JPH0316333U - - Google Patents

Info

Publication number
JPH0316333U
JPH0316333U JP7717089U JP7717089U JPH0316333U JP H0316333 U JPH0316333 U JP H0316333U JP 7717089 U JP7717089 U JP 7717089U JP 7717089 U JP7717089 U JP 7717089U JP H0316333 U JPH0316333 U JP H0316333U
Authority
JP
Japan
Prior art keywords
cavity
pellet
heat sink
resin
mounting surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7717089U
Other languages
English (en)
Other versions
JP2535926Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989077170U priority Critical patent/JP2535926Y2/ja
Publication of JPH0316333U publication Critical patent/JPH0316333U/ja
Application granted granted Critical
Publication of JP2535926Y2 publication Critical patent/JP2535926Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図は本考案に係る樹脂モールド装置の一実
施例を示す断面図、第２図及び第３図は第１図の
樹脂モールド装置の流量調整用位置決めブロツク
の二例を示す斜視図、第４図は樹脂流入途中の状
態を示す樹脂モールド装置の断面図、第５図は樹
脂流入完了状態を示す樹脂モールド装置の断面図
、第６図は樹脂モールドを完了した半導体装置を
示す斜視図である。第７図は樹脂モールド装置の
従来例を示す断面図である。 ２１……上金型、２２……下金型、２３……キ
ヤビテイ、２４……放熱板、２５……半導体ペレ
ツト、２６……リードフレーム、２７……リード
、２８……ゲート、２９……流量調整用位置決め
ブロツク。

Claims (1)

    【実用新案登録請求の範囲】
  1. 上下一対の金型の衝合面に、少さくとも一本の
    リードが連結され半導体ペレツトをマウントした
    放熱板を収容するキヤビテイを穿設し。各キヤビ
    テイの上記リード連結部と反対側の放熱板端部と
    対向する位置に樹脂を注入するゲートを設け、キ
    ヤビテイ内のゲート側で放熱板のペレツトマウン
    ト面を支持してペレツト非マウント面とキヤビテ
    イとの対向間隔を微小保ち、かつ、ペレツトマウ
    ント面側の樹脂流量を調整する位置決めブロツク
    を上下動自在に設けたことを特徴とする樹脂モー
    ルド装置。
JP1989077170U 1989-06-29 1989-06-29 樹脂モールド装置 Expired - Lifetime JP2535926Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989077170U JP2535926Y2 (ja) 1989-06-29 1989-06-29 樹脂モールド装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989077170U JP2535926Y2 (ja) 1989-06-29 1989-06-29 樹脂モールド装置

Publications (2)

Publication Number Publication Date
JPH0316333U true JPH0316333U (ja) 1991-02-19
JP2535926Y2 JP2535926Y2 (ja) 1997-05-14

Family

ID=31619306

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989077170U Expired - Lifetime JP2535926Y2 (ja) 1989-06-29 1989-06-29 樹脂モールド装置

Country Status (1)

Country Link
JP (1) JP2535926Y2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001169951A (ja) * 1999-10-05 2001-06-26 Sanga:Kk 入浴用補助具
JP2013074035A (ja) * 2011-09-27 2013-04-22 Mitsubishi Electric Corp 半導体装置の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60130129A (ja) * 1983-12-16 1985-07-11 Nec Corp 絶縁型半導体素子の樹脂封止方法
JPS62131525A (ja) * 1985-12-03 1987-06-13 Nec Kansai Ltd 半導体装置の製造方法
JPH01292834A (ja) * 1988-05-20 1989-11-27 Nec Corp 樹脂封止型半導体製造装置
JPH02110946A (ja) * 1988-10-20 1990-04-24 Sanken Electric Co Ltd 樹脂封止型電子部品の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60130129A (ja) * 1983-12-16 1985-07-11 Nec Corp 絶縁型半導体素子の樹脂封止方法
JPS62131525A (ja) * 1985-12-03 1987-06-13 Nec Kansai Ltd 半導体装置の製造方法
JPH01292834A (ja) * 1988-05-20 1989-11-27 Nec Corp 樹脂封止型半導体製造装置
JPH02110946A (ja) * 1988-10-20 1990-04-24 Sanken Electric Co Ltd 樹脂封止型電子部品の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001169951A (ja) * 1999-10-05 2001-06-26 Sanga:Kk 入浴用補助具
JP2013074035A (ja) * 2011-09-27 2013-04-22 Mitsubishi Electric Corp 半導体装置の製造方法

Also Published As

Publication number Publication date
JP2535926Y2 (ja) 1997-05-14

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