JPS6365259U - - Google Patents
Info
- Publication number
- JPS6365259U JPS6365259U JP1986160351U JP16035186U JPS6365259U JP S6365259 U JPS6365259 U JP S6365259U JP 1986160351 U JP1986160351 U JP 1986160351U JP 16035186 U JP16035186 U JP 16035186U JP S6365259 U JPS6365259 U JP S6365259U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- semiconductor laser
- chip
- crystal
- main surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000013078 crystal Substances 0.000 claims 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 1
- 229910010271 silicon carbide Inorganic materials 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
Description
第1図及び第2図は夫々本考案の第1、第2実
施例を示す断面図である。
4…半導体レーザチツプ、5…ヒートシンク。
1 and 2 are cross-sectional views showing the first and second embodiments of the present invention, respectively. 4... Semiconductor laser chip, 5... Heat sink.
Claims (1)
固着されるヒートシンクを備えた半導体レーザ装
置において、上記ヒートシンクはシリコンカーバ
イド結晶もしくはカーボン結晶からなることを特
徴とする半導体レーザ装置。 1. A semiconductor laser device comprising a semiconductor laser chip and a heat sink on which the chip is placed and fixed on one main surface, wherein the heat sink is made of silicon carbide crystal or carbon crystal.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986160351U JPS6365259U (en) | 1986-10-20 | 1986-10-20 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986160351U JPS6365259U (en) | 1986-10-20 | 1986-10-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6365259U true JPS6365259U (en) | 1988-04-30 |
Family
ID=31085653
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986160351U Pending JPS6365259U (en) | 1986-10-20 | 1986-10-20 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6365259U (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57210648A (en) * | 1981-06-19 | 1982-12-24 | Hitachi Ltd | Semiconductor device |
-
1986
- 1986-10-20 JP JP1986160351U patent/JPS6365259U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57210648A (en) * | 1981-06-19 | 1982-12-24 | Hitachi Ltd | Semiconductor device |