JPS6161831U

JPS6161831U -

Info

Publication number: JPS6161831U
Application number: JP14647584U
Authority: JP
Priority date: 1984-09-26
Filing date: 1984-09-26
Publication date: 1986-04-25

Description

[Brief explanation of the drawing]

第１〜６図は本考案の第１実施例で、第１図は
その平面図、第２図は第１図の正面図、第３図は
セラミツク棒の側面図、第４図は第３図の正面図
、第５図は他のセラミツク棒の平面図、第６図は
第５図の側面図、第７図は第５図の正面図である
。第８〜１０図は第２実施例で、第８図はその平
面図、第９図は第８図の正面図、第１０図は要部
拡大平面図である。第１１図から第１３図は従来
の半導体ウエハの支持装置であつて、第１１図は
その斜視図、第１２図は他の例の平面図、第１３
図は第１２図の−断面図である。｛１，２，３，１２，１３，１４…セラミツク
棒、５，１１…側板｝構成部材。 1 to 6 show the first embodiment of the present invention, FIG. 1 is a plan view thereof, FIG. 2 is a front view of FIG. 1, FIG. 3 is a side view of the ceramic rod, and FIG. 5 is a plan view of another ceramic rod, FIG. 6 is a side view of FIG. 5, and FIG. 7 is a front view of FIG. 5. 8 to 10 show a second embodiment, in which FIG. 8 is a plan view thereof, FIG. 9 is a front view of FIG. 8, and FIG. 10 is an enlarged plan view of the main part. 11 to 13 show a conventional semiconductor wafer support device, in which FIG. 11 is a perspective view thereof, FIG. 12 is a plan view of another example, and FIG.
The figure is a - sectional view of FIG. 12. {1, 2, 3, 12, 13, 14...Ceramic rod, 5, 11...Side plate} Components.

Claims

[Scope of utility model registration request]

A support device that supports the semiconductor wafer when the semiconductor wafer is placed in a high-temperature furnace for diffusion processing, and each component of the support device is made of ceramic such as alumina, silicon carbide, or silicon nitride. Features: Semiconductor wafer support device.