 カシオ計算機株式会社 カ−ド状電子機器
JPH0524551Y2 (enExample) * 1985-07-26 1993-06-22
JPS6265270U (enExample) * 1985-10-15 1987-04-23
JPS6265275U (enExample) * 1985-10-16 1987-04-23
JPH0450145Y2 (enExample) * 1985-10-16 1992-11-26
JPS62124996A (ja) * 1985-11-25 1987-06-06 日本電気株式会社 Icカ−ド
JPS62109973U (enExample) * 1985-12-27 1987-07-13
JP2510520B2 (ja) * 1986-06-11 1996-06-26 大日本印刷株式会社 Icカ−ドおよびicカ−ド用icモジユ−ル
JP2524585B2 (ja) * 1986-12-15 1996-08-14 日立マクセル株式会社 Icカ−ドとその作製方法
US5384689A (en) * 1993-12-20 1995-01-24 Shen; Ming-Tung Integrated circuit chip including superimposed upper and lower printed circuit boards
JP2719315B2 (ja) * 1995-04-21 1998-02-25 マー レオナード マネージメント カンパニー カード装置
JPH08276688A (ja) * 1995-04-21 1996-10-22 Mahr Reonard Manag Co 回路チップ担持装置及びその製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5231672A (en) * 1975-09-05 1977-03-10 Hitachi Ltd Ceramic package
FR2404990A1 (fr) * 1977-10-03 1979-04-27 Cii Honeywell Bull Substrat d'interconnexion de composants electroniques a circuits integres, muni d'un dispositif de reparation
FR2404992A1 (fr) * 1977-10-03 1979-04-27 Cii Honeywell Bull Circuits electriques integres proteges, substrats d'interconnexion proteges comportant de tels circuits et procede d'obtention desdits circuits et substrats
FR2439438A1 (fr) * 1978-10-19 1980-05-16 Cii Honeywell Bull Ruban porteur de dispositifs de traitement de signaux electriques, son procede de fabrication et application de ce ruban a un element de traitement de signaux
FR2439478A1 (fr) * 1978-10-19 1980-05-16 Cii Honeywell Bull Boitier plat pour dispositifs a circuits integres
JPS55105398A (en) * 1979-02-08 1980-08-12 Cho Lsi Gijutsu Kenkyu Kumiai High packing density multilayer circuit board

Also Published As

Publication number Publication date
JPS59193596A (ja) 1984-11-02

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