JPH0324786B2 - - Google Patents

Info

Publication number
JPH0324786B2
JPH0324786B2 JP58060984A JP6098483A JPH0324786B2 JP H0324786 B2 JPH0324786 B2 JP H0324786B2 JP 58060984 A JP58060984 A JP 58060984A JP 6098483 A JP6098483 A JP 6098483A JP H0324786 B2 JPH0324786 B2 JP H0324786B2
Authority
JP
Japan
Prior art keywords
flat semiconductor
cooling piece
cooling
semiconductor element
flat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58060984A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59188157A (ja
Inventor
Hiroshi Itahana
Takahiro Fujisawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58060984A priority Critical patent/JPS59188157A/ja
Publication of JPS59188157A publication Critical patent/JPS59188157A/ja
Publication of JPH0324786B2 publication Critical patent/JPH0324786B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Landscapes

  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP58060984A 1983-04-08 1983-04-08 平形半導体スタツク Granted JPS59188157A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58060984A JPS59188157A (ja) 1983-04-08 1983-04-08 平形半導体スタツク

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58060984A JPS59188157A (ja) 1983-04-08 1983-04-08 平形半導体スタツク

Publications (2)

Publication Number Publication Date
JPS59188157A JPS59188157A (ja) 1984-10-25
JPH0324786B2 true JPH0324786B2 (https=) 1991-04-04

Family

ID=13158201

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58060984A Granted JPS59188157A (ja) 1983-04-08 1983-04-08 平形半導体スタツク

Country Status (1)

Country Link
JP (1) JPS59188157A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6233794B2 (ja) * 2013-04-03 2017-11-22 京セラ株式会社 圧接型電力用半導体装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5844599Y2 (ja) * 1978-05-16 1983-10-08 三菱電機株式会社 半導体装置
JPS55159563U (https=) * 1979-05-01 1980-11-15

Also Published As

Publication number Publication date
JPS59188157A (ja) 1984-10-25

Similar Documents

Publication Publication Date Title
US4047197A (en) Housing and lead structure for a series connected semiconductor rectifier arrangement
JP4220094B2 (ja) パワー半導体モジュール
US3936704A (en) Mounting arrangement for electronic semi-conductor devices
JPH0324786B2 (https=)
EP0788152B1 (en) Internal compression bonded semiconductor device with a chip frame enabling a longer creepage distance
JPH0329288A (ja) 固定抵抗器
JPH04365303A (ja) 正抵抗温度係数発熱体およびその製造方法
JPH02299411A (ja) 平行配線による平形導体の接続装置
JP2001351764A (ja) 正特性セラミック発熱体ユニット
JP2598257B2 (ja) 熱電発電装置
US2509342A (en) Electrical rectifier construction
JPH0758746B2 (ja) 樹脂封止型半導体装置
JPS601508Y2 (ja) セラミックヒ−タ−装置
JPH0328518Y2 (https=)
JPWO2023136056A5 (https=)
JPS586617Y2 (ja) 半田こて
US2721964A (en) Power transmission
JPH0121510Y2 (https=)
JPH03201543A (ja) 圧接型半導体装置
JPH0512961Y2 (https=)
JPS5846177B2 (ja) 半導体装置
JPH0597087U (ja) 正特性サーミスタ発熱体
JPS6159661B2 (https=)
JPS5929359Y2 (ja) 正特性サ−ミスタを用いた発熱体装置
JPH0332045Y2 (https=)