JPH0270445U - - Google Patents
Info
- Publication number
- JPH0270445U JPH0270445U JP15020488U JP15020488U JPH0270445U JP H0270445 U JPH0270445 U JP H0270445U JP 15020488 U JP15020488 U JP 15020488U JP 15020488 U JP15020488 U JP 15020488U JP H0270445 U JPH0270445 U JP H0270445U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- type semiconductor
- ceramic package
- package type
- cap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000005219 brazing Methods 0.000 claims 1
- 239000002994 raw material Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案のセラミツクパツケージ型半導
体装置の一実施例の斜視図、第２図は従来のセラ
ミツクパツケージ型半導体装置の部分断面図、第
３図は従来のセラミツクパツケージ型半導体装置
を説明するための、部分断面図、第４図は本考案
の他の実施例のセラミツクパツケージ型半導体装
置の部分斜視図である。
１……ベース、２……キヤビテイー、３……凸
起部、４……キヤツプ、５……リード、６……ロ
ー材、７……開口部、８……位置決め治具、９…
…キヤツプ位置決め部、１０……ベース位置決め
部。
FIG. 1 is a perspective view of an embodiment of the ceramic package type semiconductor device of the present invention, FIG. 2 is a partial sectional view of a conventional ceramic package type semiconductor device, and FIG. 3 illustrates a conventional ceramic package type semiconductor device. FIG. 4 is a partial perspective view of a ceramic package type semiconductor device according to another embodiment of the present invention. DESCRIPTION OF SYMBOLS 1...Base, 2...Cavity, 3...Protrusion, 4...Cap, 5...Lead, 6...Raw material, 7...Opening, 8...Positioning jig, 9...
...Cap positioning section, 10...Base positioning section.
Claims (1)
接合面間をロー付による気密封止をしてなるセラ
ミツクパツケージ型半導体装置に於て、前記キヤ
ツプの各々四辺に対応した位置合わせの突起部を
前記ベースに形成したことを特徴とするセラミツ
クパツケージ型半導体装置。 In a ceramic package type semiconductor device in which a base and a cap are joined together and the joint surfaces of the two are hermetically sealed by brazing, positioning protrusions corresponding to each of the four sides of the cap are attached to the base. A ceramic package type semiconductor device characterized in that it is formed in a ceramic package type semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15020488U JPH0270445U (en) | 1988-11-17 | 1988-11-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15020488U JPH0270445U (en) | 1988-11-17 | 1988-11-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0270445U true JPH0270445U (en) | 1990-05-29 |
Family
ID=31423135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15020488U Pending JPH0270445U (en) | 1988-11-17 | 1988-11-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0270445U (en) |
-
1988
- 1988-11-17 JP JP15020488U patent/JPH0270445U/ja active Pending