JPS5922974A - 耐熱性接着剤 - Google Patents
耐熱性接着剤Info
- Publication number
- JPS5922974A JPS5922974A JP13121682A JP13121682A JPS5922974A JP S5922974 A JPS5922974 A JP S5922974A JP 13121682 A JP13121682 A JP 13121682A JP 13121682 A JP13121682 A JP 13121682A JP S5922974 A JPS5922974 A JP S5922974A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- electrical insulation
- thermal conductivity
- coated
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 18
- 239000000853 adhesive Substances 0.000 title claims abstract description 17
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 8
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 8
- 239000000919 ceramic Substances 0.000 claims abstract description 7
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 7
- 239000000057 synthetic resin Substances 0.000 claims abstract description 7
- 238000010292 electrical insulation Methods 0.000 abstract description 11
- 239000002245 particle Substances 0.000 abstract description 8
- 239000005011 phenolic resin Substances 0.000 abstract description 4
- 229920001296 polysiloxane Polymers 0.000 abstract description 4
- 229920002635 polyurethane Polymers 0.000 abstract description 4
- 239000004814 polyurethane Substances 0.000 abstract description 4
- 239000002966 varnish Substances 0.000 abstract description 4
- 229920001568 phenolic resin Polymers 0.000 abstract description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract description 2
- 239000003822 epoxy resin Substances 0.000 abstract description 2
- 239000010410 layer Substances 0.000 abstract description 2
- 229920000647 polyepoxide Polymers 0.000 abstract description 2
- 239000002345 surface coating layer Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 239000000843 powder Substances 0.000 description 5
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 241000209094 Oryza Species 0.000 description 2
- 235000007164 Oryza sativa Nutrition 0.000 description 2
- 235000013339 cereals Nutrition 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000011246 composite particle Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 235000009566 rice Nutrition 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 101710097452 4-diphosphocytidyl-2-C-methyl-D-erythritol kinase, chloroplastic Proteins 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13121682A JPS5922974A (ja) | 1982-07-29 | 1982-07-29 | 耐熱性接着剤 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13121682A JPS5922974A (ja) | 1982-07-29 | 1982-07-29 | 耐熱性接着剤 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5922974A true JPS5922974A (ja) | 1984-02-06 |
| JPH0322916B2 JPH0322916B2 (enrdf_load_stackoverflow) | 1991-03-27 |
Family
ID=15052746
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13121682A Granted JPS5922974A (ja) | 1982-07-29 | 1982-07-29 | 耐熱性接着剤 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5922974A (enrdf_load_stackoverflow) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61157569A (ja) * | 1984-12-28 | 1986-07-17 | Shin Etsu Polymer Co Ltd | 熱伝導性接着組成物 |
| JPS6440586A (en) * | 1987-08-07 | 1989-02-10 | Hitachi Chemical Co Ltd | Adhesive composition |
| JPH03273080A (ja) * | 1990-03-23 | 1991-12-04 | Nippon Telegr & Teleph Corp <Ntt> | 高強度接着剤 |
| JP2009230092A (ja) * | 2008-02-27 | 2009-10-08 | Kyocera Corp | 光アイソレータモジュールおよびそれを用いた光素子モジュール |
| WO2013187303A1 (ja) * | 2012-06-12 | 2013-12-19 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、金属箔張積層板及びプリント配線板 |
-
1982
- 1982-07-29 JP JP13121682A patent/JPS5922974A/ja active Granted
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61157569A (ja) * | 1984-12-28 | 1986-07-17 | Shin Etsu Polymer Co Ltd | 熱伝導性接着組成物 |
| JPS6440586A (en) * | 1987-08-07 | 1989-02-10 | Hitachi Chemical Co Ltd | Adhesive composition |
| JPH03273080A (ja) * | 1990-03-23 | 1991-12-04 | Nippon Telegr & Teleph Corp <Ntt> | 高強度接着剤 |
| JP2009230092A (ja) * | 2008-02-27 | 2009-10-08 | Kyocera Corp | 光アイソレータモジュールおよびそれを用いた光素子モジュール |
| WO2013187303A1 (ja) * | 2012-06-12 | 2013-12-19 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、金属箔張積層板及びプリント配線板 |
| CN104379668A (zh) * | 2012-06-12 | 2015-02-25 | 三菱瓦斯化学株式会社 | 树脂组合物、预浸料、覆金属箔层叠板及印刷布线板 |
| JPWO2013187303A1 (ja) * | 2012-06-12 | 2016-02-04 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、金属箔張積層板及びプリント配線板 |
| US9832870B2 (en) | 2012-06-12 | 2017-11-28 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, prepreg, metal foil-clad laminate and printed wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0322916B2 (enrdf_load_stackoverflow) | 1991-03-27 |
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