JPS6151745U - - Google Patents
Info
- Publication number
- JPS6151745U JPS6151745U JP13611184U JP13611184U JPS6151745U JP S6151745 U JPS6151745 U JP S6151745U JP 13611184 U JP13611184 U JP 13611184U JP 13611184 U JP13611184 U JP 13611184U JP S6151745 U JPS6151745 U JP S6151745U
- Authority
- JP
- Japan
- Prior art keywords
- base material
- ceramic base
- ceramic
- semiconductor chip
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 3
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
第１図は本考案の第１実施例を示す断面図、第
２図は本考案の他の実施例を示す断面図、第３図
は従来のセラミツクパツケージを示す断面図であ
る。
１……第１のセラミツク基材、２……半導体チ
ツプ、４……第２のセラミツク基材、６……突出
部、７……陥没部。図中同一符号は同一又は相当
部分を示す。
FIG. 1 is a sectional view showing a first embodiment of the present invention, FIG. 2 is a sectional view showing another embodiment of the present invention, and FIG. 3 is a sectional view showing a conventional ceramic package. DESCRIPTION OF SYMBOLS 1...First ceramic base material, 2...Semiconductor chip, 4...Second ceramic base material, 6...Protrusion part, 7...Recessed part. The same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
に蓋材となる第２のセラミツク基材を接着し、半
導体チツプを第１のセラミツク基材と第２のセラ
ミツク基材との間に収納するセラミツクパツケー
ジにおいて、前記第１のセラミツク基材と前記第
２のセラミツク基材との接着面側に少なくとも一
対の位置合わせ用の突出部と陥没部とを設けたこ
とを特徴とするセラミツクパツケージ。 A ceramic package in which a second ceramic base material serving as a lid material is adhered to a first ceramic base material to which a semiconductor chip is fixed, and the semiconductor chip is housed between the first ceramic base material and the second ceramic base material. A ceramic package characterized in that at least one pair of protrusions and recesses for positioning are provided on the bonding surfaces of the first ceramic base material and the second ceramic base material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13611184U JPS6151745U (en) | 1984-09-10 | 1984-09-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13611184U JPS6151745U (en) | 1984-09-10 | 1984-09-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6151745U true JPS6151745U (en) | 1986-04-07 |
Family
ID=30694584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13611184U Pending JPS6151745U (en) | 1984-09-10 | 1984-09-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6151745U (en) |
-
1984
- 1984-09-10 JP JP13611184U patent/JPS6151745U/ja active Pending