JPH0332221B2 - - Google Patents
Info
- Publication number
- JPH0332221B2 JPH0332221B2 JP62292526A JP29252687A JPH0332221B2 JP H0332221 B2 JPH0332221 B2 JP H0332221B2 JP 62292526 A JP62292526 A JP 62292526A JP 29252687 A JP29252687 A JP 29252687A JP H0332221 B2 JPH0332221 B2 JP H0332221B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive tape
- frame
- semiconductor wafer
- wafer
- mounting frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims description 143
- 239000002390 adhesive tape Substances 0.000 claims description 121
- 230000007246 mechanism Effects 0.000 claims description 61
- 230000007723 transport mechanism Effects 0.000 claims description 12
- 238000003708 edge detection Methods 0.000 claims description 9
- 230000032258 transport Effects 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 description 209
- 238000001514 detection method Methods 0.000 description 19
- 230000001681 protective effect Effects 0.000 description 17
- 238000000034 method Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- 230000003028 elevating effect Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000003042 antagnostic effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62292526A JPH01134946A (ja) | 1987-11-19 | 1987-11-19 | 半導体ウェハのマウント装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62292526A JPH01134946A (ja) | 1987-11-19 | 1987-11-19 | 半導体ウェハのマウント装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01134946A JPH01134946A (ja) | 1989-05-26 |
| JPH0332221B2 true JPH0332221B2 (forum.php) | 1991-05-10 |
Family
ID=17782947
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62292526A Granted JPH01134946A (ja) | 1987-11-19 | 1987-11-19 | 半導体ウェハのマウント装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01134946A (forum.php) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101726544B1 (ko) * | 2016-03-04 | 2017-04-12 | 주식회사 호남샤니 | 만쥬빵 깨 자동도포기 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109940314B (zh) * | 2019-02-19 | 2020-09-15 | 北汽福田汽车股份有限公司 | 白车身输送定位系统及输送定位方法 |
-
1987
- 1987-11-19 JP JP62292526A patent/JPH01134946A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101726544B1 (ko) * | 2016-03-04 | 2017-04-12 | 주식회사 호남샤니 | 만쥬빵 깨 자동도포기 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01134946A (ja) | 1989-05-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080510 Year of fee payment: 17 |