JPH0312469B2 - - Google Patents

Info

Publication number
JPH0312469B2
JPH0312469B2 JP56003391A JP339181A JPH0312469B2 JP H0312469 B2 JPH0312469 B2 JP H0312469B2 JP 56003391 A JP56003391 A JP 56003391A JP 339181 A JP339181 A JP 339181A JP H0312469 B2 JPH0312469 B2 JP H0312469B2
Authority
JP
Japan
Prior art keywords
metal pattern
insulating substrate
metal
outline
chip carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56003391A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57117260A (en
Inventor
Takashi Abe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP56003391A priority Critical patent/JPS57117260A/ja
Publication of JPS57117260A publication Critical patent/JPS57117260A/ja
Publication of JPH0312469B2 publication Critical patent/JPH0312469B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP56003391A 1981-01-13 1981-01-13 Semiconductor device Granted JPS57117260A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56003391A JPS57117260A (en) 1981-01-13 1981-01-13 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56003391A JPS57117260A (en) 1981-01-13 1981-01-13 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS57117260A JPS57117260A (en) 1982-07-21
JPH0312469B2 true JPH0312469B2 (OSRAM) 1991-02-20

Family

ID=11556058

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56003391A Granted JPS57117260A (en) 1981-01-13 1981-01-13 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57117260A (OSRAM)

Also Published As

Publication number Publication date
JPS57117260A (en) 1982-07-21

Similar Documents

Publication Publication Date Title
JP3862870B2 (ja) 半田レスの端子金具を備えた電気部品
US20010001748A1 (en) Conduction assist member and manufacturing method of the same
JP3080175B2 (ja) 半導体チップ用の支持部材
JPS6113583A (ja) 高周波コネクタ
JPH11507769A (ja) テープボールグリッドアレイ回路に用いられるフレキシブルリード
KR100407751B1 (ko) 반도체장치
JP2745933B2 (ja) Ｔａｂ−集積回路
JP3085572B2 (ja) 接続用端子
JPH0312469B2 (OSRAM)
JPS62118555A (ja) 集積回路パツケ−ジ
JPH0626280U (ja) 半導体装置のリード構造
JPH05326648A (ja) フィルムキャリアとこれを用いた半導体装置の製造方法
JPH1040984A (ja) 端子装置及びその製造方法
JP3563202B2 (ja) 電子部品
JP2731584B2 (ja) リードフレーム及びこれを用いた電子部品パッケージの製造方法
JPS6143857B2 (OSRAM)
JP3758002B2 (ja) 電子部品
JPH09199242A (ja) プリント配線板一体型コネクタ及びその製造方法
JP2658817B2 (ja) 電子部品のリード
JP2001015198A (ja) エレクトロニクスパッケージとこれに接続されて使用するコンタクトとこのパッケージの構成方法
JPS6091577A (ja) リードのない平板状回路を接続する装置とコネクタ
JPS59117147A (ja) 複合電子部品
JP2011228387A (ja) 半導体装置およびその製造方法
JPH02285602A (ja) 電子部品
JP2542956Y2 (ja) 電気部品の端子取付構造