JPH0341473Y2 - - Google Patents
Info
- Publication number
- JPH0341473Y2 JPH0341473Y2 JP18473785U JP18473785U JPH0341473Y2 JP H0341473 Y2 JPH0341473 Y2 JP H0341473Y2 JP 18473785 U JP18473785 U JP 18473785U JP 18473785 U JP18473785 U JP 18473785U JP H0341473 Y2 JPH0341473 Y2 JP H0341473Y2
- Authority
- JP
- Japan
- Prior art keywords
- cap
- substrate
- semiconductor
- metal
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 74
- 239000000758 substrate Substances 0.000 claims description 47
- 229910052751 metal Inorganic materials 0.000 claims description 41
- 239000002184 metal Substances 0.000 claims description 41
- 239000004020 conductor Substances 0.000 claims description 33
- 239000011247 coating layer Substances 0.000 claims description 22
- 238000007789 sealing Methods 0.000 claims description 22
- 239000010410 layer Substances 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 239000011368 organic material Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 2
- 238000007747 plating Methods 0.000 description 11
- 239000011347 resin Substances 0.000 description 11
- 229920005989 resin Polymers 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 239000000463 material Substances 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical group [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
- 229910001174 tin-lead alloy Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18473785U JPH0341473Y2 (ko) | 1985-11-30 | 1985-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18473785U JPH0341473Y2 (ko) | 1985-11-30 | 1985-11-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6292648U JPS6292648U (ko) | 1987-06-13 |
| JPH0341473Y2 true JPH0341473Y2 (ko) | 1991-08-30 |
Family
ID=31132695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18473785U Expired JPH0341473Y2 (ko) | 1985-11-30 | 1985-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0341473Y2 (ko) |
-
1985
- 1985-11-30 JP JP18473785U patent/JPH0341473Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6292648U (ko) | 1987-06-13 |
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