JPH0282032U - - Google Patents
Info
- Publication number
- JPH0282032U JPH0282032U JP16288688U JP16288688U JPH0282032U JP H0282032 U JPH0282032 U JP H0282032U JP 16288688 U JP16288688 U JP 16288688U JP 16288688 U JP16288688 U JP 16288688U JP H0282032 U JPH0282032 U JP H0282032U
- Authority
- JP
- Japan
- Prior art keywords
- load lock
- boat
- wafers
- preliminary chamber
- lock chambers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 235000012431 wafers Nutrition 0.000 claims 4
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16288688U JPH0517879Y2 (enrdf_load_stackoverflow) | 1988-12-14 | 1988-12-14 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16288688U JPH0517879Y2 (enrdf_load_stackoverflow) | 1988-12-14 | 1988-12-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0282032U true JPH0282032U (enrdf_load_stackoverflow) | 1990-06-25 |
JPH0517879Y2 JPH0517879Y2 (enrdf_load_stackoverflow) | 1993-05-13 |
Family
ID=31447121
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16288688U Expired - Lifetime JPH0517879Y2 (enrdf_load_stackoverflow) | 1988-12-14 | 1988-12-14 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0517879Y2 (enrdf_load_stackoverflow) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04137613A (ja) * | 1990-09-28 | 1992-05-12 | Handotai Process Kenkyusho:Kk | 半導体装置の製造装置 |
JPH04188721A (ja) * | 1990-11-22 | 1992-07-07 | Tokyo Electron Ltd | 縦型熱処理装置 |
JPH05198659A (ja) * | 1992-01-22 | 1993-08-06 | Tokyo Ohka Kogyo Co Ltd | プラズマ処理装置 |
JPH0883831A (ja) * | 1994-09-13 | 1996-03-26 | Nec Corp | 半導体装置の製造装置 |
WO1996024949A1 (fr) * | 1995-02-10 | 1996-08-15 | Tokyo Electron Limited | Procede de traitement thermique et appareil |
JPH1092906A (ja) * | 1996-09-05 | 1998-04-10 | Samsung Electron Co Ltd | 半導体ウェーハ熱処理装置 |
-
1988
- 1988-12-14 JP JP16288688U patent/JPH0517879Y2/ja not_active Expired - Lifetime
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04137613A (ja) * | 1990-09-28 | 1992-05-12 | Handotai Process Kenkyusho:Kk | 半導体装置の製造装置 |
JPH04188721A (ja) * | 1990-11-22 | 1992-07-07 | Tokyo Electron Ltd | 縦型熱処理装置 |
JPH05198659A (ja) * | 1992-01-22 | 1993-08-06 | Tokyo Ohka Kogyo Co Ltd | プラズマ処理装置 |
JPH0883831A (ja) * | 1994-09-13 | 1996-03-26 | Nec Corp | 半導体装置の製造装置 |
WO1996024949A1 (fr) * | 1995-02-10 | 1996-08-15 | Tokyo Electron Limited | Procede de traitement thermique et appareil |
US6322631B1 (en) | 1995-02-10 | 2001-11-27 | Tokyo Electron Limited | Heat treatment method and its apparatus |
JPH1092906A (ja) * | 1996-09-05 | 1998-04-10 | Samsung Electron Co Ltd | 半導体ウェーハ熱処理装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH0517879Y2 (enrdf_load_stackoverflow) | 1993-05-13 |
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