JPH0297461A - チタン酸バリウム系半導体セラミックス成形体の製造方法 - Google Patents
チタン酸バリウム系半導体セラミックス成形体の製造方法Info
- Publication number
- JPH0297461A JPH0297461A JP63250391A JP25039188A JPH0297461A JP H0297461 A JPH0297461 A JP H0297461A JP 63250391 A JP63250391 A JP 63250391A JP 25039188 A JP25039188 A JP 25039188A JP H0297461 A JPH0297461 A JP H0297461A
- Authority
- JP
- Japan
- Prior art keywords
- parts
- pts
- weight
- molded body
- wax
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910002113 barium titanate Inorganic materials 0.000 title claims abstract description 10
- 239000004065 semiconductor Substances 0.000 title claims abstract description 7
- 239000000919 ceramic Substances 0.000 title claims description 28
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 title claims description 7
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000000843 powder Substances 0.000 claims abstract description 23
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 9
- 238000001746 injection moulding Methods 0.000 claims abstract description 7
- 239000000203 mixture Substances 0.000 claims abstract description 5
- 239000002994 raw material Substances 0.000 claims description 15
- 239000012756 surface treatment agent Substances 0.000 claims description 6
- 238000010304 firing Methods 0.000 claims description 4
- 239000001993 wax Substances 0.000 abstract description 14
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 abstract description 10
- 239000004014 plasticizer Substances 0.000 abstract description 7
- 239000002245 particle Substances 0.000 abstract description 6
- 239000004793 Polystyrene Substances 0.000 abstract description 4
- 229920002223 polystyrene Polymers 0.000 abstract description 4
- 238000002844 melting Methods 0.000 abstract description 3
- 230000008018 melting Effects 0.000 abstract description 3
- 150000001413 amino acids Chemical class 0.000 abstract description 2
- 239000012188 paraffin wax Substances 0.000 abstract description 2
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- 239000007858 starting material Substances 0.000 abstract 2
- 238000002156 mixing Methods 0.000 abstract 1
- 238000005245 sintering Methods 0.000 abstract 1
- 239000011230 binding agent Substances 0.000 description 11
- 238000000465 moulding Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 6
- -1 Polyethylene Polymers 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000004413 injection moulding compound Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000004200 microcrystalline wax Substances 0.000 description 1
- 235000019808 microcrystalline wax Nutrition 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001490 poly(butyl methacrylate) polymer Polymers 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229910001404 rare earth metal oxide Inorganic materials 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
- H01C7/022—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient mainly consisting of non-metallic substances
- H01C7/023—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient mainly consisting of non-metallic substances containing oxides or oxidic compounds, e.g. ferrites
- H01C7/025—Perovskites, e.g. titanates
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Thermistors And Varistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63250391A JPH0297461A (ja) | 1988-10-03 | 1988-10-03 | チタン酸バリウム系半導体セラミックス成形体の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63250391A JPH0297461A (ja) | 1988-10-03 | 1988-10-03 | チタン酸バリウム系半導体セラミックス成形体の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0297461A true JPH0297461A (ja) | 1990-04-10 |
| JPH0529624B2 JPH0529624B2 (enrdf_load_stackoverflow) | 1993-05-06 |
Family
ID=17207217
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63250391A Granted JPH0297461A (ja) | 1988-10-03 | 1988-10-03 | チタン酸バリウム系半導体セラミックス成形体の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0297461A (enrdf_load_stackoverflow) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011506238A (ja) * | 2007-12-05 | 2011-03-03 | エプコス アクチエンゲゼルシャフト | 原料および原料を調製する方法 |
| JP2011506127A (ja) * | 2007-12-05 | 2011-03-03 | エプコス アクチエンゲゼルシャフト | 射出成形されたｐｔｃセラミック |
| US7973639B2 (en) | 2007-12-05 | 2011-07-05 | Epcos Ag | PTC-resistor |
| WO2015124225A1 (de) * | 2014-02-24 | 2015-08-27 | Siemens Aktiengesellschaft | Thermoelektrischer hochleistungsgenerator und verfahren zu dessen herstellung |
| US9321689B2 (en) | 2008-08-07 | 2016-04-26 | Epcos Ag | Molded object, heating device and method for producing a molded object |
| US9363851B2 (en) | 2008-08-07 | 2016-06-07 | Epcos Ag | Heating device and method for manufacturing the heating device |
-
1988
- 1988-10-03 JP JP63250391A patent/JPH0297461A/ja active Granted
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011506238A (ja) * | 2007-12-05 | 2011-03-03 | エプコス アクチエンゲゼルシャフト | 原料および原料を調製する方法 |
| JP2011506127A (ja) * | 2007-12-05 | 2011-03-03 | エプコス アクチエンゲゼルシャフト | 射出成形されたｐｔｃセラミック |
| US7973639B2 (en) | 2007-12-05 | 2011-07-05 | Epcos Ag | PTC-resistor |
| US9034210B2 (en) | 2007-12-05 | 2015-05-19 | Epcos Ag | Feedstock and method for preparing the feedstock |
| US9321689B2 (en) | 2008-08-07 | 2016-04-26 | Epcos Ag | Molded object, heating device and method for producing a molded object |
| US9363851B2 (en) | 2008-08-07 | 2016-06-07 | Epcos Ag | Heating device and method for manufacturing the heating device |
| WO2015124225A1 (de) * | 2014-02-24 | 2015-08-27 | Siemens Aktiengesellschaft | Thermoelektrischer hochleistungsgenerator und verfahren zu dessen herstellung |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0529624B2 (enrdf_load_stackoverflow) | 1993-05-06 |
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