JPH0322916B2 - - Google Patents
Info
- Publication number
- JPH0322916B2 JPH0322916B2 JP13121682A JP13121682A JPH0322916B2 JP H0322916 B2 JPH0322916 B2 JP H0322916B2 JP 13121682 A JP13121682 A JP 13121682A JP 13121682 A JP13121682 A JP 13121682A JP H0322916 B2 JPH0322916 B2 JP H0322916B2
- Authority
- JP
- Japan
- Prior art keywords
- thermal conductivity
- heat
- mhr
- electrical insulation
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000853 adhesive Substances 0.000 claims description 15
- 230000001070 adhesive effect Effects 0.000 claims description 15
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 11
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 10
- 239000000919 ceramic Substances 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- 229920003002 synthetic resin Polymers 0.000 claims description 6
- 239000000057 synthetic resin Substances 0.000 claims description 6
- 229920001187 thermosetting polymer Polymers 0.000 claims description 5
- 238000010292 electrical insulation Methods 0.000 description 10
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- 239000000843 powder Substances 0.000 description 5
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 239000004814 polyurethane Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000002966 varnish Substances 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000011246 composite particle Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13121682A JPS5922974A (ja) | 1982-07-29 | 1982-07-29 | 耐熱性接着剤 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13121682A JPS5922974A (ja) | 1982-07-29 | 1982-07-29 | 耐熱性接着剤 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5922974A JPS5922974A (ja) | 1984-02-06 |
| JPH0322916B2 true JPH0322916B2 (enrdf_load_stackoverflow) | 1991-03-27 |
Family
ID=15052746
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13121682A Granted JPS5922974A (ja) | 1982-07-29 | 1982-07-29 | 耐熱性接着剤 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5922974A (enrdf_load_stackoverflow) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61157569A (ja) * | 1984-12-28 | 1986-07-17 | Shin Etsu Polymer Co Ltd | 熱伝導性接着組成物 |
| JPS6440586A (en) * | 1987-08-07 | 1989-02-10 | Hitachi Chemical Co Ltd | Adhesive composition |
| JP2736364B2 (ja) * | 1990-03-23 | 1998-04-02 | 日本電信電話株式会社 | 高強度接着剤 |
| JP2009230092A (ja) * | 2008-02-27 | 2009-10-08 | Kyocera Corp | 光アイソレータモジュールおよびそれを用いた光素子モジュール |
| CN104379668B (zh) * | 2012-06-12 | 2016-12-07 | 三菱瓦斯化学株式会社 | 树脂组合物、预浸料、覆金属箔层叠板及印刷布线板 |
-
1982
- 1982-07-29 JP JP13121682A patent/JPS5922974A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5922974A (ja) | 1984-02-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0322908B2 (enrdf_load_stackoverflow) | ||
| CN102838962A (zh) | 一种环氧树脂胶粘剂及其制备方法 | |
| JPH0369953B2 (enrdf_load_stackoverflow) | ||
| JPH0322916B2 (enrdf_load_stackoverflow) | ||
| KR880009313A (ko) | 내열성 절연피복재 및 이것을 이용한 써말 헤드 | |
| JPH02227451A (ja) | 樹脂用充填材及び液状エポキシ樹脂組成物 | |
| JPS6183218A (ja) | エポキシ樹脂組成物 | |
| JPH0355203Y2 (enrdf_load_stackoverflow) | ||
| JPS59142270A (ja) | 耐熱性導電性接着剤 | |
| JPH06104542A (ja) | 金属ベース配線基板 | |
| JPS61148274A (ja) | エポキシ樹脂粉体塗料組成物 | |
| US2945829A (en) | High temperature alkyd resin varnish | |
| JPS626571B2 (enrdf_load_stackoverflow) | ||
| JPH06136300A (ja) | 導電性ペースト組成物 | |
| JPS6069127A (ja) | エポキシ樹脂組成物 | |
| JPH04288381A (ja) | 耐熱塗料 | |
| SU785336A1 (ru) | Клей | |
| JPS61151231A (ja) | 液状エポキシ樹脂組成物 | |
| JPS5941358A (ja) | 耐熱接着剤用組成物 | |
| JPS5923081B2 (ja) | 抵抗器 | |
| JPH06157681A (ja) | 熱硬化性樹脂組成物 | |
| JPS5761020A (en) | Curing agent for epoxy resin | |
| JPS59182278A (ja) | 自硬性耐火組成物 | |
| JPS5792019A (en) | Preparation of imidazole mixture assuming liquidity at room temperature | |
| JPS61502336A (ja) | 高耐熱性電気絶縁被覆用粉体 |