JPS59188157A - 平形半導体スタツク - Google Patents

平形半導体スタツク

Info

Publication number
JPS59188157A
JPS59188157A JP58060984A JP6098483A JPS59188157A JP S59188157 A JPS59188157 A JP S59188157A JP 58060984 A JP58060984 A JP 58060984A JP 6098483 A JP6098483 A JP 6098483A JP S59188157 A JPS59188157 A JP S59188157A
Authority
JP
Japan
Prior art keywords
flat semiconductor
conductor
cooling
flat
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58060984A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0324786B2 (https=
Inventor
Hiroshi Itahana
板鼻　博
Takahiro Fujisawa
藤沢　孝博
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58060984A priority Critical patent/JPS59188157A/ja
Publication of JPS59188157A publication Critical patent/JPS59188157A/ja
Publication of JPH0324786B2 publication Critical patent/JPH0324786B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Landscapes

  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP58060984A 1983-04-08 1983-04-08 平形半導体スタツク Granted JPS59188157A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58060984A JPS59188157A (ja) 1983-04-08 1983-04-08 平形半導体スタツク

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58060984A JPS59188157A (ja) 1983-04-08 1983-04-08 平形半導体スタツク

Publications (2)

Publication Number Publication Date
JPS59188157A true JPS59188157A (ja) 1984-10-25
JPH0324786B2 JPH0324786B2 (https=) 1991-04-04

Family

ID=13158201

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58060984A Granted JPS59188157A (ja) 1983-04-08 1983-04-08 平形半導体スタツク

Country Status (1)

Country Link
JP (1) JPS59188157A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014203903A (ja) * 2013-04-03 2014-10-27 インターユニット株式会社 圧接型電力用半導体装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54166531U (https=) * 1978-05-16 1979-11-22
JPS55159563U (https=) * 1979-05-01 1980-11-15

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54166531U (https=) * 1978-05-16 1979-11-22
JPS55159563U (https=) * 1979-05-01 1980-11-15

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014203903A (ja) * 2013-04-03 2014-10-27 インターユニット株式会社 圧接型電力用半導体装置

Also Published As

Publication number Publication date
JPH0324786B2 (https=) 1991-04-04

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