JPH0311903Y2 - - Google Patents
Info
- Publication number
- JPH0311903Y2 JPH0311903Y2 JP1983161282U JP16128283U JPH0311903Y2 JP H0311903 Y2 JPH0311903 Y2 JP H0311903Y2 JP 1983161282 U JP1983161282 U JP 1983161282U JP 16128283 U JP16128283 U JP 16128283U JP H0311903 Y2 JPH0311903 Y2 JP H0311903Y2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- conductive
- paint layer
- conductive paint
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003973 paint Substances 0.000 claims description 80
- 238000007747 plating Methods 0.000 claims description 29
- 239000011888 foil Substances 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000010410 layer Substances 0.000 description 84
- 239000000758 substrate Substances 0.000 description 16
- 229920005989 resin Polymers 0.000 description 14
- 239000011347 resin Substances 0.000 description 14
- 239000007788 liquid Substances 0.000 description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 230000008602 contraction Effects 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 229920001568 phenolic resin Polymers 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16128283U JPS6071173U (ja) | 1983-10-20 | 1983-10-20 | 電子回路用基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16128283U JPS6071173U (ja) | 1983-10-20 | 1983-10-20 | 電子回路用基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6071173U JPS6071173U (ja) | 1985-05-20 |
| JPH0311903Y2 true JPH0311903Y2 (ko) | 1991-03-20 |
Family
ID=30354495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16128283U Granted JPS6071173U (ja) | 1983-10-20 | 1983-10-20 | 電子回路用基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6071173U (ko) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100332970B1 (ko) * | 1998-12-08 | 2002-09-17 | 주식회사 심텍 | 피씨비기판슬롯단자의블라인드비아홀및그형성방법 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS519143A (en) * | 1974-07-15 | 1976-01-24 | Matsushita Electric Works Ltd | Netsukasoseijushitairumoyotsukeyo chitsupuseikeihoho |
| JPS5874097A (ja) * | 1981-10-29 | 1983-05-04 | 松下電器産業株式会社 | 印刷配線板の製造方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49109144U (ko) * | 1973-01-16 | 1974-09-18 |
-
1983
- 1983-10-20 JP JP16128283U patent/JPS6071173U/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS519143A (en) * | 1974-07-15 | 1976-01-24 | Matsushita Electric Works Ltd | Netsukasoseijushitairumoyotsukeyo chitsupuseikeihoho |
| JPS5874097A (ja) * | 1981-10-29 | 1983-05-04 | 松下電器産業株式会社 | 印刷配線板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6071173U (ja) | 1985-05-20 |
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