JPH0332832B2 - - Google Patents
Info
- Publication number
- JPH0332832B2 JPH0332832B2 JP58066890A JP6689083A JPH0332832B2 JP H0332832 B2 JPH0332832 B2 JP H0332832B2 JP 58066890 A JP58066890 A JP 58066890A JP 6689083 A JP6689083 A JP 6689083A JP H0332832 B2 JPH0332832 B2 JP H0332832B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- card
- board
- module
- cards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C17/00—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Credit Cards Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58066890A JPS59193596A (ja) | 1983-04-18 | 1983-04-18 | Icカ−ド用icモジユ−ル |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58066890A JPS59193596A (ja) | 1983-04-18 | 1983-04-18 | Icカ−ド用icモジユ−ル |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59193596A JPS59193596A (ja) | 1984-11-02 |
| JPH0332832B2 true JPH0332832B2 (enExample) | 1991-05-14 |
Family
ID=13328953
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58066890A Granted JPS59193596A (ja) | 1983-04-18 | 1983-04-18 | Icカ−ド用icモジユ−ル |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59193596A (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61133489A (ja) * | 1984-12-03 | 1986-06-20 | Mitsubishi Plastics Ind Ltd | メモリ−カ−ド |
| JPH0752462B2 (ja) * | 1985-03-04 | 1995-06-05 | カシオ計算機株式会社 | カ−ド状電子機器 |
| JPH0524551Y2 (enExample) * | 1985-07-26 | 1993-06-22 | ||
| JPS6265270U (enExample) * | 1985-10-15 | 1987-04-23 | ||
| JPS6265275U (enExample) * | 1985-10-16 | 1987-04-23 | ||
| JPH0450145Y2 (enExample) * | 1985-10-16 | 1992-11-26 | ||
| JPS62124996A (ja) * | 1985-11-25 | 1987-06-06 | 日本電気株式会社 | Icカ−ド |
| JPS62109973U (enExample) * | 1985-12-27 | 1987-07-13 | ||
| JP2510520B2 (ja) * | 1986-06-11 | 1996-06-26 | 大日本印刷株式会社 | Icカ−ドおよびicカ−ド用icモジユ−ル |
| JP2524585B2 (ja) * | 1986-12-15 | 1996-08-14 | 日立マクセル株式会社 | Icカ−ドとその作製方法 |
| US5384689A (en) * | 1993-12-20 | 1995-01-24 | Shen; Ming-Tung | Integrated circuit chip including superimposed upper and lower printed circuit boards |
| JP2719315B2 (ja) * | 1995-04-21 | 1998-02-25 | マー レオナード マネージメント カンパニー | カード装置 |
| JPH08276688A (ja) * | 1995-04-21 | 1996-10-22 | Mahr Reonard Manag Co | 回路チップ担持装置及びその製造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5231672A (en) * | 1975-09-05 | 1977-03-10 | Hitachi Ltd | Ceramic package |
| FR2404990A1 (fr) * | 1977-10-03 | 1979-04-27 | Cii Honeywell Bull | Substrat d'interconnexion de composants electroniques a circuits integres, muni d'un dispositif de reparation |
| FR2404992A1 (fr) * | 1977-10-03 | 1979-04-27 | Cii Honeywell Bull | Circuits electriques integres proteges, substrats d'interconnexion proteges comportant de tels circuits et procede d'obtention desdits circuits et substrats |
| FR2439438A1 (fr) * | 1978-10-19 | 1980-05-16 | Cii Honeywell Bull | Ruban porteur de dispositifs de traitement de signaux electriques, son procede de fabrication et application de ce ruban a un element de traitement de signaux |
| FR2439478A1 (fr) * | 1978-10-19 | 1980-05-16 | Cii Honeywell Bull | Boitier plat pour dispositifs a circuits integres |
| JPS55105398A (en) * | 1979-02-08 | 1980-08-12 | Cho Lsi Gijutsu Kenkyu Kumiai | High packing density multilayer circuit board |
-
1983
- 1983-04-18 JP JP58066890A patent/JPS59193596A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59193596A (ja) | 1984-11-02 |
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