JPH0297461A - Production of molded body of barium titanate semiconductor ceramics - Google Patents
Production of molded body of barium titanate semiconductor ceramicsInfo
- Publication number
- JPH0297461A JPH0297461A JP63250391A JP25039188A JPH0297461A JP H0297461 A JPH0297461 A JP H0297461A JP 63250391 A JP63250391 A JP 63250391A JP 25039188 A JP25039188 A JP 25039188A JP H0297461 A JPH0297461 A JP H0297461A
- Authority
- JP
- Japan
- Prior art keywords
- parts
- pts
- weight
- molded body
- wax
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910002113 barium titanate Inorganic materials 0.000 title claims abstract description 10
- 239000004065 semiconductor Substances 0.000 title claims abstract description 7
- 239000000919 ceramic Substances 0.000 title claims description 28
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 title claims description 7
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000000843 powder Substances 0.000 claims abstract description 23
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 9
- 238000001746 injection moulding Methods 0.000 claims abstract description 7
- 239000000203 mixture Substances 0.000 claims abstract description 5
- 239000002994 raw material Substances 0.000 claims description 15
- 239000012756 surface treatment agent Substances 0.000 claims description 6
- 238000010304 firing Methods 0.000 claims description 4
- 239000001993 wax Substances 0.000 abstract description 14
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 abstract description 10
- 239000004014 plasticizer Substances 0.000 abstract description 7
- 239000002245 particle Substances 0.000 abstract description 6
- 239000004793 Polystyrene Substances 0.000 abstract description 4
- 229920002223 polystyrene Polymers 0.000 abstract description 4
- 238000002844 melting Methods 0.000 abstract description 3
- 230000008018 melting Effects 0.000 abstract description 3
- 150000001413 amino acids Chemical class 0.000 abstract description 2
- 239000012188 paraffin wax Substances 0.000 abstract description 2
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- 239000007858 starting material Substances 0.000 abstract 2
- 238000002156 mixing Methods 0.000 abstract 1
- 238000005245 sintering Methods 0.000 abstract 1
- 239000011230 binding agent Substances 0.000 description 11
- 238000000465 moulding Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 6
- -1 Polyethylene Polymers 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000004413 injection moulding compound Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000004200 microcrystalline wax Substances 0.000 description 1
- 235000019808 microcrystalline wax Nutrition 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001490 poly(butyl methacrylate) polymer Polymers 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229910001404 rare earth metal oxide Inorganic materials 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
- H01C7/022—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient mainly consisting of non-metallic substances
- H01C7/023—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient mainly consisting of non-metallic substances containing oxides or oxidic compounds, e.g. ferrites
- H01C7/025—Perovskites, e.g. titanates
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Thermistors And Varistors (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、チタン酸バリウム系半五体セラミックス成形
体の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for manufacturing a barium titanate semi-pentate ceramic molded body.
従来技術
いわゆる原子価制御の原理によってｙ、ｏ、等の希土類
金属酸化物を添加して半導体化したチタン酸バリウム（
ＢａＴｉ０３）系セラミックスはＰＴＣ（Ｐ。Prior Art Barium titanate (which has been made into a semiconductor by adding rare earth metal oxides such as y and o based on the so-called valence control principle)
BaTi03) based ceramics are PTC (P.
５ｉｔｉｖｅ Ｔｅｍｐｅｒａｔｕｒｅ Ｃｏｅｆｆｉ
ｃｉｅｎｔ）セラミックスとも称され、その特性を活か
して、電気回路の過熱防止、電子回路の温度補償、ポテ
ンショメーターの無接点リレー、定温発熱体素子、モー
ター起動素子、カラーＴＶの自動消磁素子、温度検出、
その他の機器に広く利用されることが知られている。5tive TemperatureCoeffi
Also known as ceramics, its properties can be used to prevent overheating in electrical circuits, compensate for temperature in electronic circuits, contactless relays for potentiometers, constant temperature heating elements, motor starting elements, automatic degaussing elements for color TVs, temperature detection,
It is known that it is widely used in other devices.
特に、最近、これ等の実用化技術の進歩は目ざましく、
様々な形状で利用されるようになってきた。軽薄短小、
小型複雑化への要望は益々強くなってくるが、チタン酸
バリウム系セラミックス（以下、ＰＴＣセラミックスと
称する）の素子の従来の製造技術では下記の通り限界が
あった。In particular, the progress of these practical technologies has been remarkable recently.
It has come to be used in various shapes. Flirty, short and small,
Although the demand for smaller and more complex devices is becoming stronger and stronger, the conventional manufacturing technology for elements of barium titanate ceramics (hereinafter referred to as PTC ceramics) has the following limitations.
即ち、比較的形状の大きなものについては、プレス成形
で成形され、物によっては古来から継承される伝統的な
鋳込成形等が実施される。また、フィルムシートを用い
たドグダーブレード法では薄い基板の成形が可能である
。更に、パイプやノ＼ニカムといった形状のものは、押
出成形が適用される。しかし、このような方法では、次
のようなものの成形は不可能であった。That is, objects with relatively large shapes are formed by press molding, and depending on the object, traditional casting molding inherited from ancient times is performed. Furthermore, the dogder blade method using a film sheet allows the formation of thin substrates. Furthermore, extrusion molding is applied to shapes such as pipes and nicums. However, with this method, it was impossible to mold the following items.
ａ、複雑な形状あるいは加工工程を必要とするもの。a. Items that require complex shapes or processing steps.
ｂ、製品各部の最大肉厚が５１以下のもの。b. The maximum wall thickness of each part of the product is 51 mm or less.
Ｃ１製品各部の最小肉厚が１ｍｍ以下のもの。C1 The minimum wall thickness of each part of the product is 1 mm or less.
ｄ、製品各部にφＱ、５鰭以下の貫通穴を有するもの。d. Products with through holes of φQ, 5 fins or less in each part.
ｅ、製品重量が１ｇ以下のもの。e.Product weight is 1g or less.
ｆ、高密度な製品が要求されるもの。f. Those that require high-density products.
ｇ、高度な寸法精度が製品に要求されるもの。g. Products that require a high degree of dimensional accuracy.
ｈ、数量、ロフトの大きいもの。h, quantity, large loft.
ｉ、粉末の平均粒径が０．５ μｌ以下のもの。i. Powder with an average particle size of 0.5 μl or less.
ｊ、粉末価格の高いもの。j. Highly priced powder.
発明の解決しようとする課題
本発明は、このようなＰＣＴセラミックスの成形におい
て、前記ａ −ｊのように、小型で複雑な物品をも精度
良く、容易に製造できる方法を提供することを課題とす
る。Problems to be Solved by the Invention It is an object of the present invention to provide a method for easily manufacturing small and complex articles, such as those shown in a-j, with high accuracy in the molding of PCT ceramics. do.
課題を解決するための手段
本発明は、ＰＣＴセラミックスを射出成形で成形可能と
することによって、上記課題を解決した。Means for Solving the Problems The present invention has solved the above problems by making PCT ceramics moldable by injection molding.
即ち、本発明では、チタン酸バリウム系半導体の原料粉
末１００重量部に、ワックス類１０〜３０重量部、熱可
塑性樹脂２〜２５重量部、及び粉末表面処理剤２〜５重
量部を添加混合した配合物を射出成形し、焼成すること
を特徴とする。That is, in the present invention, 10 to 30 parts by weight of waxes, 2 to 25 parts by weight of thermoplastic resin, and 2 to 5 parts by weight of a powder surface treatment agent were added and mixed to 100 parts by weight of barium titanate-based semiconductor raw material powder. The formulation is characterized by injection molding and firing.
射出成形では、ＰＴＣセラミックス原料粉末に添加する
バインダーの選定が最大の要点となる。In injection molding, the most important point is the selection of the binder to be added to the PTC ceramic raw material powder.
ＰＴＣセラミックス原料粉末に流動性を与え、成形を可
能にするのがバインダー類の役割であるが、その後の焼
成工程ではこれが妨げとなる。従って、バインダーに要
求される特性としては、少量の添加で良好な流動性が得
られるもの、ＰＴＣセラミックス原料粉末との親和性が
良いこと、焼成時の脱バインダー性が良いことなどが選
択の要点となる。逆に、ＰＴＣセラミックス原料粉末側
からすれば、バインダー量を減らすためには、例えば平
均粒子径（１μｍ前後）、粒度分布（ブロード）、比面
積（１ｍ”７ｇ＞ 、粒子形状（球状）のような粉体が
理想となる。バインダーとして添加する有機材料はそれ
ぞれ次の役割を有している。The role of binders is to provide fluidity to the PTC ceramic raw material powder and enable it to be molded, but this hinders the subsequent firing process. Therefore, the key characteristics required for a binder when selecting a binder include the ability to obtain good fluidity with a small amount of addition, good affinity with the PTC ceramic raw material powder, and good debinding properties during firing. becomes. On the other hand, from the PTC ceramic raw material powder side, in order to reduce the amount of binder, it is necessary to change the average particle diameter (around 1 μm), particle size distribution (broad), specific area (1 m"7g>, particle shape (spherical), etc.) Ideally, the organic material added as a binder has the following role.
・ＰＴＣセラミックス原料粉末に加熱流動性をそして成
形体に保形性を与える結合剤
・離型性とＰＴＣセラミックス原料粉末の粒子の間の滑
りを良好にする滑剤
・レオロジー性の付与と可塑性、柔軟性を与える可塑剤
・ＰＴＣセラミックス原料粉末の表面活性化させ結合剤
との親和性を高める粉末表面処理剤の以上である。・Binding agent that gives heat fluidity to the PTC ceramic raw material powder and shape retention to the molded body ・Lubricant that improves mold releasability and slippage between particles of the PTC ceramic raw material powder ・Provides rheology, plasticity, and flexibility The above describes a plasticizer that imparts properties and a powder surface treatment agent that activates the surface of PTC ceramic raw material powder and increases its affinity with the binder.
ＰＴＣセラミックス原料粉末１００重量部に対する有機
材料の添加量は次のようなものが好ましい。The amount of organic material added to 100 parts by weight of PTC ceramic raw material powder is preferably as follows.
熱可塑性樹脂（有機結合剤） 、２〜２５重量部アクリ
ル （０〜１０重量部）ポリエチ
レン （０〜５重量部）ポリスチレン
（０〜５重量部）エチレン酢酸ビニル共
重合体 （０〜５重量部）ワックス類 （滑剤）
１０〜３０重量部可塑剤（ジブチルフタレート
）０〜５重量部置部）末表面処理剤 ２〜
５重量部本発明において、ワックス類の添加量が、ＰＴ
Ｃセラミックス原料粉末に対して１０重量％より少なく
なると、ワックス類より熱分解性の悪い熱可塑性樹脂を
多（必要とし、成形体の脱脂が国難となる。また、ワッ
クス類が３０重量％を越えると、ワックス類よりバイン
ダー力の良好な熱可塑性樹脂の使用量が少な（なるため
、成形体の強度が低下するので好ましくない。Thermoplastic resin (organic binder), 2 to 25 parts by weight Acrylic (0 to 10 parts by weight) Polyethylene (0 to 5 parts by weight) Polystyrene
(0 to 5 parts by weight) Ethylene vinyl acetate copolymer (0 to 5 parts by weight) Waxes (Lubricant)
10-30 parts by weight Plasticizer (dibutyl phthalate) 0-5 parts by weight) Terminal surface treatment agent 2-
5 parts by weight In the present invention, the amount of waxes added is 5 parts by weight.
C If it is less than 10% by weight based on the ceramic raw material powder, it will require a large amount of thermoplastic resin, which has poor thermal decomposition properties than waxes, and degreasing the molded product will become a national problem.Also, if the wax content exceeds 30% by weight In this case, the amount of thermoplastic resin that has better binder power than waxes is used (this is not preferable because the strength of the molded product decreases).
ワックスとしては、合成ワックス系のもので、融点が６
０〜２００℃の範囲のものを用いるのが好ましい。融点
が６０℃未満では成形加工中ワックスの一部が蒸発し、
組成変化を起こす可能性があり、また２００ ℃を越え
ると成形加工が困難となる。The wax is a synthetic wax type with a melting point of 6.
It is preferable to use a temperature range of 0 to 200°C. If the melting point is less than 60°C, part of the wax will evaporate during the molding process,
There is a possibility of compositional changes, and if the temperature exceeds 200°C, molding becomes difficult.
最に使用されるワックス類としては、パラフィンワック
ス、マイクロクリスタルワックス、変形ワックス等が挙
げられる。The most commonly used waxes include paraffin wax, microcrystalline wax, and modified wax.
また、熱可塑性樹脂としては、アクリル、ポリスチレン
、ポリエチレン、エチレン酢酸ビニール共重合体、ポリ
プロピレン、ポリブチルメタクリレート、ポリエチレン
オキサイド等が使用される。Further, as the thermoplastic resin, acrylic, polystyrene, polyethylene, ethylene vinyl acetate copolymer, polypropylene, polybutyl methacrylate, polyethylene oxide, etc. are used.
これらは一種のみ使用されてもよいが、数種を併用する
のが好ましい。熱可塑性樹脂は、ＰＴＣセラミックス原
料粉末に対して２〜２５重量％の範囲で添加するが、２
５重量％を越えると樹脂量が多くなり、成形体の密度が
低下するため好ましくなく、また、２重量％未満となる
と、成形体の強度が十分に保てない。Although only one type of these may be used, it is preferable to use several types in combination. The thermoplastic resin is added in an amount of 2 to 25% by weight based on the PTC ceramic raw material powder.
If it exceeds 5% by weight, the amount of resin increases and the density of the molded product decreases, which is undesirable. If it exceeds 2% by weight, the strength of the molded product cannot be maintained sufficiently.
わ）末表面処理剤としては、アミノ酸類などが使用され
るが、この添加量は、ＰＴＣセラミックス原料粉末に対
して２重量％に満たないと結合剤との親和性が劣り、ま
た５重量％を越えると焼結体密度が低下するため好まし
くなくなる。W) Amino acids and the like are used as the final surface treatment agent, but if the amount added is less than 2% by weight based on the PTC ceramic raw material powder, the affinity with the binder will be poor; Exceeding this is not preferable because the density of the sintered body decreases.
なお、可塑剤は、必要に応じて使用されるが、−ｉにプ
ラスチックの加工に使用されているがいずれも使用でき
るが、ジブチルフタレート、ジブチルフタレート、ジオ
クチルフタレート等の化合物の中から選択して使用する
のが好ましい。可塑剤の添加量が、ＰＴＣセラミックス
原料粉末に対して５重量％を越えると成形体の強度が低
下するので好ましくない。The plasticizer may be used as needed, but any of the plasticizers used in -i for processing plastics can be used, but plasticizers should be selected from compounds such as dibutyl phthalate, dibutyl phthalate, and dioctyl phthalate. It is preferable to use If the amount of plasticizer added exceeds 5% by weight based on the PTC ceramic raw material powder, the strength of the molded product will decrease, which is not preferable.
次に、実施例に従って、本発明を更に詳しく説明する。Next, the present invention will be explained in more detail according to examples.
実施例において部又は％とあるのは特に断らない限り重
量部又は重量％を示す。In the examples, parts or % indicate parts by weight or % by weight unless otherwise specified.
実施例Ｉ
ＰＴＣセラミックス原料粉末１００部に対し、ワックス
２９部、アクリル７．７部、ポリスチレン３゜１部、ポ
リエチレン３，１部、エチレン酢酸ビニル共重合体１．
５部、ジブチルフタレート４．６部、粉末表面処理剤４
．６部を加え、これを加圧ニーダにて１００〜２００℃
の温度で２〜５時間混練する。Example I To 100 parts of PTC ceramic raw material powder, 29 parts of wax, 7.7 parts of acrylic, 1 part of polystyrene 3.1 parts, 3.1 parts of polyethylene, 1.
5 parts, dibutyl phthalate 4.6 parts, powder surface treatment agent 4
．． Add 6 parts and heat this in a pressure kneader at 100-200℃
Knead for 2 to 5 hours at a temperature of .
そして、この混練物を粉砕し、射出成形用コンパウンド
を作成する。次に、これを射出成形機に投入し、成形温
度１００〜２００℃、成形圧力５００〜１００１００Ｏ
／ａｎ２の条件にて、φ０．２ｍｍの貫通穴を有する外
径φ２．４ｍｍ、長さ１３ｍの成形体に成形し、この成
形体を４５０℃×２時間で脱脂し、１３２０℃で１時間
焼成してＰＴＣセラミックスとした。製品は、精度ある
品質のよいセラミックス成形体となった。This kneaded material is then pulverized to create an injection molding compound. Next, this was put into an injection molding machine, and the molding temperature was 100 to 200℃, and the molding pressure was 500 to 100,100O.
/an2 conditions, molded into a molded body with an outer diameter of 2.4 mm and a length of 13 m with a through hole of 0.2 mm, degreased at 450°C for 2 hours, and baked at 1320°C for 1 hour. and made it into PTC ceramics. The product is a ceramic molded body with high precision and high quality.
実施例２
実施例１と同様の方法で、射出成形してＰＴＣセラミッ
クス成形体を製造し、その密度を成形で得られＰＴＣセ
ラミックス成形体の密度を測定した。これを通常のプレ
ス成形で得たＰＴＣセラミックス成形体の密度と比較し
て次表に示す。Example 2 A PTC ceramic molded body was produced by injection molding in the same manner as in Example 1, and the density of the PTC ceramic molded body obtained by molding was measured. This is compared with the density of a PTC ceramic molded body obtained by ordinary press molding and is shown in the following table.
ミノクツ、成形体の製造が可能となり、ＰＣＴセラミッ
クスの特性を有する小型で複雑な製品をも、非常に高密
度で精度よく安定して製造できる。It is now possible to manufacture compact molded bodies, and even small and complex products with the characteristics of PCT ceramics can be manufactured stably with extremely high density and precision.
Claims (1)
、ワックス類１０〜３０重量部、熱可塑性樹脂２〜２５
重量部、及び粉末表面処理剤２〜５重量部を添加混合し
た配合物を射出成形し、焼成することを特徴とするチタ
ン酸バリウム系半導体セラミックス成形体の製造方法。100 parts by weight of barium titanate semiconductor raw material powder, 10 to 30 parts by weight of wax, and 2 to 25 parts by weight of thermoplastic resin.
1. A method for producing a barium titanate-based semiconductor ceramic molded body, which comprises injection molding a mixture containing 2 to 5 parts by weight of a powder surface treatment agent and firing the mixture.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63250391A JPH0297461A (en) | 1988-10-03 | 1988-10-03 | Production of molded body of barium titanate semiconductor ceramics |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63250391A JPH0297461A (en) | 1988-10-03 | 1988-10-03 | Production of molded body of barium titanate semiconductor ceramics |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0297461A true JPH0297461A (en) | 1990-04-10 |
| JPH0529624B2 JPH0529624B2 (en) | 1993-05-06 |
Family
ID=17207217
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63250391A Granted JPH0297461A (en) | 1988-10-03 | 1988-10-03 | Production of molded body of barium titanate semiconductor ceramics |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0297461A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011506238A (en) * | 2007-12-05 | 2011-03-03 | エプコス アクチエンゲゼルシャフト | Raw material and method for preparing the raw material |
| JP2011506127A (en) * | 2007-12-05 | 2011-03-03 | エプコス アクチエンゲゼルシャフト | Injection molded PTC ceramic |
| US7973639B2 (en) | 2007-12-05 | 2011-07-05 | Epcos Ag | PTC-resistor |
| WO2015124225A1 (en) * | 2014-02-24 | 2015-08-27 | Siemens Aktiengesellschaft | Thermoelectric high-power generator and method for the production thereof |
| US9321689B2 (en) | 2008-08-07 | 2016-04-26 | Epcos Ag | Molded object, heating device and method for producing a molded object |
| US9363851B2 (en) | 2008-08-07 | 2016-06-07 | Epcos Ag | Heating device and method for manufacturing the heating device |
-
1988
- 1988-10-03 JP JP63250391A patent/JPH0297461A/en active Granted
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011506238A (en) * | 2007-12-05 | 2011-03-03 | エプコス アクチエンゲゼルシャフト | Raw material and method for preparing the raw material |
| JP2011506127A (en) * | 2007-12-05 | 2011-03-03 | エプコス アクチエンゲゼルシャフト | Injection molded PTC ceramic |
| US7973639B2 (en) | 2007-12-05 | 2011-07-05 | Epcos Ag | PTC-resistor |
| US9034210B2 (en) | 2007-12-05 | 2015-05-19 | Epcos Ag | Feedstock and method for preparing the feedstock |
| US9321689B2 (en) | 2008-08-07 | 2016-04-26 | Epcos Ag | Molded object, heating device and method for producing a molded object |
| US9363851B2 (en) | 2008-08-07 | 2016-06-07 | Epcos Ag | Heating device and method for manufacturing the heating device |
| WO2015124225A1 (en) * | 2014-02-24 | 2015-08-27 | Siemens Aktiengesellschaft | Thermoelectric high-power generator and method for the production thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0529624B2 (en) | 1993-05-06 |
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