JPH029461U - - Google Patents

Info

Publication number
JPH029461U
JPH029461U JP8875488U JP8875488U JPH029461U JP H029461 U JPH029461 U JP H029461U JP 8875488 U JP8875488 U JP 8875488U JP 8875488 U JP8875488 U JP 8875488U JP H029461 U JPH029461 U JP H029461U
Authority
JP
Japan
Prior art keywords
bonding surface
semiconductor laser
substrate
heat sink
laser device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8875488U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8875488U priority Critical patent/JPH029461U/ja
Publication of JPH029461U publication Critical patent/JPH029461U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】
第１図は本考案に係る半導体レーザ装置用パツ
ケージの気密ガラス端子の一実施例を示すＸ―Ｘ
′断面図、第２図は平面図、第３図はＹ―Ｙ′断
面図、第４図は従来の気密ガラス端子の構造を示
す断面図である。 １０……基板、１２……放熱体、１４……接合
面、１６……半導体レーザ素子、１８……凹部、
２０……モニター素子、２２……リードピン。

Claims (1)

  1. 【実用新案登録請求の範囲】 半導体レーザ素子が接合される接合面を有する
    放熱体が基板上に立設され、半導体レーザ素子か
    らの光を受光するモニター素子の接合面が基板上
    に形成される半導体レーザ装置用パツケージにお
    いて、 前記放熱体の接合面下部に、前記基板上の接合
    面に接合されるモニター素子の放熱体側の端部を
    収容する凹部を形成したことを特徴とする半導体
    レーザ装置用パツケージ。
JP8875488U 1988-07-04 1988-07-04 Pending JPH029461U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8875488U JPH029461U (ja) 1988-07-04 1988-07-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8875488U JPH029461U (ja) 1988-07-04 1988-07-04

Publications (1)

Publication Number Publication Date
JPH029461U true JPH029461U (ja) 1990-01-22

Family

ID=31313314

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8875488U Pending JPH029461U (ja) 1988-07-04 1988-07-04

Country Status (1)

Country Link
JP (1) JPH029461U (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04124719U (ja) * 1991-04-30 1992-11-13 東京特殊電線株式会社 細心同軸ケーブル
WO2005048421A1 (ja) * 2003-11-14 2005-05-26 Sanyo Electric Co., Ltd 半導体レーザ装置
JP2007142112A (ja) * 2005-11-17 2007-06-07 Shinko Electric Ind Co Ltd 光半導体素子用ステムの製造方法
JP2011146744A (ja) * 2011-04-14 2011-07-28 Shinko Electric Ind Co Ltd 光半導体素子用ステム

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5925292A (ja) * 1982-07-30 1984-02-09 Fujitsu Ltd 半導体レ−ザ装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5925292A (ja) * 1982-07-30 1984-02-09 Fujitsu Ltd 半導体レ−ザ装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04124719U (ja) * 1991-04-30 1992-11-13 東京特殊電線株式会社 細心同軸ケーブル
WO2005048421A1 (ja) * 2003-11-14 2005-05-26 Sanyo Electric Co., Ltd 半導体レーザ装置
JPWO2005048421A1 (ja) * 2003-11-14 2007-05-31 三洋電機株式会社 半導体レーザ装置
JP4549298B2 (ja) * 2003-11-14 2010-09-22 三洋電機株式会社 半導体レーザ装置
JP2007142112A (ja) * 2005-11-17 2007-06-07 Shinko Electric Ind Co Ltd 光半導体素子用ステムの製造方法
JP2011146744A (ja) * 2011-04-14 2011-07-28 Shinko Electric Ind Co Ltd 光半導体素子用ステム

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