JPS57117260A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS57117260A JPS57117260A JP56003391A JP339181A JPS57117260A JP S57117260 A JPS57117260 A JP S57117260A JP 56003391 A JP56003391 A JP 56003391A JP 339181 A JP339181 A JP 339181A JP S57117260 A JPS57117260 A JP S57117260A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- overhung
- patterns
- metal
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56003391A JPS57117260A (en) | 1981-01-13 | 1981-01-13 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56003391A JPS57117260A (en) | 1981-01-13 | 1981-01-13 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57117260A true JPS57117260A (en) | 1982-07-21 |
| JPH0312469B2 JPH0312469B2 (OSRAM) | 1991-02-20 |
Family
ID=11556058
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56003391A Granted JPS57117260A (en) | 1981-01-13 | 1981-01-13 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57117260A (OSRAM) |
-
1981
- 1981-01-13 JP JP56003391A patent/JPS57117260A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0312469B2 (OSRAM) | 1991-02-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0412545A2 (en) | IC package and IC card incorporating the same thereinto | |
| GB2090071B (en) | Bonding with a conductive adhesive | |
| EP0055578A3 (en) | Integrated circuit package | |
| AU1339797A (en) | Multi-chip device and method of fabrication employing leads over and under processes | |
| KR920001689A (ko) | 반도체장치 및 그 제조방법 | |
| HK70887A (en) | Semiconductor device and a method of producing the same | |
| KR960012397A (ko) | 칩 사이즈 패키지형 반도체 장치의 제조 방법 | |
| CA2171458A1 (en) | Multi-chip module | |
| IE56411B1 (en) | Integrated circuit chip carrier | |
| GB2289985B (en) | Method of connecting the output pads on an integrated circuit chip,and multichip module thus obtained | |
| TW365035B (en) | Semiconductor device package having a board, manufacturing method thereof and stack package using the same | |
| KR900019545A (ko) | 표면장착용 배선기판의 제조방법 | |
| TW243550B (en) | Semiconductor having a solder bump and process | |
| JPS57117260A (en) | Semiconductor device | |
| KR850006259A (ko) | 수지봉합형 반도체 장치의 제조방법 | |
| CN210640175U (zh) | 电子芯片封装结构 | |
| JPS57136352A (en) | Semiconductor device of resin potted type | |
| JPS5559746A (en) | Semiconductor device and its mounting circuit device | |
| EP0698920A3 (en) | A method for assembling integrated circuits upon printed circuit boards | |
| JPS5669850A (en) | Method for sealing semiconductor device | |
| JPS54114975A (en) | Semiconductor device | |
| JPS56155556A (en) | Semiconductor device | |
| KR100374661B1 (ko) | 배선 기판, 그 제조 방법 및 반도체 장치 | |
| JPH09223767A (ja) | リードフレーム | |
| KR100369501B1 (ko) | 반도체패키지 |