JPH0319258Y2 - - Google Patents
Info
- Publication number
- JPH0319258Y2 JPH0319258Y2 JP1981159192U JP15919281U JPH0319258Y2 JP H0319258 Y2 JPH0319258 Y2 JP H0319258Y2 JP 1981159192 U JP1981159192 U JP 1981159192U JP 15919281 U JP15919281 U JP 15919281U JP H0319258 Y2 JPH0319258 Y2 JP H0319258Y2
- Authority
- JP
- Japan
- Prior art keywords
- thermal expansion
- bonded
- hybrid integrated
- members
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005219 brazing Methods 0.000 claims description 8
- 238000004026 adhesive bonding Methods 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15919281U JPS5866690U (ja) | 1981-10-26 | 1981-10-26 | ハイブリツド集積回路 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15919281U JPS5866690U (ja) | 1981-10-26 | 1981-10-26 | ハイブリツド集積回路 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5866690U JPS5866690U (ja) | 1983-05-06 |
| JPH0319258Y2 true JPH0319258Y2 (ko) | 1991-04-23 |
Family
ID=29951654
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15919281U Granted JPS5866690U (ja) | 1981-10-26 | 1981-10-26 | ハイブリツド集積回路 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5866690U (ko) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55162297A (en) * | 1979-06-04 | 1980-12-17 | Fujitsu Ltd | Method of mounting microwave integrated circuit board |
-
1981
- 1981-10-26 JP JP15919281U patent/JPS5866690U/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55162297A (en) * | 1979-06-04 | 1980-12-17 | Fujitsu Ltd | Method of mounting microwave integrated circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5866690U (ja) | 1983-05-06 |
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