JPH0322919Y2 - - Google Patents
Info
- Publication number
- JPH0322919Y2 JPH0322919Y2 JP1984178563U JP17856384U JPH0322919Y2 JP H0322919 Y2 JPH0322919 Y2 JP H0322919Y2 JP 1984178563 U JP1984178563 U JP 1984178563U JP 17856384 U JP17856384 U JP 17856384U JP H0322919 Y2 JPH0322919 Y2 JP H0322919Y2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- heat sink
- flat
- groove
- amount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000002093 peripheral effect Effects 0.000 claims description 20
- 229910000679 solder Inorganic materials 0.000 description 70
- 239000004065 semiconductor Substances 0.000 description 23
- 239000000758 substrate Substances 0.000 description 10
- 238000007747 plating Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 239000011888 foil Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
- H01L2224/26152—Auxiliary members for layer connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
- H01L2224/26175—Flow barriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984178563U JPH0322919Y2 (US20030220297A1-20031127-C00033.png) | 1984-11-24 | 1984-11-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984178563U JPH0322919Y2 (US20030220297A1-20031127-C00033.png) | 1984-11-24 | 1984-11-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6194356U JPS6194356U (US20030220297A1-20031127-C00033.png) | 1986-06-18 |
| JPH0322919Y2 true JPH0322919Y2 (US20030220297A1-20031127-C00033.png) | 1991-05-20 |
Family
ID=30736128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984178563U Expired JPH0322919Y2 (US20030220297A1-20031127-C00033.png) | 1984-11-24 | 1984-11-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0322919Y2 (US20030220297A1-20031127-C00033.png) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5027013B2 (ja) * | 2008-03-03 | 2012-09-19 | 古河電気工業株式会社 | コネクタ用めっき角線材料 |
| JP2021145081A (ja) * | 2020-03-13 | 2021-09-24 | 日立Astemo株式会社 | 半導体装置の製造方法および半導体装置 |
-
1984
- 1984-11-24 JP JP1984178563U patent/JPH0322919Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6194356U (US20030220297A1-20031127-C00033.png) | 1986-06-18 |
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